JPH01121939U - - Google Patents

Info

Publication number
JPH01121939U
JPH01121939U JP1715688U JP1715688U JPH01121939U JP H01121939 U JPH01121939 U JP H01121939U JP 1715688 U JP1715688 U JP 1715688U JP 1715688 U JP1715688 U JP 1715688U JP H01121939 U JPH01121939 U JP H01121939U
Authority
JP
Japan
Prior art keywords
metal
microwave integrated
partition wall
spaces
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1715688U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1715688U priority Critical patent/JPH01121939U/ja
Publication of JPH01121939U publication Critical patent/JPH01121939U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5445Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Casings For Electric Apparatus (AREA)
JP1715688U 1988-02-12 1988-02-12 Pending JPH01121939U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1715688U JPH01121939U (enExample) 1988-02-12 1988-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1715688U JPH01121939U (enExample) 1988-02-12 1988-02-12

Publications (1)

Publication Number Publication Date
JPH01121939U true JPH01121939U (enExample) 1989-08-18

Family

ID=31230687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1715688U Pending JPH01121939U (enExample) 1988-02-12 1988-02-12

Country Status (1)

Country Link
JP (1) JPH01121939U (enExample)

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