JPH01121960U - - Google Patents

Info

Publication number
JPH01121960U
JPH01121960U JP1988017189U JP1718988U JPH01121960U JP H01121960 U JPH01121960 U JP H01121960U JP 1988017189 U JP1988017189 U JP 1988017189U JP 1718988 U JP1718988 U JP 1718988U JP H01121960 U JPH01121960 U JP H01121960U
Authority
JP
Japan
Prior art keywords
lead frame
led bare
bare chip
led
illuminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988017189U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988017189U priority Critical patent/JPH01121960U/ja
Publication of JPH01121960U publication Critical patent/JPH01121960U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP1988017189U 1988-02-12 1988-02-12 Pending JPH01121960U (da)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988017189U JPH01121960U (da) 1988-02-12 1988-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988017189U JPH01121960U (da) 1988-02-12 1988-02-12

Publications (1)

Publication Number Publication Date
JPH01121960U true JPH01121960U (da) 1989-08-18

Family

ID=31230748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988017189U Pending JPH01121960U (da) 1988-02-12 1988-02-12

Country Status (1)

Country Link
JP (1) JPH01121960U (da)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159262A (ja) * 2003-10-30 2005-06-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
WO2007102534A1 (ja) * 2006-03-08 2007-09-13 Rohm Co., Ltd. チップ型半導体発光素子
JP2009206529A (ja) * 2004-12-16 2009-09-10 Seoul Semiconductor Co Ltd ヒートシンク支持リングを有するリードフレーム、それを使用した発光ダイオードパッケージ製造方法及びそれを用いて製造した発光ダイオードパッケージ
WO2014002628A1 (ja) * 2012-06-29 2014-01-03 シャープ株式会社 発光装置、照明装置および表示装置用バックライト

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921414U (ja) * 1982-07-29 1984-02-09 松下電器産業株式会社 コンロ
JPS5950455B2 (ja) * 1981-05-25 1984-12-08 秀三 末本 旋盤のねじ切り装置
JPS60102775A (ja) * 1983-11-09 1985-06-06 Toshiba Corp 発光表示装置
JPS6235224U (da) * 1985-08-22 1987-03-02
JPS631362B2 (da) * 1982-09-13 1988-01-12 Teikoku Pisutonringu Kk

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950455B2 (ja) * 1981-05-25 1984-12-08 秀三 末本 旋盤のねじ切り装置
JPS5921414U (ja) * 1982-07-29 1984-02-09 松下電器産業株式会社 コンロ
JPS631362B2 (da) * 1982-09-13 1988-01-12 Teikoku Pisutonringu Kk
JPS60102775A (ja) * 1983-11-09 1985-06-06 Toshiba Corp 発光表示装置
JPS6235224U (da) * 1985-08-22 1987-03-02

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159262A (ja) * 2003-10-30 2005-06-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
JP2009206529A (ja) * 2004-12-16 2009-09-10 Seoul Semiconductor Co Ltd ヒートシンク支持リングを有するリードフレーム、それを使用した発光ダイオードパッケージ製造方法及びそれを用いて製造した発光ダイオードパッケージ
WO2007102534A1 (ja) * 2006-03-08 2007-09-13 Rohm Co., Ltd. チップ型半導体発光素子
WO2014002628A1 (ja) * 2012-06-29 2014-01-03 シャープ株式会社 発光装置、照明装置および表示装置用バックライト
JP2014011359A (ja) * 2012-06-29 2014-01-20 Sharp Corp 発光装置、照明装置および表示装置用バックライト

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