JPH01106239U - - Google Patents
Info
- Publication number
- JPH01106239U JPH01106239U JP220688U JP220688U JPH01106239U JP H01106239 U JPH01106239 U JP H01106239U JP 220688 U JP220688 U JP 220688U JP 220688 U JP220688 U JP 220688U JP H01106239 U JPH01106239 U JP H01106239U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- substrate
- recess
- common electrode
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案のサーマルヘツド装置の斜視図
、第２図ａ，ｂは従来のサーマルヘツド装置の斜
視図と側面図、第３図は本考案のサーマルヘツド
装置の他の実施例の斜視図である。
１…アルミナ基板、２…発熱体、３…個別電極
、４…リード、５…共通電極、６…厚膜導体、１
１…基板、１２…発熱体、１３…個別電極、１４
…リード、１５…共通電極、１６…凹部、１７…
溝、１８…導体。
Fig. 1 is a perspective view of the thermal head device of the present invention, Figs. 2a and b are perspective views and side views of a conventional thermal head device, and Fig. 3 is a perspective view of another embodiment of the thermal head device of the present invention. It is a diagram. DESCRIPTION OF SYMBOLS 1...Alumina substrate, 2...Heating element, 3...Individual electrode, 4...Lead, 5...Common electrode, 6...Thick film conductor, 1
DESCRIPTION OF SYMBOLS 1...Substrate, 12...Heating element, 13...Individual electrode, 14
...Lead, 15...Common electrode, 16...Recess, 17...
Groove, 18...conductor.
Claims (1)
備えることを特徴とするサーマルヘツド装置。[Claims for Utility Model Registration] A substrate in which a recess is formed, a heating element formed on this substrate, an individual electrode connected to this heating element, a common electrode formed in the recess, and the heating element. A thermal head device comprising a lead connecting the body and a common electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP220688U JPH01106239U (en) | 1988-01-12 | 1988-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP220688U JPH01106239U (en) | 1988-01-12 | 1988-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01106239U true JPH01106239U (en) | 1989-07-18 |
Family
ID=31202776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP220688U Pending JPH01106239U (en) | 1988-01-12 | 1988-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01106239U (en) |
-
1988
- 1988-01-12 JP JP220688U patent/JPH01106239U/ja active Pending