JPH01122463U - - Google Patents
Info
- Publication number
- JPH01122463U JPH01122463U JP1988012999U JP1299988U JPH01122463U JP H01122463 U JPH01122463 U JP H01122463U JP 1988012999 U JP1988012999 U JP 1988012999U JP 1299988 U JP1299988 U JP 1299988U JP H01122463 U JPH01122463 U JP H01122463U
- Authority
- JP
- Japan
- Prior art keywords
- storage holes
- tape
- electronic components
- base tape
- packaging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 claims description 3
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988012999U JPH076124Y2 (ja) | 1988-02-04 | 1988-02-04 | 電子部品の包装装置 |
| KR2019880016735U KR920008600Y1 (ko) | 1988-02-04 | 1988-10-02 | 전자부품의 포장장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988012999U JPH076124Y2 (ja) | 1988-02-04 | 1988-02-04 | 電子部品の包装装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01122463U true JPH01122463U (me) | 1989-08-21 |
| JPH076124Y2 JPH076124Y2 (ja) | 1995-02-15 |
Family
ID=31222932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988012999U Expired - Lifetime JPH076124Y2 (ja) | 1988-02-04 | 1988-02-04 | 電子部品の包装装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH076124Y2 (me) |
| KR (1) | KR920008600Y1 (me) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58129697U (ja) * | 1982-02-26 | 1983-09-02 | 株式会社東芝 | チツプ部品の包装装置 |
| JPS63183067U (me) * | 1987-05-18 | 1988-11-25 |
-
1988
- 1988-02-04 JP JP1988012999U patent/JPH076124Y2/ja not_active Expired - Lifetime
- 1988-10-02 KR KR2019880016735U patent/KR920008600Y1/ko not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58129697U (ja) * | 1982-02-26 | 1983-09-02 | 株式会社東芝 | チツプ部品の包装装置 |
| JPS63183067U (me) * | 1987-05-18 | 1988-11-25 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR920008600Y1 (ko) | 1992-12-05 |
| KR890018229U (ko) | 1989-09-09 |
| JPH076124Y2 (ja) | 1995-02-15 |