JPH01105518A - Sputtering target - Google Patents
Sputtering targetInfo
- Publication number
- JPH01105518A JPH01105518A JP26318387A JP26318387A JPH01105518A JP H01105518 A JPH01105518 A JP H01105518A JP 26318387 A JP26318387 A JP 26318387A JP 26318387 A JP26318387 A JP 26318387A JP H01105518 A JPH01105518 A JP H01105518A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- sputtering
- rare earth
- sputtering target
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005477 sputtering target Methods 0.000 title claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 23
- 238000004544 sputter deposition Methods 0.000 claims abstract description 16
- 239000010409 thin film Substances 0.000 claims abstract description 14
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 12
- 150000002910 rare earth metals Chemical class 0.000 claims abstract description 12
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 5
- 150000003624 transition metals Chemical class 0.000 claims abstract description 5
- 229910052771 Terbium Inorganic materials 0.000 claims abstract description 3
- 229910052688 Gadolinium Inorganic materials 0.000 claims abstract 2
- 229910052779 Neodymium Inorganic materials 0.000 claims abstract 2
- 229910052777 Praseodymium Inorganic materials 0.000 claims abstract 2
- 239000010408 film Substances 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 6
- 229910052692 Dysprosium Inorganic materials 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052684 Cerium Inorganic materials 0.000 abstract 1
- 230000007774 longterm Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001325 element alloy Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000001007 puffing effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005478 sputtering type Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Thin Magnetic Films (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、例えば磁気光学素子に用いられる重希土類金
屑・遷移金属合金磁性薄膜作成に用いるスパッタリング
eターゲットに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a sputtering e-target used for producing a heavy rare earth gold scrap/transition metal alloy magnetic thin film used, for example, in magneto-optical elements.
重希土類金属・遷移金層合金薄膜の成膜には一般に真空
蒸着、スパッタリング等が用いられる。Vacuum evaporation, sputtering, etc. are generally used to form heavy rare earth metal/transition gold layer alloy thin films.
中でもスパッタリング法は他の成膜法に比べて磁気的に
優れた膜が得られる点や、マグネトロンスパッタリング
法の進歩により量産性が著しく向上したことなどの理由
で、今日では最も広く利用されている。Among these, sputtering is the most widely used method today because it produces films with better magnetic properties than other film formation methods, and mass production has significantly improved due to advances in magnetron sputtering. .
スパッタリング法により多元素合金薄膜を形成する方法
として、薄膜方向及び面内方向に均一な組成の膜が得ら
れ、またスパッタリングを多数回繰り返し行っても、得
られる膜の組成は一定であることから、合金ターゲット
をスパッタリングする方法が適している。As a method of forming multi-element alloy thin films by sputtering, a film with a uniform composition can be obtained in the thin film direction and in-plane direction, and even if sputtering is repeated many times, the composition of the obtained film remains constant. , a method of sputtering an alloy target is suitable.
しかし、合金ターゲット中に不純物が多く含まれると、
スパックリングにより不純物が磁性薄膜に混入すること
になる。それにより、磁性薄膜の磁気特性が劣化し、同
時に長期信頼性を低下させる。そこで、本発明はこのよ
うな問題点を解決するもので、その目的とするところは
、磁性薄膜の本来存する磁気性能を十分引出し、尚且つ
長期間の信頼性を確保する磁性膜の作成を可能にする、
スパッタリング・ターゲットを提供することにある。However, if the alloy target contains many impurities,
Spackling causes impurities to be mixed into the magnetic thin film. This deteriorates the magnetic properties of the magnetic thin film and at the same time reduces long-term reliability. Therefore, the present invention is intended to solve these problems, and its purpose is to make it possible to create a magnetic film that fully brings out the inherent magnetic performance of the magnetic thin film and also ensures long-term reliability. to,
The purpose is to provide sputtering targets.
本発明のスパッタリング・ターゲットは、重希土類金属
及び遷移金属を主たる成分とする磁性薄膜を作成する際
に用いるスパッタリング・ターゲットにおいて、炭素含
存量が重量比で200PPM以下であることを特徴とし
ている。さらに、前記スパッタリング・ターゲットの、
組成を原子比で、
((LR)X’(HR)I−x)yA+*o’−yと表
すとき、(但し、LRは軽希土類金属Ce。The sputtering target of the present invention is a sputtering target used for creating a magnetic thin film containing heavy rare earth metals and transition metals as main components, and is characterized by having a carbon content of 200 PPM or less by weight. Furthermore, the sputtering target
When the composition is expressed in atomic ratio as ((LR)X'(HR)I-x)yA+*o'-y, (LR is the light rare earth metal Ce.
Prs Ndt Smのうち1u類以上、HRは重希土
fJ金rlAGd、Tb、Dyのうt>1種類以上、A
はFe、Coのうちいずれかを、必ず含む (LR)、
(HR)以外の元素を表すa) Xs’jが各々、
0.05≦X≦0.60
15≦y≦40
の範囲にある。Prs Ndt Sm, 1u class or more, HR is heavy rare earth fJ gold rlAGd, Tb, Dy > 1 type or more, A
must contain either Fe or Co (LR),
a) Xs'j representing an element other than (HR) is in the range of 0.05≦X≦0.60 and 15≦y≦40.
(実施例)
以下、実施例に基づいて本発明の詳細な説明する。本実
施例に用いたスパッタリング・ターゲットは特に断わら
ない限り、すべて純度99.0%以上の高純度金属の原
料を誘導加熱炉にて真空中で加熱・溶解した後、アルゴ
ン雰囲気で鋳造したものを直径10 c m s厚さ5
mmの円盤状に加工し、さらに銅板からなるパフキング
プレートにインジウム系ハングで接合して用いた。原料
純度及び鋳造条件を変えることにより、炭素濃度はff
i量比で1100PP〜800PPMのターゲットが得
られた。比較例として用いた焼結ターゲット中の、炭素
濃度は重量比で約5000PPMであった。(Examples) Hereinafter, the present invention will be described in detail based on Examples. Unless otherwise specified, all sputtering targets used in this example were made by heating and melting high-purity metal raw materials with a purity of 99.0% or higher in vacuum in an induction heating furnace, and then casting in an argon atmosphere. Diameter 10 cm s Thickness 5
It was processed into a disk shape of mm, and was further bonded to a puffing plate made of a copper plate using an indium hanger. By changing the raw material purity and casting conditions, the carbon concentration can be reduced to ff.
A target having an i amount ratio of 1100PP to 800PPM was obtained. The carbon concentration in the sintered target used as a comparative example was about 5000 PPM by weight.
また、以下に示す組成は原子比であった。Further, the compositions shown below are in atomic ratio.
(実施例1)
作成した、鋳造ターゲットの組成を第−表に示す。これ
らのスパッタリング・ターゲットを用いて初期真空度5
.0XIO−’ Toor以下にチャンバー内を排気し
た後、キャリアーガスとしてArをm人し、300Wの
高周波電力をカソードに印加して、ガラス基板上に50
nmの膜厚に成膜した。磁性膜の酸化を防止するため真
空を破らずに連続して窒化アルミニウムと窒化ケイ素の
混合物を1100nの膜厚に形成した。第一図は、試料
番号1の組成で炭素濃度が重量比で1100PP、20
0PPM及び800PPMの3種類のスパッタリング・
ターゲットにより作成した試料の成膜直後のファラデー
・ループと、60℃、RH90%の恒温恒湿槽内に20
時間放置した後のファラデー−ループを示し、第二表は
ファラデー回転角とファラデー・ループから得られた保
磁力の変化を示す、スパッタリング・ターゲットの炭素
濃度が低い試料の順に成膜直後のファラデー回転角、
第2表
保磁力ともに太き(、また60℃、R890%中に20
時間放置しても、)7ラデ一回転角、保磁力の低下が少
ない。試料番号2〜8の組成のスパッタリング・ターゲ
ットにより作成した試料についても同様な結果が得られ
た。このことから、低炭素濃度のスバッタリ/グーター
ゲットを用いて磁性薄膜を作成することは磁気特性の改
善と磁気特性の長期信頼性に効果があると−とがわかる
。(Example 1) Table 1 shows the composition of the created casting target. Using these sputtering targets, the initial vacuum level is 5.
.. After evacuating the chamber to below 0XIO-'Toor, Ar was used as a carrier gas, and 300W of high-frequency power was applied to the cathode to deposit 50% on a glass substrate.
A film was formed to a thickness of nm. In order to prevent oxidation of the magnetic film, a mixture of aluminum nitride and silicon nitride was continuously formed to a thickness of 1100 nm without breaking the vacuum. Figure 1 shows the composition of sample number 1 with a carbon concentration of 1100PP and 20PP by weight.
Three types of sputtering: 0PPM and 800PPM
A Faraday loop immediately after film formation of a sample created using a target, and a
Table 2 shows the Faraday rotation angle and the change in the coercive force obtained from the Faraday loop, in order of the carbon concentration of the sputtering target. Both the angle and the coercive force in Table 2 are thick (and 60℃, R890%, 20
Even if it is left for a long time, the coercive force does not decrease by 7 rad per rotation angle. Similar results were obtained for samples prepared using sputtering targets having compositions of sample numbers 2 to 8. From this, it can be seen that creating a magnetic thin film using a Subatari/Goo target with a low carbon concentration is effective in improving the magnetic properties and long-term reliability of the magnetic properties.
(実施例2)
案内溝付きのポリカーボネイト基板に、第−保FJ、層
トして窒化アルミニウムと窒化ケイ素の混合物を110
0nの膜厚に形成し、連続して試料番号1の組成で炭素
濃度が重量比で1100PP。(Example 2) A mixture of aluminum nitride and silicon nitride was layered on a polycarbonate substrate with guide grooves to form a layer of 110% of aluminum nitride and silicon nitride.
The film was formed to a thickness of 0 nm, and the carbon concentration was 1100 PP by weight with the composition of sample number 1.
200PPM及び800PPMのターゲット、比較例と
して、試料番号9の組成の焼結ターゲット(炭素濃度5
000PPM)4種類をスパッタリングすることにより
光磁気記録層を40nmの膜厚で形成し、前記光磁気記
録層上に第二保護層として第一保護層と同一組成のもの
を1100nの膜厚に形成して4種類の光磁気記録媒体
を作製した。4種類の記録媒体を60℃、RH90%、
の恒温恒湿槽内に放置して耐候性試験を行い、第二図は
4N類の記録媒体のファラデ一方式による再生信号のC
N比の経時変化を示す。尚、線速4゜7m/s1記録周
波数I M Hz 、分解能帯域30KHzの条件にて
評価を行った。Targets of 200 PPM and 800 PPM; as a comparative example, a sintered target with the composition of sample number 9 (carbon concentration 5
A magneto-optical recording layer is formed with a thickness of 40 nm by sputtering four types (000 PPM), and a second protective layer having the same composition as the first protective layer is formed on the magneto-optical recording layer with a thickness of 1100 nm. Four types of magneto-optical recording media were manufactured using this method. 4 types of recording media at 60℃, RH90%,
A weather resistance test was conducted by leaving it in a constant temperature and humidity chamber. Figure 2 shows the C
It shows the change in N ratio over time. The evaluation was performed under the conditions of a linear velocity of 4°7 m/s1, a recording frequency of I MHz, and a resolution band of 30 KHz.
第二図から明らかなように、同一組成の記録媒体を比較
すると炭素含Ir量が少ないターゲットをスパッタリン
グすることにより作製した記録媒体の方がより高いCN
比を示し、また長期間に渡ってCN比の低下が少ない。As is clear from Figure 2, when comparing recording media with the same composition, the recording medium produced by sputtering a target with a lower carbon content has a higher CN content.
CN ratio, and the decrease in CN ratio is small over a long period of time.
炭素含有量の多い焼結ターゲットをスパッタリングする
ことにより作成した記録媒体は、作成直後のCN比は試
料番号1の組成の炭素濃度が重量比で1100PPのタ
ーゲットをスパッタリングすることにより作製した記録
媒体のCN比とほぼ同一であるが、CN比の劣化速度は
4!Ol類の記録媒体の中で最も大きな値である。試料
番号2〜8の組成のターゲットにより作成した試料につ
いても試料番号1と同様な結果が得られた。A recording medium created by sputtering a sintered target with a high carbon content has a CN ratio immediately after creation of a recording medium created by sputtering a target having the composition of sample number 1 with a carbon concentration of 1100 PP by weight. Although it is almost the same as the CN ratio, the deterioration rate of the CN ratio is 4! This is the largest value among the Ol class recording media. Results similar to those of sample number 1 were obtained for samples prepared using targets having the compositions of sample numbers 2 to 8.
以上のことから、ターゲット中の炭素含9rf!kをで
きる限り低く抑えることにより長期信頼性の向上に効柔
かあることがわかる。From the above, the carbon content in the target is 9rf! It can be seen that keeping k as low as possible is effective in improving long-term reliability.
以上のべたように本発明によれば、重希土類金属及び遷
移金属を主たる成分とする磁性薄膜の特性を引き出すこ
とが可能で、また長期信頼性を向上させるという効果を
有する。As described above, according to the present invention, it is possible to bring out the characteristics of a magnetic thin film whose main components are heavy rare earth metals and transition metals, and it has the effect of improving long-term reliability.
第1図(a)、(b)、(c)は、そ住ぞれ試料番号1
の組成で炭素濃度が重量比でtooppM、200PP
M及び800PPMのターゲットを、スパッタリングし
て形成直後の磁性膜の、ファラデー回転角の磁場依存性
を表す図。第1図、°(d)、(e)、(f)は、それ
ぞれ試料番号1の組成で炭素濃度が重量比で1100P
P、200PPM及び800PPMのターゲットを、ス
パッタリングして形成した磁性膜を60℃、RH90%
の恒温恒湿槽内に20時間放置した後の磁性膜のファラ
デー回転角の磁場依存性を示す図。
第2図は、試料番号1の組成で炭素濃度が重量比で11
00PP、200PPM及び800PPMのターゲット
、及び試料番号9の組成の炭素濃度が重量比で5000
P P Mのターゲットをスパッタリングして、作製
した光磁気記録媒体を60’C1RH90%の恒温恒湿
槽内に放置した時のCN比の経時変化を表す図。尚・は
試料番号1の組成で炭素濃度が重量比で1100PP、
Oは試料番号1の組成で、炭素濃度が重量比で200P
PM1ムは試料番号1の組成で炭素濃度が重量比で80
0PPM、Xは試料番号9の組成で炭素濃度がffi量
比で5000PPMのターゲットをスパッタリングして
作製した光磁気記録媒体を表す。
・以 上
出願人 セイコーエプソン株式会社
情1図(2)
第1図(e−)
菩1図(C)
al圓ル]
)シ 1 図 (fンFigure 1 (a), (b), and (c) are sample number 1, respectively.
With the composition, the carbon concentration is tooppM and 200PP by weight.
FIG. 3 is a diagram showing the magnetic field dependence of the Faraday rotation angle of a magnetic film immediately after being formed by sputtering M and 800 PPM targets. Figure 1, °(d), (e), and (f) are the composition of sample number 1, and the carbon concentration is 1100P in weight ratio.
Magnetic films formed by sputtering P, 200PPM and 800PPM targets were heated at 60°C and RH90%.
FIG. 3 is a diagram showing the magnetic field dependence of the Faraday rotation angle of a magnetic film after being left in a constant temperature and humidity chamber for 20 hours. Figure 2 shows that the composition of sample number 1 has a carbon concentration of 11% by weight.
The carbon concentration of the targets of 00PP, 200PPM and 800PPM, and the composition of sample number 9 is 5000 by weight.
FIG. 3 is a diagram showing the change over time in the CN ratio when a magneto-optical recording medium prepared by sputtering a PPM target is left in a constant temperature and humidity chamber of 60'C1RH90%. In addition, the composition of sample number 1 has a carbon concentration of 1100PP by weight,
O has the composition of sample number 1, and the carbon concentration is 200P by weight.
PM1mu has the composition of sample number 1 and the carbon concentration is 80% by weight.
0 PPM, X represents a magneto-optical recording medium manufactured by sputtering a target having the composition of Sample No. 9 and a carbon concentration of 5000 PPM in ffi amount ratio.・Applicant Seiko Epson Co., Ltd. Figure 1 (2) Figure 1 (e-) Figure 1 (C) al-en]) Figure 1 (f-n)
Claims (1)
金属を主たる成分とする磁性薄膜を作成する際に用いる
スパッタリング・ターゲットにおいて、炭素含有量が重
量比で200PPM以下であることを特徴とするスパッ
タリング・ターゲット。 (2)前記スパッタリング・ターゲットの組成を、原子
比で {(LR)_X(HR)_1_−_X}_YA_1_0
_0_−_Yと表すとき(但し、LRは軽希土類金属C
e、Pr、Nd、Smのうち1種類以上、HRは重希土
類金属Gd、Tb、Dyのうち1種類以上、AはFe、
Coのうちの、いずれかを必ず含む(LR)、(HR)
以外の元表を表す)、X、Yが各々、 0.05≦X≦0.60 15≦Y≦40 の範囲にあることを特徴とする特許請求の範囲第1項記
載のスパッタリング・ターゲット。[Claims] (1) (In a sputtering target used when creating a magnetic thin film containing heavy rare earth metals and transition metals as main components by sputtering method, the carbon content is 200 PPM or less by weight ratio. Characteristic sputtering target. (2) The composition of the sputtering target is {(LR)_X(HR)_1_-_X}_YA_1_0 in atomic ratio.
When expressed as _0_-_Y (however, LR is light rare earth metal C
e, Pr, Nd, and Sm, HR is one or more of the heavy rare earth metals Gd, Tb, and Dy, A is Fe,
Must include one of Co (LR), (HR)
The sputtering target according to claim 1, wherein X and Y are in the following ranges: 0.05≦X≦0.60 and 15≦Y≦40.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26318387A JPH01105518A (en) | 1987-10-19 | 1987-10-19 | Sputtering target |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26318387A JPH01105518A (en) | 1987-10-19 | 1987-10-19 | Sputtering target |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01105518A true JPH01105518A (en) | 1989-04-24 |
Family
ID=17385922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26318387A Pending JPH01105518A (en) | 1987-10-19 | 1987-10-19 | Sputtering target |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01105518A (en) |
-
1987
- 1987-10-19 JP JP26318387A patent/JPH01105518A/en active Pending
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