JPH01123352U - - Google Patents
Info
- Publication number
- JPH01123352U JPH01123352U JP1887388U JP1887388U JPH01123352U JP H01123352 U JPH01123352 U JP H01123352U JP 1887388 U JP1887388 U JP 1887388U JP 1887388 U JP1887388 U JP 1887388U JP H01123352 U JPH01123352 U JP H01123352U
- Authority
- JP
- Japan
- Prior art keywords
- insulating spacer
- cooling device
- heat radiator
- semiconductor element
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1887388U JPH01123352U (US20050192411A1-20050901-C00001.png) | 1988-02-15 | 1988-02-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1887388U JPH01123352U (US20050192411A1-20050901-C00001.png) | 1988-02-15 | 1988-02-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01123352U true JPH01123352U (US20050192411A1-20050901-C00001.png) | 1989-08-22 |
Family
ID=31233897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1887388U Pending JPH01123352U (US20050192411A1-20050901-C00001.png) | 1988-02-15 | 1988-02-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01123352U (US20050192411A1-20050901-C00001.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0969594A (ja) * | 1995-06-23 | 1997-03-11 | Toshiba Corp | 圧接用窒化けい素放熱板およびそれを用いた圧接構造部品 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56135948A (en) * | 1980-03-28 | 1981-10-23 | Denki Kagaku Kogyo Kk | Insulated radiating substrate |
JPS6258664A (ja) * | 1985-09-09 | 1987-03-14 | Toshiba Corp | 放熱性絶縁基板 |
-
1988
- 1988-02-15 JP JP1887388U patent/JPH01123352U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56135948A (en) * | 1980-03-28 | 1981-10-23 | Denki Kagaku Kogyo Kk | Insulated radiating substrate |
JPS6258664A (ja) * | 1985-09-09 | 1987-03-14 | Toshiba Corp | 放熱性絶縁基板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0969594A (ja) * | 1995-06-23 | 1997-03-11 | Toshiba Corp | 圧接用窒化けい素放熱板およびそれを用いた圧接構造部品 |