JPH01104771U - - Google Patents
Info
- Publication number
- JPH01104771U JPH01104771U JP20008887U JP20008887U JPH01104771U JP H01104771 U JPH01104771 U JP H01104771U JP 20008887 U JP20008887 U JP 20008887U JP 20008887 U JP20008887 U JP 20008887U JP H01104771 U JPH01104771 U JP H01104771U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- clearance
- circuit board
- printed circuit
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20008887U JPH01104771U (enExample) | 1987-12-30 | 1987-12-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20008887U JPH01104771U (enExample) | 1987-12-30 | 1987-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104771U true JPH01104771U (enExample) | 1989-07-14 |
Family
ID=31490513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20008887U Pending JPH01104771U (enExample) | 1987-12-30 | 1987-12-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104771U (enExample) |
-
1987
- 1987-12-30 JP JP20008887U patent/JPH01104771U/ja active Pending