JPH01123360U - - Google Patents
Info
- Publication number
- JPH01123360U JPH01123360U JP1988018097U JP1809788U JPH01123360U JP H01123360 U JPH01123360 U JP H01123360U JP 1988018097 U JP1988018097 U JP 1988018097U JP 1809788 U JP1809788 U JP 1809788U JP H01123360 U JPH01123360 U JP H01123360U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- lead electrode
- fixed
- lead
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988018097U JPH01123360U (enrdf_load_stackoverflow) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988018097U JPH01123360U (enrdf_load_stackoverflow) | 1988-02-16 | 1988-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123360U true JPH01123360U (enrdf_load_stackoverflow) | 1989-08-22 |
Family
ID=31232432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988018097U Pending JPH01123360U (enrdf_load_stackoverflow) | 1988-02-16 | 1988-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123360U (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5177173A (en) * | 1974-12-27 | 1976-07-03 | Tokyo Shibaura Electric Co | Handotaisochino tanshikozo |
| JPS5524465A (en) * | 1978-08-11 | 1980-02-21 | Hitachi Ltd | Rectifier |
-
1988
- 1988-02-16 JP JP1988018097U patent/JPH01123360U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5177173A (en) * | 1974-12-27 | 1976-07-03 | Tokyo Shibaura Electric Co | Handotaisochino tanshikozo |
| JPS5524465A (en) * | 1978-08-11 | 1980-02-21 | Hitachi Ltd | Rectifier |