JPH01125554U - - Google Patents
Info
- Publication number
- JPH01125554U JPH01125554U JP1988020265U JP2026588U JPH01125554U JP H01125554 U JPH01125554 U JP H01125554U JP 1988020265 U JP1988020265 U JP 1988020265U JP 2026588 U JP2026588 U JP 2026588U JP H01125554 U JPH01125554 U JP H01125554U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- sealing frame
- electronic component
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988020265U JPH01125554U (US06252093-20010626-C00008.png) | 1988-02-18 | 1988-02-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988020265U JPH01125554U (US06252093-20010626-C00008.png) | 1988-02-18 | 1988-02-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01125554U true JPH01125554U (US06252093-20010626-C00008.png) | 1989-08-28 |
Family
ID=31236485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988020265U Pending JPH01125554U (US06252093-20010626-C00008.png) | 1988-02-18 | 1988-02-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01125554U (US06252093-20010626-C00008.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61247059A (ja) * | 1985-04-24 | 1986-11-04 | Mitsubishi Electric Corp | 混成集積回路装置の製造方法 |
JPS6239034A (ja) * | 1985-08-14 | 1987-02-20 | Matsushita Electric Works Ltd | 半導体チツプキヤリアの製造方法 |
-
1988
- 1988-02-18 JP JP1988020265U patent/JPH01125554U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61247059A (ja) * | 1985-04-24 | 1986-11-04 | Mitsubishi Electric Corp | 混成集積回路装置の製造方法 |
JPS6239034A (ja) * | 1985-08-14 | 1987-02-20 | Matsushita Electric Works Ltd | 半導体チツプキヤリアの製造方法 |