JPH01116488U - - Google Patents
Info
- Publication number
- JPH01116488U JPH01116488U JP1988012349U JP1234988U JPH01116488U JP H01116488 U JPH01116488 U JP H01116488U JP 1988012349 U JP1988012349 U JP 1988012349U JP 1234988 U JP1234988 U JP 1234988U JP H01116488 U JPH01116488 U JP H01116488U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- component mounting
- circuit boards
- board assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 1
Description
第1図は本考案の一実施例になるプリント基板
組立体ガイド機構の構成を示す図、第2図は第1
図中ガイドレールの斜視図、第3図乃至第5図は
夫々板厚の異なるプリント基板組立体が挿入され
たときの状態を示す図、第6図は従来の1例のプ
リント基板組立体ガイド機構の構成を示す図、第
7図は第6図中ガイドレールの斜視図、第8図乃
至第10図は夫々板厚の異なるプリント基板組立
体が挿入されたときの状態を示す図である。
図において、5はシエルフ、6は側板、10,
10A,10Bはプリント基板組立体、11,1
1A,11Bはプリント基板、12は電子部品、
13はソケツト、14は部品実装面、15ははん
だ面、20はコネクタ、21は背板、22はピン
、30はガイド機構、31はガイドレール、32
は上側フランジ、33は下側フランジ、34は溝
、35,36はばね部、37は下面、を示す。
FIG. 1 is a diagram showing the configuration of a printed circuit board assembly guide mechanism that is an embodiment of the present invention, and FIG.
In the figure, a perspective view of the guide rail, FIGS. 3 to 5 are diagrams showing the states when printed circuit board assemblies with different board thicknesses are inserted, and FIG. 6 is an example of a conventional printed circuit board assembly guide. FIG. 7 is a perspective view of the guide rail in FIG. 6, and FIGS. 8 to 10 are diagrams showing the state when printed circuit board assemblies with different board thicknesses are inserted. . In the figure, 5 is a shield, 6 is a side plate, 10,
10A, 10B are printed circuit board assemblies, 11, 1
1A and 11B are printed circuit boards, 12 is electronic components,
13 is a socket, 14 is a component mounting surface, 15 is a soldering surface, 20 is a connector, 21 is a back plate, 22 is a pin, 30 is a guide mechanism, 31 is a guide rail, 32
33 is an upper flange, 33 is a lower flange, 34 is a groove, 35 and 36 are spring parts, and 37 is a lower surface.
Claims (1)
はんだ面15であるプリント基板11,11A,
11Bの上記部品実装面14に部品12が実装し
てあり、且つ上記部品実装面14を基準にソケツ
ト13が取り付けてあるプリント基板組立体の1
0,10A,10Bの上記ソケツト13をシエル
フ5の奥部に設けてあるコネクタ20に接続すべ
く、上記プリント基板組立体10,10A,10
Bをその部品実装面14を上側とした水平姿勢で
上記シエルフ5内に挿入するときに、上記プリン
ト基板の11,11A,11Bの両側縁側を案内
するガイドレールを有するプリント基板組立体ガ
イド機構において、 その間に上記プリント基板11,11A,11
Bの側縁側を案内する溝34を有する上側フラン
ジ32及び下側フランジ33と、該下側フランジ
33の上面に該下側フランジと一体形成されてお
り、上記プリント基板11,11A,11Bのは
んだ面15を押し上げて片寄せするばね部35,
36とよりなるガイドレール31を備えてなり、 上記プリント基板組立体10,10A,10B
がそのプリント基板11,11A,11Bの部品
実装面14を上記上側フランジ32の下面37に
押し付けられて高さ位置を規制される構造のプリ
ント基板組立体ガイド機構。[Claims for Utility Model Registration] Printed circuit boards 11, 11A, one surface of which is a component mounting surface 14 and the other surface is a solder surface 15;
1 of the printed circuit board assembly in which the component 12 is mounted on the component mounting surface 14 of 11B, and the socket 13 is attached with reference to the component mounting surface 14;
In order to connect the sockets 13 of 0, 10A, 10B to the connector 20 provided in the inner part of the shelf 5, the printed circuit board assemblies 10, 10A, 10
A printed circuit board assembly guide mechanism having guide rails for guiding both side edges of the printed circuit boards 11, 11A, and 11B when inserting the board B into the shelf 5 in a horizontal position with its component mounting surface 14 facing upward. , Meanwhile, the printed circuit boards 11, 11A, 11
An upper flange 32 and a lower flange 33 having grooves 34 for guiding the side edges of B, and integrally formed with the lower flange on the upper surface of the lower flange 33, and solder of the printed circuit boards 11, 11A, 11B. a spring portion 35 that pushes up the surface 15 and shifts it to one side;
36, and the printed circuit board assembly 10, 10A, 10B.
The printed circuit board assembly guide mechanism has a structure in which the component mounting surfaces 14 of the printed circuit boards 11, 11A, and 11B are pressed against the lower surface 37 of the upper flange 32 to regulate the height position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988012349U JPH073670Y2 (en) | 1988-02-01 | 1988-02-01 | Printed circuit board assembly guide mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988012349U JPH073670Y2 (en) | 1988-02-01 | 1988-02-01 | Printed circuit board assembly guide mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01116488U true JPH01116488U (en) | 1989-08-07 |
JPH073670Y2 JPH073670Y2 (en) | 1995-01-30 |
Family
ID=31221717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988012349U Expired - Lifetime JPH073670Y2 (en) | 1988-02-01 | 1988-02-01 | Printed circuit board assembly guide mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH073670Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0582990A (en) * | 1991-09-18 | 1993-04-02 | Nec Corp | Plug-in unit |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5380069U (en) * | 1976-12-06 | 1978-07-04 | ||
JPS56172998U (en) * | 1980-05-21 | 1981-12-21 | ||
JPS61164095U (en) * | 1985-04-01 | 1986-10-11 |
-
1988
- 1988-02-01 JP JP1988012349U patent/JPH073670Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5380069U (en) * | 1976-12-06 | 1978-07-04 | ||
JPS56172998U (en) * | 1980-05-21 | 1981-12-21 | ||
JPS61164095U (en) * | 1985-04-01 | 1986-10-11 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0582990A (en) * | 1991-09-18 | 1993-04-02 | Nec Corp | Plug-in unit |
Also Published As
Publication number | Publication date |
---|---|
JPH073670Y2 (en) | 1995-01-30 |
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