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Priority to JP1988017201UpriorityCriticalpatent/JPH01121969U/ja
Publication of JPH01121969UpublicationCriticalpatent/JPH01121969U/ja
H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
H10W90/00—Package configurations
H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
Details Of Resistors
(AREA)
Insulated Metal Substrates For Printed Circuits
(AREA)
Cooling Or The Like Of Electrical Apparatus
(AREA)