JPH01123390U - - Google Patents
Info
- Publication number
- JPH01123390U JPH01123390U JP1888888U JP1888888U JPH01123390U JP H01123390 U JPH01123390 U JP H01123390U JP 1888888 U JP1888888 U JP 1888888U JP 1888888 U JP1888888 U JP 1888888U JP H01123390 U JPH01123390 U JP H01123390U
- Authority
- JP
- Japan
- Prior art keywords
- back surfaces
- electronic components
- module mounting
- wire arrangement
- sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009434 installation Methods 0.000 claims 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1888888U JPH0547497Y2 (de) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1888888U JPH0547497Y2 (de) | 1988-02-16 | 1988-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01123390U true JPH01123390U (de) | 1989-08-22 |
JPH0547497Y2 JPH0547497Y2 (de) | 1993-12-14 |
Family
ID=31522030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1888888U Expired - Lifetime JPH0547497Y2 (de) | 1988-02-16 | 1988-02-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0547497Y2 (de) |
-
1988
- 1988-02-16 JP JP1888888U patent/JPH0547497Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0547497Y2 (de) | 1993-12-14 |