JPH01113355U - - Google Patents
Info
- Publication number
- JPH01113355U JPH01113355U JP776788U JP776788U JPH01113355U JP H01113355 U JPH01113355 U JP H01113355U JP 776788 U JP776788 U JP 776788U JP 776788 U JP776788 U JP 776788U JP H01113355 U JPH01113355 U JP H01113355U
- Authority
- JP
- Japan
- Prior art keywords
- air
- heat
- air flow
- flow
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011800 void material Substances 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案によるヒートシンクの構成を
示す図、第２図は従来のヒートシンクの構成を示
す図。
１は半導体、２はヒートシンク、３はヒートシ
ンクの溝、４はヒートシンクの山、５は送気口、
６は排気口、７は導風管、８は周囲を流れる空気
流。なお、各図中同一符号は同一又は相当部分を
示すものとする。
FIG. 1 is a diagram showing the configuration of a heat sink according to this invention, and FIG. 2 is a diagram showing the configuration of a conventional heat sink. 1 is the semiconductor, 2 is the heat sink, 3 is the groove of the heat sink, 4 is the mountain of the heat sink, 5 is the air outlet,
6 is an exhaust port, 7 is an air guide pipe, and 8 is an air flow flowing around it. Note that the same reference numerals in each figure indicate the same or corresponding parts.
補正 昭６３．７．６
図面の簡単な説明を次のように補正する。
明細書第６頁第１６行目「周囲を流れる空気流
。」とあるを「空気流。」と訂正する。Amendment July 6, 1983 The brief description of the drawing is amended as follows. On page 6, line 16 of the specification, the phrase ``Air flow flowing around.'' is corrected to ``Air flow.''
Claims (1)
冷却するため上記半導体からの熱伝導部分と、こ
の熱伝導部分の間に空気流を流すための空隙部分
とを有するヒートシンクにおいて、 上記熱伝導部分と上記空隙部分との全体を覆う
カバーを設け、 このカバー内に空気流を送り込む送気口と熱交
換された空気を上記空隙部分から排出する排気口
とを設ける手段と、上記送気口へこの送気口に接
続された導風管より空気流を送り込む手段とを備
えたことを特徴とするヒートシンク。[Claim for Utility Model Registration] In order to cool a heating element such as a semiconductor by heat exchange with an air flow, a heat conduction part from the semiconductor and a gap part for allowing an air flow to flow between the heat conduction part. In the heat sink having a heat sink, a cover is provided that covers the entirety of the heat conduction portion and the void portion, and an air inlet for sending an air flow into the cover and an exhaust port for discharging the heat-exchanged air from the void portion are provided. and means for sending an air flow to the air inlet from an air guide tube connected to the air inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP776788U JPH01113355U (en) | 1988-01-25 | 1988-01-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP776788U JPH01113355U (en) | 1988-01-25 | 1988-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113355U true JPH01113355U (en) | 1989-07-31 |
Family
ID=31213060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP776788U Pending JPH01113355U (en) | 1988-01-25 | 1988-01-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113355U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4333373A1 (en) * | 1992-09-30 | 1994-03-31 | Hitachi Ltd | Electronic appts. using power semiconductors - provides respective cooling medium flow jets for each power semiconductor heat sink element |
| WO1999048346A1 (en) * | 1998-03-18 | 1999-09-23 | Hitachi, Ltd. | Electronic equipment |
| JP2013145834A (en) * | 2012-01-16 | 2013-07-25 | Mitsubishi Electric Corp | Heat sink |
| JP2016149567A (en) * | 2016-03-29 | 2016-08-18 | 株式会社新川 | Heater for bonding device, heater assembly for bonding device, and bonding device |
-
1988
- 1988-01-25 JP JP776788U patent/JPH01113355U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4333373A1 (en) * | 1992-09-30 | 1994-03-31 | Hitachi Ltd | Electronic appts. using power semiconductors - provides respective cooling medium flow jets for each power semiconductor heat sink element |
| DE4333373B4 (en) * | 1992-09-30 | 2006-04-20 | Hitachi, Ltd. | Electronic device |
| WO1999048346A1 (en) * | 1998-03-18 | 1999-09-23 | Hitachi, Ltd. | Electronic equipment |
| JP2013145834A (en) * | 2012-01-16 | 2013-07-25 | Mitsubishi Electric Corp | Heat sink |
| JP2016149567A (en) * | 2016-03-29 | 2016-08-18 | 株式会社新川 | Heater for bonding device, heater assembly for bonding device, and bonding device |
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