JPH01123380U - - Google Patents

Info

Publication number
JPH01123380U
JPH01123380U JP1889088U JP1889088U JPH01123380U JP H01123380 U JPH01123380 U JP H01123380U JP 1889088 U JP1889088 U JP 1889088U JP 1889088 U JP1889088 U JP 1889088U JP H01123380 U JPH01123380 U JP H01123380U
Authority
JP
Japan
Prior art keywords
semiconductor element
substrate
pads
leads
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1889088U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1889088U priority Critical patent/JPH01123380U/ja
Publication of JPH01123380U publication Critical patent/JPH01123380U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1889088U 1988-02-16 1988-02-16 Pending JPH01123380U (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1889088U JPH01123380U (it) 1988-02-16 1988-02-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1889088U JPH01123380U (it) 1988-02-16 1988-02-16

Publications (1)

Publication Number Publication Date
JPH01123380U true JPH01123380U (it) 1989-08-22

Family

ID=31233929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1889088U Pending JPH01123380U (it) 1988-02-16 1988-02-16

Country Status (1)

Country Link
JP (1) JPH01123380U (it)

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