JPH01106225U - - Google Patents
Info
- Publication number
- JPH01106225U JPH01106225U JP172188U JP172188U JPH01106225U JP H01106225 U JPH01106225 U JP H01106225U JP 172188 U JP172188 U JP 172188U JP 172188 U JP172188 U JP 172188U JP H01106225 U JPH01106225 U JP H01106225U
- Authority
- JP
- Japan
- Prior art keywords
- inorganic
- heat insulating
- frame member
- resistant
- fire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 4
- 230000009970 fire resistant effect Effects 0.000 claims 3
- 239000006260 foam Substances 0.000 claims 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 229910000019 calcium carbonate Inorganic materials 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000012784 inorganic fiber Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000011541 reaction mixture Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011863 silicon-based powder Substances 0.000 claims 1
Description
第１図は本考案の第一実施例に係る無機質系パ
ネルを示す部分断面図、第２図は第二実施例に係
る無機質系パネルを示す部分断面図である。
符号の説明、１，１１…無機質系パネル１、２
，１２…無機質断熱材、３，１３…緩衝材、４，
１４…表面材、５…枠部材、ｄ…厚さ寸法の誤差
。
FIG. 1 is a partial sectional view showing an inorganic panel according to a first embodiment of the present invention, and FIG. 2 is a partial sectional view showing an inorganic panel according to a second embodiment. Explanation of symbols, 1, 11...Inorganic panels 1, 2
, 12... Inorganic heat insulating material, 3, 13... Cushioning material, 4,
14... Surface material, 5... Frame member, d... Error in thickness dimension.
Claims (1)
用される硅酸アルカリ溶液及び金属硅素粉を主体
とする硬化剤を含有する反応混合物を成形してな
る無機質断熱材と、この無機質断熱材の表面の一
部又は全部を覆う表面材及び／又は枠部材と、上
記無機質断熱材と表面材及び／又は枠部材との間
に介装される緩衝材とを有することを特徴とする
無機質系パネル。 (2) 緩衝材が耐火不燃性を有する無機緩衝材で
ある実用新案登録請求の範囲第１項記載の無機質
系パネル。 (3) 無機緩衝材が、炭酸カルシウム発泡板又は
無機繊維成形板である実用新案登録請求の範囲第
２項記載の無機質系パネル。 (4) 緩衝材が、耐火性の表面材及び／又は枠部
材の中に密封され、高温に加熱された際に炭化し
て耐火不燃性を発揮する樹脂発泡板である実用新
案登録請求の範囲第１項記載の無機質系パネル。[Claims for Utility Model Registration] (1) An inorganic heat insulating material formed by molding a reaction mixture containing a granular inorganic foam, an alkaline silicate solution used as a binder, and a hardening agent mainly composed of metal silicon powder. , a surface material and/or a frame member that covers part or all of the surface of the inorganic heat insulating material, and a cushioning material interposed between the inorganic heat insulating material and the surface material and/or the frame member. Features an inorganic panel. (2) The inorganic panel according to claim 1, wherein the cushioning material is a fire-resistant and noncombustible inorganic cushioning material. (3) The inorganic panel according to claim 2, wherein the inorganic buffer material is a calcium carbonate foam board or an inorganic fiber molded board. (4) The scope of the utility model registration claim where the cushioning material is a resin foam board that is sealed in a fire-resistant surface material and/or frame member and carbonizes when heated to high temperatures to exhibit fire-resistant and non-combustible properties. The inorganic panel according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP172188U JPH051386Y2 (en) | 1988-01-12 | 1988-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP172188U JPH051386Y2 (en) | 1988-01-12 | 1988-01-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01106225U true JPH01106225U (en) | 1989-07-18 |
| JPH051386Y2 JPH051386Y2 (en) | 1993-01-14 |
Family
ID=31201855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP172188U Expired - Lifetime JPH051386Y2 (en) | 1988-01-12 | 1988-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH051386Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03115643A (en) * | 1989-09-28 | 1991-05-16 | Nikkei Aavan Birudo Kk | Heat resistant insulating panel |
| JP2007247399A (en) * | 2007-05-28 | 2007-09-27 | Bunka Shutter Co Ltd | Panel for building material |
| JP2020128661A (en) * | 2019-02-08 | 2020-08-27 | 株式会社オカムラ | Wall surface panel |
-
1988
- 1988-01-12 JP JP172188U patent/JPH051386Y2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03115643A (en) * | 1989-09-28 | 1991-05-16 | Nikkei Aavan Birudo Kk | Heat resistant insulating panel |
| JP2007247399A (en) * | 2007-05-28 | 2007-09-27 | Bunka Shutter Co Ltd | Panel for building material |
| JP4647636B2 (en) * | 2007-05-28 | 2011-03-09 | 文化シヤッター株式会社 | Panel for building materials |
| JP2020128661A (en) * | 2019-02-08 | 2020-08-27 | 株式会社オカムラ | Wall surface panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH051386Y2 (en) | 1993-01-14 |
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