JPH01118451U - - Google Patents
Info
- Publication number
- JPH01118451U JPH01118451U JP1430088U JP1430088U JPH01118451U JP H01118451 U JPH01118451 U JP H01118451U JP 1430088 U JP1430088 U JP 1430088U JP 1430088 U JP1430088 U JP 1430088U JP H01118451 U JPH01118451 U JP H01118451U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- lead
- semiconductor device
- socket
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
Landscapes
- Connecting Device With Holders (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図ａ及びｂは本考案の一実施例を説明する
ための断面図、第２図は従来のソケツトの一例の
断面図である。 １，１′……接触子、２，２′……バネ、３，
３′……絶縁物。
ための断面図、第２図は従来のソケツトの一例の
断面図である。 １，１′……接触子、２，２′……バネ、３，
３′……絶縁物。
Claims (1)
- 半導体装置のリードと電気的に接続するための
導電性の接触子と該接触子を所定の位置に配置し
た絶縁物とを含む半導体装置用のソケツトにおい
て、前記リードと前記接触子との接続を保持する
ためのバネが形状記憶合金からなることを特徴と
するソケツト。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1430088U JPH01118451U (ja) | 1988-02-04 | 1988-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1430088U JPH01118451U (ja) | 1988-02-04 | 1988-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01118451U true JPH01118451U (ja) | 1989-08-10 |
Family
ID=31225377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1430088U Pending JPH01118451U (ja) | 1988-02-04 | 1988-02-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01118451U (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03236181A (ja) * | 1990-02-13 | 1991-10-22 | Fujitsu Ltd | ソケット |
| JP2007250475A (ja) * | 2006-03-17 | 2007-09-27 | Espec Corp | Ｉｃソケット |
| JP2015517713A (ja) * | 2012-05-03 | 2015-06-22 | ▲劉▼杰Ｊｉｅ ＬＩＵ | 導電デバイスを備えたソケット |
-
1988
- 1988-02-04 JP JP1430088U patent/JPH01118451U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03236181A (ja) * | 1990-02-13 | 1991-10-22 | Fujitsu Ltd | ソケット |
| JP2007250475A (ja) * | 2006-03-17 | 2007-09-27 | Espec Corp | Ｉｃソケット |
| JP4628291B2 (ja) * | 2006-03-17 | 2011-02-09 | エスペック株式会社 | Ｉｃソケット |
| JP2015517713A (ja) * | 2012-05-03 | 2015-06-22 | ▲劉▼杰Ｊｉｅ ＬＩＵ | 導電デバイスを備えたソケット |