JPH01105070U - - Google Patents
Info
- Publication number
- JPH01105070U JPH01105070U JP57988U JP57988U JPH01105070U JP H01105070 U JPH01105070 U JP H01105070U JP 57988 U JP57988 U JP 57988U JP 57988 U JP57988 U JP 57988U JP H01105070 U JPH01105070 U JP H01105070U
- Authority
- JP
- Japan
- Prior art keywords
- molten solder
- pump
- jet soldering
- soldering bath
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57988U JPH0421644Y2 (is) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57988U JPH0421644Y2 (is) | 1988-01-08 | 1988-01-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01105070U true JPH01105070U (is) | 1989-07-14 |
| JPH0421644Y2 JPH0421644Y2 (is) | 1992-05-18 |
Family
ID=31199736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57988U Expired JPH0421644Y2 (is) | 1988-01-08 | 1988-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0421644Y2 (is) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6313423B2 (ja) | 2014-02-28 | 2018-04-18 | 株式会社Ｆｕｊｉ | 粘性流体付着装置 |
-
1988
- 1988-01-08 JP JP57988U patent/JPH0421644Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0421644Y2 (is) | 1992-05-18 |
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