JPH01121960U - - Google Patents
Info
- Publication number
- JPH01121960U JPH01121960U JP1988017189U JP1718988U JPH01121960U JP H01121960 U JPH01121960 U JP H01121960U JP 1988017189 U JP1988017189 U JP 1988017189U JP 1718988 U JP1718988 U JP 1718988U JP H01121960 U JPH01121960 U JP H01121960U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- led bare
- bare chip
- led
- illuminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Elements Other Than Lenses (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988017189U JPH01121960U (id) | 1988-02-12 | 1988-02-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988017189U JPH01121960U (id) | 1988-02-12 | 1988-02-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01121960U true JPH01121960U (id) | 1989-08-18 |
Family
ID=31230748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988017189U Pending JPH01121960U (id) | 1988-02-12 | 1988-02-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01121960U (id) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005159262A (ja) * | 2003-10-30 | 2005-06-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
WO2007102534A1 (ja) * | 2006-03-08 | 2007-09-13 | Rohm Co., Ltd. | チップ型半導体発光素子 |
JP2009206529A (ja) * | 2004-12-16 | 2009-09-10 | Seoul Semiconductor Co Ltd | ヒートシンク支持リングを有するリードフレーム、それを使用した発光ダイオードパッケージ製造方法及びそれを用いて製造した発光ダイオードパッケージ |
WO2014002628A1 (ja) * | 2012-06-29 | 2014-01-03 | シャープ株式会社 | 発光装置、照明装置および表示装置用バックライト |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5921414U (ja) * | 1982-07-29 | 1984-02-09 | 松下電器産業株式会社 | コンロ |
JPS5950455B2 (ja) * | 1981-05-25 | 1984-12-08 | 秀三 末本 | 旋盤のねじ切り装置 |
JPS60102775A (ja) * | 1983-11-09 | 1985-06-06 | Toshiba Corp | 発光表示装置 |
JPS6235224U (id) * | 1985-08-22 | 1987-03-02 | ||
JPS631362B2 (id) * | 1982-09-13 | 1988-01-12 | Teikoku Pisutonringu Kk |
-
1988
- 1988-02-12 JP JP1988017189U patent/JPH01121960U/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950455B2 (ja) * | 1981-05-25 | 1984-12-08 | 秀三 末本 | 旋盤のねじ切り装置 |
JPS5921414U (ja) * | 1982-07-29 | 1984-02-09 | 松下電器産業株式会社 | コンロ |
JPS631362B2 (id) * | 1982-09-13 | 1988-01-12 | Teikoku Pisutonringu Kk | |
JPS60102775A (ja) * | 1983-11-09 | 1985-06-06 | Toshiba Corp | 発光表示装置 |
JPS6235224U (id) * | 1985-08-22 | 1987-03-02 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005159262A (ja) * | 2003-10-30 | 2005-06-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
JP2009206529A (ja) * | 2004-12-16 | 2009-09-10 | Seoul Semiconductor Co Ltd | ヒートシンク支持リングを有するリードフレーム、それを使用した発光ダイオードパッケージ製造方法及びそれを用いて製造した発光ダイオードパッケージ |
WO2007102534A1 (ja) * | 2006-03-08 | 2007-09-13 | Rohm Co., Ltd. | チップ型半導体発光素子 |
WO2014002628A1 (ja) * | 2012-06-29 | 2014-01-03 | シャープ株式会社 | 発光装置、照明装置および表示装置用バックライト |
JP2014011359A (ja) * | 2012-06-29 | 2014-01-20 | Sharp Corp | 発光装置、照明装置および表示装置用バックライト |