JPH01106241U - - Google Patents
Info
- Publication number
- JPH01106241U JPH01106241U JP1988001789U JP178988U JPH01106241U JP H01106241 U JPH01106241 U JP H01106241U JP 1988001789 U JP1988001789 U JP 1988001789U JP 178988 U JP178988 U JP 178988U JP H01106241 U JPH01106241 U JP H01106241U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- led array
- block
- common electrode
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Dot-Matrix Printers And Others (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988001789U JPH078214Y2 (ja) | 1988-01-11 | 1988-01-11 | Ｌｅｄアレイプリントヘッド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988001789U JPH078214Y2 (ja) | 1988-01-11 | 1988-01-11 | Ｌｅｄアレイプリントヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01106241U true JPH01106241U (me) | 1989-07-18 |
| JPH078214Y2 JPH078214Y2 (ja) | 1995-03-01 |
Family
ID=31201981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988001789U Expired - Lifetime JPH078214Y2 (ja) | 1988-01-11 | 1988-01-11 | Ｌｅｄアレイプリントヘッド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH078214Y2 (me) |
-
1988
- 1988-01-11 JP JP1988001789U patent/JPH078214Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH078214Y2 (ja) | 1995-03-01 |