JPH01127239U - - Google Patents
Info
- Publication number
- JPH01127239U JPH01127239U JP2255388U JP2255388U JPH01127239U JP H01127239 U JPH01127239 U JP H01127239U JP 2255388 U JP2255388 U JP 2255388U JP 2255388 U JP2255388 U JP 2255388U JP H01127239 U JPH01127239 U JP H01127239U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- opening
- semiconductor
- wiring conductor
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2255388U JPH01127239U (es) | 1988-02-22 | 1988-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2255388U JPH01127239U (es) | 1988-02-22 | 1988-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127239U true JPH01127239U (es) | 1989-08-31 |
Family
ID=31240775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2255388U Pending JPH01127239U (es) | 1988-02-22 | 1988-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127239U (es) |
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1988
- 1988-02-22 JP JP2255388U patent/JPH01127239U/ja active Pending