JPH01117049U - - Google Patents
Info
- Publication number
- JPH01117049U JPH01117049U JP1323088U JP1323088U JPH01117049U JP H01117049 U JPH01117049 U JP H01117049U JP 1323088 U JP1323088 U JP 1323088U JP 1323088 U JP1323088 U JP 1323088U JP H01117049 U JPH01117049 U JP H01117049U
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- filament support
- filament
- display tube
- fluorescent display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
Landscapes
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Description
第１図は本考案のフイラメント支持体の一実施
例の斜視図、第２図は従来のフイラメント支持体
の一例の斜視図である。
１……フイラメント支持体、２……ガラス基板
、３……フイラメント、４……蛍光体パターン、
５……グリツド、６……低融点ガラス、１１……
フイラメント支持体。
FIG. 1 is a perspective view of an embodiment of the filament support of the present invention, and FIG. 2 is a perspective view of an example of a conventional filament support. DESCRIPTION OF SYMBOLS 1... Filament support, 2... Glass substrate, 3... Filament, 4... Phosphor pattern,
5... Grid, 6... Low melting point glass, 11...
filament support.
Claims (1)
れたフイラメント支持体と、該フイラメント支持
体に張設されたフイラメントとを有する蛍光表示
管において、前記フイラメント支持体を前記ガラ
ス基板の端面に外嵌して固定したことを特徴とす
る蛍光表示管。 In a fluorescent display tube having a glass substrate, a filament support fixed to both ends of the glass substrate, and a filament stretched over the filament support, the filament support is externally fitted onto an end surface of the glass substrate. A fluorescent display tube characterized in that it is fixed in place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1323088U JPH01117049U (en) | 1988-02-02 | 1988-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1323088U JPH01117049U (en) | 1988-02-02 | 1988-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01117049U true JPH01117049U (en) | 1989-08-08 |
Family
ID=31223359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1323088U Pending JPH01117049U (en) | 1988-02-02 | 1988-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01117049U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11735552B2 (en) | 2019-06-25 | 2023-08-22 | Intel Corporation | Microelectronic package with solder array thermal interface material (SA-TIM) |
-
1988
- 1988-02-02 JP JP1323088U patent/JPH01117049U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11735552B2 (en) | 2019-06-25 | 2023-08-22 | Intel Corporation | Microelectronic package with solder array thermal interface material (SA-TIM) |