JPH01104044U - - Google Patents

Info

Publication number

JPH01104044U

JPH01104044U JP19786587U JP19786587U JPH01104044U JP H01104044 U JPH01104044 U JP H01104044U JP 19786587 U JP19786587 U JP 19786587U JP 19786587 U JP19786587 U JP 19786587U JP H01104044 U JPH01104044 U JP H01104044U

Authority

JP

Japan

Prior art keywords

package

semiconductor device

external

external lead

lead

Prior art date

1987-12-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 5
• 238000005476 soldering Methods 0.000 claims description 2
• 230000015572 biosynthetic process Effects 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 claims 1
• 238000005452 bending Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1