JPH01125566U - - Google Patents

Info

Publication number
JPH01125566U
JPH01125566U JP2136588U JP2136588U JPH01125566U JP H01125566 U JPH01125566 U JP H01125566U JP 2136588 U JP2136588 U JP 2136588U JP 2136588 U JP2136588 U JP 2136588U JP H01125566 U JPH01125566 U JP H01125566U
Authority
JP
Japan
Prior art keywords
chip carrier
optical semiconductor
mounting
semiconductor device
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2136588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2136588U priority Critical patent/JPH01125566U/ja
Publication of JPH01125566U publication Critical patent/JPH01125566U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Optical Couplings Of Light Guides (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例によるチツプキヤ
リア型端面発光LEDの斜視図、第2図は従来の
チツプキヤリア型面発光LEDの斜視図、第3図
は従来のチツプキヤリアに端面発光LEDをマウ
ントした場合の斜視図を示す。 図において、1はチツプキヤリア本体、2はア
ノード電極、3はチツプマウント部、4はカソー
ド電極、5はLEDチツプ、6はワイヤ、7は光
ビーム、8は光フアイバを示す。なお、図中、同
一符号は同一、または相当部分を示す。
Fig. 1 is a perspective view of a chip carrier type edge-emitting LED according to an embodiment of this invention, Fig. 2 is a perspective view of a conventional chip carrier type surface-emitting LED, and Fig. 3 is a case where an edge-emitting LED is mounted on a conventional chip carrier. A perspective view of the figure is shown. In the figure, 1 is a chip carrier body, 2 is an anode electrode, 3 is a chip mount, 4 is a cathode electrode, 5 is an LED chip, 6 is a wire, 7 is a light beam, and 8 is an optical fiber. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光ダイオードなどの光半導体素子と、この光
半導体素子をマウントしかつ外部回路との接続を
図るためのメタライズ部が施されたチツプキヤリ
アとから成るチツプキヤリア型半導体装置に用い
られるチツプキヤリアにおいて、光半導体素子を
マウントするためのメタライズ部が前記チツプキ
ヤリアの任意の一辺に隣接して設けられているこ
とを特徴とする光半導体素子用チツプキヤリア。
A chip carrier used in a chip carrier type semiconductor device consisting of an optical semiconductor element such as a light emitting diode and a chip carrier with a metallized part for mounting the optical semiconductor element and connecting it to an external circuit. A chip carrier for an optical semiconductor device, characterized in that a metallized portion for mounting is provided adjacent to any one side of the chip carrier.
JP2136588U 1988-02-19 1988-02-19 Pending JPH01125566U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2136588U JPH01125566U (en) 1988-02-19 1988-02-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2136588U JPH01125566U (en) 1988-02-19 1988-02-19

Publications (1)

Publication Number Publication Date
JPH01125566U true JPH01125566U (en) 1989-08-28

Family

ID=31238543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2136588U Pending JPH01125566U (en) 1988-02-19 1988-02-19

Country Status (1)

Country Link
JP (1) JPH01125566U (en)

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