JPH01126380U - - Google Patents
Info
- Publication number
- JPH01126380U JPH01126380U JP1988022767U JP2276788U JPH01126380U JP H01126380 U JPH01126380 U JP H01126380U JP 1988022767 U JP1988022767 U JP 1988022767U JP 2276788 U JP2276788 U JP 2276788U JP H01126380 U JPH01126380 U JP H01126380U
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- spool
- flange
- fixed
- starting end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
Description
第１図はこの考案の半導体装置のボンデイング
ワイヤ用スプール巻線の側面図であり、第２図は
、その平面図、第３図は、この考案のもう１つの
半導体装置のボンデイングワイヤ用スプール巻線
の側面図であり、第４図は、その平面図、第５図
および第６図は、上記ボンデイングワイヤ用スプ
ール巻線をボンデイングマシンにセツトした状態
を示す概略側面図、第７図は、従来の半導体装置
のボンデイングワイヤ用スプール巻線をボンデイ
ングマシンにセツトし、ボンデイングワイヤをガ
ラス管を通して半導体装置に送給している状態を
示す概略側面図、第８図は、従来の半導体装置の
ボンデイングワイヤ用スプールの平面図である。
１……ボンデイングワイヤ、２……フランジ、
３……接地ターミナル、４……ガラス管、５……
支持台、６，６′，６″……テープ、７……接地
導電部、８……切欠き、９……支持テープ。
FIG. 1 is a side view of a spool winding for bonding wire of a semiconductor device of this invention, FIG. 2 is a plan view thereof, and FIG. 3 is a spool winding for bonding wire of another semiconductor device of this invention. FIG. 4 is a plan view thereof, FIGS. 5 and 6 are schematic side views showing the bonding wire spool winding set in a bonding machine, and FIG. 7 is a side view of the bonding wire. FIG. 8 is a schematic side view showing a state in which a spool winding for bonding wire of a conventional semiconductor device is set in a bonding machine and the bonding wire is fed to the semiconductor device through a glass tube. It is a top view of a spool for wires. 1... bonding wire, 2... flange,
3...Ground terminal, 4...Glass tube, 5...
Support stand, 6, 6', 6''...tape, 7... ground conductive part, 8... notch, 9... support tape.
Claims (1)
から引き出されたボンデイングワイヤの始端部を
、上記フランジの外側表面に間隔をおいて２個所
以上とめてなることを特徴とする半導体装置のボ
ンデイングワイヤ用スプール巻線。 ２ 上記ボンデイングワイヤの始端部を、支持テ
ープによつて浮かしてとめてなることを特徴とす
る請求項１記載の半導体装置のボンデイングワイ
ヤ用スプール巻線。[Claims for Utility Model Registration] 1. The starting end of the bonding wire pulled out from the notch provided in the flange of the spool is fixed at two or more locations spaced apart from each other on the outer surface of the flange. Spool winding for bonding wire for semiconductor devices. 2. The spool winding for a bonding wire for a semiconductor device according to claim 1, wherein the starting end of the bonding wire is suspended and fixed by a support tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988022767U JPH01126380U (en) | 1988-02-23 | 1988-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988022767U JPH01126380U (en) | 1988-02-23 | 1988-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01126380U true JPH01126380U (en) | 1989-08-29 |
Family
ID=31241173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988022767U Pending JPH01126380U (en) | 1988-02-23 | 1988-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01126380U (en) |
-
1988
- 1988-02-23 JP JP1988022767U patent/JPH01126380U/ja active Pending