JPH01123373U - - Google Patents
Info
- Publication number
- JPH01123373U JPH01123373U JP1817488U JP1817488U JPH01123373U JP H01123373 U JPH01123373 U JP H01123373U JP 1817488 U JP1817488 U JP 1817488U JP 1817488 U JP1817488 U JP 1817488U JP H01123373 U JPH01123373 U JP H01123373U
- Authority
- JP
- Japan
- Prior art keywords
- back side
- reinforcing plate
- printed circuit
- circuit board
- circuit film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1817488U JPH01123373U (tr) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1817488U JPH01123373U (tr) | 1988-02-16 | 1988-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123373U true JPH01123373U (tr) | 1989-08-22 |
Family
ID=31232580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1817488U Pending JPH01123373U (tr) | 1988-02-16 | 1988-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123373U (tr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020174067A (ja) * | 2019-04-08 | 2020-10-22 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
-
1988
- 1988-02-16 JP JP1817488U patent/JPH01123373U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020174067A (ja) * | 2019-04-08 | 2020-10-22 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |