JPH01123400U - - Google Patents
Info
- Publication number
- JPH01123400U JPH01123400U JP1988018495U JP1849588U JPH01123400U JP H01123400 U JPH01123400 U JP H01123400U JP 1988018495 U JP1988018495 U JP 1988018495U JP 1849588 U JP1849588 U JP 1849588U JP H01123400 U JPH01123400 U JP H01123400U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- circuit components
- chip
- suction head
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011159 matrix material Substances 0.000 claims 1
- 239000003463 adsorbent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988018495U JPH0810234Y2 (ja) | 1988-02-15 | 1988-02-15 | チップ状回路部品マウント装置 |
KR1019890000721A KR920002278B1 (ko) | 1988-02-15 | 1989-01-24 | 리드선이 없는 회로부품의 장착장치 |
US07/307,899 US4914809A (en) | 1988-02-15 | 1989-02-07 | Chip mounting apparatus |
DE68924660T DE68924660T2 (de) | 1988-02-15 | 1989-02-08 | Vorrichtung zum Montieren von Chips. |
EP89102168A EP0329004B1 (en) | 1988-02-15 | 1989-02-08 | Chip mounting apparatus |
HK105896A HK105896A (en) | 1988-02-15 | 1996-06-19 | Chip mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988018495U JPH0810234Y2 (ja) | 1988-02-15 | 1988-02-15 | チップ状回路部品マウント装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01123400U true JPH01123400U (US06534493-20030318-C00184.png) | 1989-08-22 |
JPH0810234Y2 JPH0810234Y2 (ja) | 1996-03-27 |
Family
ID=31233195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988018495U Expired - Lifetime JPH0810234Y2 (ja) | 1988-02-15 | 1988-02-15 | チップ状回路部品マウント装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0810234Y2 (US06534493-20030318-C00184.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0377497U (US06534493-20030318-C00184.png) * | 1989-11-28 | 1991-08-05 | ||
JP2003163180A (ja) * | 2001-11-26 | 2003-06-06 | Apic Yamada Corp | ワーク搬送装置及びダイシング装置 |
JPWO2016103791A1 (ja) * | 2014-12-26 | 2017-08-31 | シャープ株式会社 | 半導体素子パッケージのためのキャップ装着方法及びキャップ装着装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55164493A (en) * | 1979-06-09 | 1980-12-22 | Pioneer Electronic Corp | Vacuum head for moving electronic part |
JPS565332U (US06534493-20030318-C00184.png) * | 1979-06-25 | 1981-01-17 |
-
1988
- 1988-02-15 JP JP1988018495U patent/JPH0810234Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55164493A (en) * | 1979-06-09 | 1980-12-22 | Pioneer Electronic Corp | Vacuum head for moving electronic part |
JPS565332U (US06534493-20030318-C00184.png) * | 1979-06-25 | 1981-01-17 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0377497U (US06534493-20030318-C00184.png) * | 1989-11-28 | 1991-08-05 | ||
JP2003163180A (ja) * | 2001-11-26 | 2003-06-06 | Apic Yamada Corp | ワーク搬送装置及びダイシング装置 |
JPWO2016103791A1 (ja) * | 2014-12-26 | 2017-08-31 | シャープ株式会社 | 半導体素子パッケージのためのキャップ装着方法及びキャップ装着装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0810234Y2 (ja) | 1996-03-27 |