JPH01104714U - - Google Patents
Info
- Publication number
- JPH01104714U JPH01104714U JP20104087U JP20104087U JPH01104714U JP H01104714 U JPH01104714 U JP H01104714U JP 20104087 U JP20104087 U JP 20104087U JP 20104087 U JP20104087 U JP 20104087U JP H01104714 U JPH01104714 U JP H01104714U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- solder
- utility
- model registration
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20104087U JPH01104714U (id) | 1987-12-29 | 1987-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20104087U JPH01104714U (id) | 1987-12-29 | 1987-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104714U true JPH01104714U (id) | 1989-07-14 |
Family
ID=31491420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20104087U Pending JPH01104714U (id) | 1987-12-29 | 1987-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104714U (id) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074596A (ja) * | 1983-09-30 | 1985-04-26 | 富士通株式会社 | 電子部品搭載基板の製造方法 |
-
1987
- 1987-12-29 JP JP20104087U patent/JPH01104714U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074596A (ja) * | 1983-09-30 | 1985-04-26 | 富士通株式会社 | 電子部品搭載基板の製造方法 |