JPH01116457U - - Google Patents
Info
- Publication number
- JPH01116457U JPH01116457U JP1988011436U JP1143688U JPH01116457U JP H01116457 U JPH01116457 U JP H01116457U JP 1988011436 U JP1988011436 U JP 1988011436U JP 1143688 U JP1143688 U JP 1143688U JP H01116457 U JPH01116457 U JP H01116457U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- external lead
- semiconductor device
- sealing
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011436U JPH01116457U (enExample) | 1988-01-29 | 1988-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011436U JPH01116457U (enExample) | 1988-01-29 | 1988-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01116457U true JPH01116457U (enExample) | 1989-08-07 |
Family
ID=31219988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988011436U Pending JPH01116457U (enExample) | 1988-01-29 | 1988-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116457U (enExample) |
-
1988
- 1988-01-29 JP JP1988011436U patent/JPH01116457U/ja active Pending