JPH01121953U - - Google Patents

Info

Publication number
JPH01121953U
JPH01121953U JP1721488U JP1721488U JPH01121953U JP H01121953 U JPH01121953 U JP H01121953U JP 1721488 U JP1721488 U JP 1721488U JP 1721488 U JP1721488 U JP 1721488U JP H01121953 U JPH01121953 U JP H01121953U
Authority
JP
Japan
Prior art keywords
chip
transparent
semiconductor device
sealing material
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1721488U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1721488U priority Critical patent/JPH01121953U/ja
Publication of JPH01121953U publication Critical patent/JPH01121953U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP1721488U 1988-02-10 1988-02-10 Pending JPH01121953U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1721488U JPH01121953U (fr) 1988-02-10 1988-02-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1721488U JPH01121953U (fr) 1988-02-10 1988-02-10

Publications (1)

Publication Number Publication Date
JPH01121953U true JPH01121953U (fr) 1989-08-18

Family

ID=31230796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1721488U Pending JPH01121953U (fr) 1988-02-10 1988-02-10

Country Status (1)

Country Link
JP (1) JPH01121953U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185657A (ja) * 1999-12-10 2001-07-06 Amkor Technology Korea Inc 半導体パッケージ及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185657A (ja) * 1999-12-10 2001-07-06 Amkor Technology Korea Inc 半導体パッケージ及びその製造方法

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