JPH01117049U - - Google Patents
Info
- Publication number
- JPH01117049U JPH01117049U JP1323088U JP1323088U JPH01117049U JP H01117049 U JPH01117049 U JP H01117049U JP 1323088 U JP1323088 U JP 1323088U JP 1323088 U JP1323088 U JP 1323088U JP H01117049 U JPH01117049 U JP H01117049U
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- filament support
- filament
- display tube
- fluorescent display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
Landscapes
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1323088U JPH01117049U (fr) | 1988-02-02 | 1988-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1323088U JPH01117049U (fr) | 1988-02-02 | 1988-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01117049U true JPH01117049U (fr) | 1989-08-08 |
Family
ID=31223359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1323088U Pending JPH01117049U (fr) | 1988-02-02 | 1988-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01117049U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11735552B2 (en) | 2019-06-25 | 2023-08-22 | Intel Corporation | Microelectronic package with solder array thermal interface material (SA-TIM) |
-
1988
- 1988-02-02 JP JP1323088U patent/JPH01117049U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11735552B2 (en) | 2019-06-25 | 2023-08-22 | Intel Corporation | Microelectronic package with solder array thermal interface material (SA-TIM) |