JPH01105483A - Socket for wiring substrate - Google Patents

Socket for wiring substrate

Info

Publication number
JPH01105483A
JPH01105483A JP26082587A JP26082587A JPH01105483A JP H01105483 A JPH01105483 A JP H01105483A JP 26082587 A JP26082587 A JP 26082587A JP 26082587 A JP26082587 A JP 26082587A JP H01105483 A JPH01105483 A JP H01105483A
Authority
JP
Japan
Prior art keywords
contact
measured
substrate
board
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26082587A
Other languages
Japanese (ja)
Inventor
Takao Ishibashi
石橋 隆雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP26082587A priority Critical patent/JPH01105483A/en
Publication of JPH01105483A publication Critical patent/JPH01105483A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To allow the connection with high density to the optional position on a wiring substrate by providing a socket structure using the flexible wiring substrate as a connecting means to a wiring substrate to be measured. CONSTITUTION:A substrate to be measured is placed in coincidence with a substrate positioning frame 8 in a pedestal insulating body 2, an upper cover insulating body 1 is pressed from above so that a reference hole 16 matches with a reference pin 17 in the pedestal insulating body 2, and the upper cover is fixed to the pedestal with hanging claw components 15. At this time, a contact land 4 and a contact piece 7 on a flexible substrate 3 are brought into contact with the portions necessary for the probing contact on the substrate to be measured and connected to an external inspecting device via an external lead terminal. Connection can be made with high density to the optional position on the substrate to be measured regardless of its size.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、配線基板用ソケットに関し、特に混成集積回
路装置等に用いられる高密度配線基板の検査用ソケット
に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a socket for wiring boards, and more particularly to a socket for testing high-density wiring boards used in hybrid integrated circuit devices and the like.

〔従来の技術〕[Conventional technology]

従来、混成集積回路装置等に用いられる高密度配線基板
を検査する場合において、所要の検査装置との接続手段
としては、第7図に示したように先端を数10〜数10
0μmφにまで加工したタングステジ等を素材とした探
針20をプリント配線基板19上に探針固定台21によ
り固定したプローブカードと呼ばれるものを用いる方式
と、第8図に示したように内部にバネ機構を有した接触
子7をアクリル板等を素材とした絶縁基板22上に貫通
固定し、この接触子7に配線23を接続した治具を製作
し用いる方式とが使用されている。
Conventionally, when inspecting a high-density wiring board used in a hybrid integrated circuit device, etc., the connection means with the required inspection equipment is as shown in FIG.
One method uses what is called a probe card, in which a probe 20 made of a material such as a tongue stage processed to a diameter of 0 μm is fixed on a printed wiring board 19 with a probe fixing base 21, and the other uses a probe card with a spring inside as shown in FIG. A method is used in which a contactor 7 having a mechanism is fixed through an insulating substrate 22 made of an acrylic plate or the like, and a jig is manufactured and used in which a wiring 23 is connected to the contactor 7.

いずれも、載物台24上の被測定基板5の特性を測定す
る。
In both cases, the characteristics of the substrate to be measured 5 on the stage 24 are measured.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の接続手段では、まず前者の方式の場合、
測定の信頼性面から当接部位への針圧を一定にする必要
があり、プリント配線基板上の探針固定位置から探針先
端までの長され一定に保たなければならないため、被測
定基板の周辺付近に対しては高精度かつ高密度にブロー
ビング可能であるが、配線基板が大きくなればなるほど
中心部任意位置へのブロービングが不可能になるという
欠点を有している。
In the conventional connection means mentioned above, first of all, in the case of the former method,
In terms of measurement reliability, it is necessary to keep the stylus pressure on the contact area constant, and the length from the probe fixing position on the printed wiring board to the tip of the probe must be kept constant. Although it is possible to perform blowing with high precision and high density near the periphery of the wiring board, it has the disadvantage that as the wiring board becomes larger, it becomes impossible to blow into any arbitrary position in the center.

また、後者の方式の場合には、構造上接触子内部にバネ
機構を有しているため、被測定基板の大きさに関係なく
任意位置へのブロービングが可能であるが、反面構造上
接触子自身を細くする事に限界があり、また隣合う接触
子同士の絶縁を確保するために一定の距離を置いて配置
しなければならず、従って高密度化された配線基板への
使用に限界があるという欠点を有している。
In addition, in the case of the latter method, since the structure has a spring mechanism inside the contact, it is possible to blow to any position regardless of the size of the board to be measured. There is a limit to how thin the contacts themselves can be, and adjacent contacts must be placed a certain distance apart to ensure insulation, which limits their use in high-density wiring boards. It has the disadvantage that there is

また、両者の方式においては、別に配線基板の位置決め
機構が必要な事から全体の規模が大きくなり所要経費が
高いこと、評価を行う場合に一度に多量の配線基板を容
易にかつコンパクトに接続する必要があること等からソ
ケット方式の実現が強く要望されていた。
In addition, both methods require a separate wiring board positioning mechanism, which increases the overall scale and costs, and when evaluating, it is difficult to easily and compactly connect a large number of wiring boards at once. There was a strong desire to implement a socket method due to the necessity.

〔発明の従来技術に対する相違点〕[Differences between the invention and the prior art]

上述した従来の接続手段に対し、本発明は、被測定配線
基板への接続手段としてフレキシブル配線基板を用いた
ソケット構造としたもので、ソケット上蓋部に取り付け
たフレキシブル配線基板上、被測定配線基板の所要探針
当接部位に対応した位置に当接用ランドを設ける事によ
り、当該配線基板の任意位置に高密度のブロービングを
可能としたものである。また、外部測定装置への配線接
続については、被測定基板領域の外側部に設けたフレキ
シブル配線基板上の外部配線引出しランドに対して、基
板用ソケット台座部に設けた外部リード端子兼用の接触
子により当接を行うことで容易に可能とし、従って、被
測定基板の大きさに関係なく配線基板の任意位置へ高密
度に接続が可能となる構成を有している。
In contrast to the conventional connection means described above, the present invention has a socket structure using a flexible wiring board as a connection means to the wiring board to be measured. By providing an abutment land at a position corresponding to the required probe abutment area, high-density probing can be performed at any position on the wiring board. In addition, for wiring connections to external measurement equipment, a contact terminal that also serves as an external lead terminal provided on the board socket pedestal is attached to the external wiring draw-out land on the flexible wiring board provided on the outside of the measured board area. This is easily possible by making contact with the wiring board, and therefore, it has a configuration that allows high-density connection to any position on the wiring board regardless of the size of the board to be measured.

〔問題点を解決する手段〕[Means to solve problems]

本発明の配線基板用ソケットは、ソケット上蓋部として
、被測定基板上面部の探針接触の必要な部位に対応して
当接用ランドを形成し、かつ当接用ランドから被測定基
板領域の外側部に設けた外部配線引出し部まではパター
ン配線を施したフレキシブル配線基板が所定の位置に位
置決めされて取り付けられており、ソケット台座部とし
て、被測定基板の収納位置決め部を有し、また少なくと
も前記フレキシブル配線基板上の外部配線引出し部に対
応した位置に当接を行なう接触子が嵌挿され、その脚部
をソケット台座部下部より突出させて外部リード端子と
し、また、ソケットの上蓋部と台座部は互いに嵌合しあ
う位置決め部を共有する構造を有している。
The socket for a wiring board of the present invention has a contact land formed as the socket upper lid portion corresponding to a portion of the upper surface of the board to be measured where the probe contacts, and a contact land that extends from the contact land to the area of the board to be measured. A flexible wiring board with patterned wiring is positioned and attached at a predetermined position up to the external wiring draw-out part provided on the outer side, and has a storage positioning part for the board to be measured as a socket pedestal part, and at least A contact that makes contact is inserted into a position corresponding to the external wiring draw-out part on the flexible wiring board, and its leg part protrudes from the lower part of the socket pedestal part to serve as an external lead terminal. The base portions have a structure in which they share positioning portions that fit into each other.

〔実施例1〕 次に、本発明について図面を参照して説明する。[Example 1] Next, the present invention will be explained with reference to the drawings.

第1図(a)は本発明の実施例1の上蓋部の平面図であ
り、第1図(b)は台座部の平面図である。
FIG. 1(a) is a plan view of the upper lid portion of Example 1 of the present invention, and FIG. 1(b) is a plan view of the pedestal portion.

第2図は、本実施例1の組合せ時の縦断面図である。ま
た第3図は、本実施例に使用するフレキシブル配線基板
の断面図である。
FIG. 2 is a longitudinal cross-sectional view of the combination of the first embodiment. Moreover, FIG. 3 is a sectional view of the flexible wiring board used in this example.

5一 実施例1において、上蓋部絶縁基体1には、所定の位置
に位置決めされたフレキシブル配線基板3が固定され、
被測定基板5との当接領域9には絶縁基体1との間にゴ
ムマット等の緩衝材6が付けられている。また、フレキ
シブル配線基板3はポリイミドフィルム等のフレキシブ
ル基板10上に、被測定基板5への探針接触の必要部位
に対応して金バンプ等の当接用ランド4を設け、かつ当
接用ランド4から外部配線引出しランド12まで導体パ
ターン配線11を行って、その外側に当接用ランド部分
を除いて絶縁膜13を形成した構造としている。
51 In Embodiment 1, the flexible wiring board 3 positioned at a predetermined position is fixed to the upper lid insulating base 1,
A cushioning material 6 such as a rubber mat is attached to the contact area 9 with the substrate to be measured 5 and the insulating base 1 . In addition, the flexible wiring board 3 has contact lands 4 such as gold bumps provided on a flexible board 10 made of polyimide film or the like, corresponding to the necessary areas for the probe to contact the substrate 5 to be measured, and contact lands 4 such as gold bumps. 4 to an external wiring lead-out land 12, and an insulating film 13 is formed on the outside except for the contact land portion.

台座部絶縁基体2には、被測定基板5の収納位置決め枠
8を有し、また被測定基板5下面部の探針接触の必要部
位に対応して当接を行う接触子7及び、上蓋部絶縁基体
上のフレキシブル配線基板3上の外部配線引出しランド
12に対応して当接を行う接触子7が嵌挿されその脚部
が絶縁基体下部から突出して外部リード端子となってい
る。接触子7は、バネ構造となっている。また、台座部
絶縁基体2には上蓋部絶縁基体1を装着固定する鉤爪部
品15が取り付けられ、台座部絶縁基体2と上蓋部絶縁
基体1にはそれぞれ勘合し合う基準ピン17と基準穴1
6が設けられている。
The pedestal insulating base 2 has a storage and positioning frame 8 for the substrate to be measured 5, and a contactor 7 that makes contact with the required probe contact area on the lower surface of the substrate to be measured 5, and an upper lid portion. A contact 7 is fitted and brought into contact with an external wiring draw-out land 12 on a flexible wiring board 3 on an insulating base, and its legs protrude from the lower part of the insulating base to serve as an external lead terminal. The contact 7 has a spring structure. Further, a claw part 15 for mounting and fixing the upper lid insulating base 1 is attached to the pedestal insulating base 2, and a reference pin 17 and a reference hole 1 are fitted to the pedestal insulating base 2 and the upper lid insulating base 1, respectively.
6 is provided.

このような構造を有する基板用ソケットにおいて操作を
説明すると、まず被測定基板5を台座部絶縁基体2中の
基板位置決め枠8に合わせて置き、次に上蓋部絶縁基体
1を基準穴16が台座部絶縁基体2中の基準ピン17に
勘合するように上から押さえ、鉤爪部品15で上蓋部を
台座部に固定するものである。この時、フレキシブル基
板上の当接用ランド及び接触子は被測定基板上の探針接
触必要部位に対して当接が行われ、外部リード端子を経
由して外部検査装置と接続される事になる。
To explain the operation of a board socket having such a structure, first place the board 5 to be measured so that it aligns with the board positioning frame 8 in the insulating base 2 of the pedestal, and then place the insulating base 1 of the upper lid part so that the reference hole 16 is aligned with the pedestal. The upper lid part is held down from above so as to fit into the reference pin 17 in the insulating base 2, and the upper lid part is fixed to the pedestal part with the claw parts 15. At this time, the contact lands and contacts on the flexible board are brought into contact with the parts of the board to be measured that require probe contact, and are connected to the external inspection equipment via the external lead terminals. Become.

また、第3図においては導体配線パターン11をフレキ
シブル基板100片面だけについて使用しているが、本
発明の主旨から第4図に示したようにフレキシブル基板
にスルーホールを設け、フレキシブル基板の両面を導体
配線パターンに使用しても良く、更には多層構造として
も良い。
Furthermore, in FIG. 3, the conductive wiring pattern 11 is used on only one side of the flexible substrate 100, but in view of the spirit of the present invention, through holes are provided in the flexible substrate as shown in FIG. It may be used as a conductor wiring pattern, or even as a multilayer structure.

〔実施例2〕 第5図は本発明の実施例2の平面図であり、第6図は本
実施例2の組合せ時の縦断面図である。
[Embodiment 2] FIG. 5 is a plan view of Embodiment 2 of the present invention, and FIG. 6 is a longitudinal cross-sectional view of the combination of Embodiment 2.

実施例2においては、上蓋部絶縁基体1と台座部絶縁基
体2の個々の構造は同一であるが、上蓋部と台座部は一
端で、回転軸を共有する連結軸18で結合されている構
造となっている。
In the second embodiment, the individual structures of the upper lid insulating base 1 and the pedestal insulating base 2 are the same, but the upper lid and the pedestal are connected at one end by a connecting shaft 18 that shares a rotation axis. It becomes.

このような構造を有する基板用ソケットにおいて操作を
説明すると、まず被測定基板5を台座部絶縁基体2中の
基板位置決め枠8に合わせて置き、次に連結軸で結合さ
れた上蓋絶縁基体1を回転させ、基準穴16が台座部絶
縁基体2中の基準ピン17に勘合するように上から押さ
え、鉤爪部品15で上蓋部を台座部に固定する。この時
フレキシブル基板上の当接用ランド及び接触子は被測定
基板上の探針接触必要部位に対して当接が行われ、外部
リード端子を経由して外部検査装置と接続される事にな
る。この実施例では、上蓋部と台座部とが連結されてい
るため、1つのソケットとして扱いやすいという利点が
ある。
To explain the operation of a board socket having such a structure, first, place the board to be measured 5 in alignment with the board positioning frame 8 in the pedestal part insulating base 2, and then place the top cover insulating base 1 connected with the connecting shaft. Rotate and press from above so that the reference hole 16 fits into the reference pin 17 in the insulating base 2 of the pedestal part, and fix the upper lid part to the pedestal part with the claw parts 15. At this time, the contact lands and contacts on the flexible board are brought into contact with the areas on the board to be measured where the probe needs to be contacted, and are connected to external inspection equipment via external lead terminals. . In this embodiment, since the upper lid part and the base part are connected, there is an advantage that it is easy to handle as one socket.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、基板用ソケットとして上
蓋部に被測定基板の所要探針当接部位に対応した位置に
当接用ランドを設けたフレキシブル配線基板を取り付け
、台座部にはフレキシブル配線基板上の外部配線引出し
部に対応した位置に外部リード端子兼用の接触子を設け
た構造とした事により、被測定基板の大きさに関係なく
、容易に、コンパクトな構造で、測定基板の任意位置に
対して高密度に接続が可能になるという効果がある。
As explained above, in the present invention, as a socket for a board, a flexible wiring board is attached to the upper lid part, and a contact land is provided at a position corresponding to the required probe contact area of the board to be measured, and a flexible wiring board is attached to the pedestal part. The structure has a contact that also serves as an external lead terminal at a position corresponding to the external wiring drawer on the board, making it easy to use any measurement board regardless of the size of the board to be measured. This has the effect of enabling high-density connections depending on the location.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)は、本発明の実施例1の上蓋部の平面図で
ある。第1図(b)は、本発明の実施例10台座部の平
面図である。第2図は、本実施例1の組合せ時の縦断面
図である。第3図は、第1図(a)のフレキシブル配線
基板の断面図である。第4図は、フレキシブル配線基板
の他の実施例の断面図である。第5図は、本発明の実施
例2の平面図である。第6図は、本実施例2の組合せ時
の縦断面図である。第7図及び第8図は、それぞれ従来
の実施例の構造図である。 l・・・・・・上蓋部絶縁基体、2・・・・・・台座部
絶縁基体、3・・・・・・フレキシブル配線基板、4・
・・・・・当接用ランド、5・・・・・・被測定基板、
6・・・・・・緩衝材、7・・・・・・接触子、8・・
・・・一基板位置決め枠、9・・・・・・当接領域、1
0・・・・・・フレキシブル基板、11・・・・・・導
体パターン配線、12・・・・・・外部配線引出しラン
ド、13・・・・・・絶縁膜、14・・・・・・スルー
ホール、15・・・・・・鉤爪部品、16・・・・・・
基準穴、17・・・・・・基準ピン、18・・・・・・
連結軸、19・・・・・・プリント配線基板、20・・
・・・・探針、21・・・・・・探針固定台、22・・
・・・・絶縁基板、23・・・・・・配線、24・・・
・・・載物台。 代理人 弁理士  内 原   晋 勺 \    N1
FIG. 1(a) is a plan view of the upper lid portion of Embodiment 1 of the present invention. FIG. 1(b) is a plan view of a pedestal portion according to a tenth embodiment of the present invention. FIG. 2 is a longitudinal cross-sectional view of the combination of the first embodiment. FIG. 3 is a sectional view of the flexible wiring board shown in FIG. 1(a). FIG. 4 is a sectional view of another embodiment of the flexible wiring board. FIG. 5 is a plan view of Embodiment 2 of the present invention. FIG. 6 is a vertical cross-sectional view of the combination of the second embodiment. 7 and 8 are structural diagrams of conventional embodiments, respectively. l...Top lid insulating base, 2...Pedestal insulating base, 3...Flexible wiring board, 4.
.... Land for contact, 5 .... Board to be measured,
6...Buffer material, 7...Contact, 8...
... One board positioning frame, 9... Contact area, 1
0... Flexible board, 11... Conductor pattern wiring, 12... External wiring extraction land, 13... Insulating film, 14... Through hole, 15...Claw parts, 16...
Reference hole, 17...Reference pin, 18...
Connection shaft, 19...Printed wiring board, 20...
...Probe, 21...Probe fixing base, 22...
...Insulating board, 23...Wiring, 24...
... Loading table. Agent Patent Attorney Shinsuke Uchihara\ N1

Claims (1)

【特許請求の範囲】[Claims] 第1の絶縁基体には、被測定基板上面部の探針接触の必
要な部位に対応して当接用ランドを形成し、かつ該当接
用ランドから被測定基板領域の外側部に設けた外部配線
引出し部まではパターン配線を施したフレキシブル配線
基板が所定の位置に取り付けられており、第2の絶縁基
体には、被測定基板の収納位置決め部を有し、また少な
くとも前記フレキシブル配線基板上の外部配線引出し部
に対応した位置に、当接を行う接触子が嵌挿されており
、かつ前記第1の絶縁基体と前記第2の絶縁基体は、互
いに嵌合しあう位置決め部を共有する事を特徴とする配
線基板用ソケット。
A contact land is formed on the first insulating base corresponding to the part of the top surface of the substrate to be measured that requires probe contact, and an external contact land is formed from the contact land to the outside of the area of the substrate to be measured. A flexible wiring board with patterned wiring is attached to a predetermined position up to the wiring draw-out part, and the second insulating base has a storage positioning part for the board to be measured, and at least the part on the flexible wiring board A contact that makes contact is inserted into a position corresponding to the external wiring draw-out part, and the first insulating base and the second insulating base share a positioning part that fits into each other. A wiring board socket featuring:
JP26082587A 1987-10-16 1987-10-16 Socket for wiring substrate Pending JPH01105483A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26082587A JPH01105483A (en) 1987-10-16 1987-10-16 Socket for wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26082587A JPH01105483A (en) 1987-10-16 1987-10-16 Socket for wiring substrate

Publications (1)

Publication Number Publication Date
JPH01105483A true JPH01105483A (en) 1989-04-21

Family

ID=17353281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26082587A Pending JPH01105483A (en) 1987-10-16 1987-10-16 Socket for wiring substrate

Country Status (1)

Country Link
JP (1) JPH01105483A (en)

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