JPH01102707U - - Google Patents

Info

Publication number
JPH01102707U
JPH01102707U JP19684587U JP19684587U JPH01102707U JP H01102707 U JPH01102707 U JP H01102707U JP 19684587 U JP19684587 U JP 19684587U JP 19684587 U JP19684587 U JP 19684587U JP H01102707 U JPH01102707 U JP H01102707U
Authority
JP
Japan
Prior art keywords
stamper
sensor
adjustment board
contact
fixing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19684587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19684587U priority Critical patent/JPH01102707U/ja
Publication of JPH01102707U publication Critical patent/JPH01102707U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1〜7図は本考案に係るスタンパセツト測定
装置の一実施例を示す図であり、第1図はそのス
タンパセツトの横断面図、第2図はそのセンサお
よびセンサ固定盤の平面図、第3図は第2図の
―矢視断面図、第4図はその全体構成を示す斜
視図、第5,6図はそれぞれそのセンサ固定盤を
ゼロ点調整盤およびスパン調整盤に当接させた状
態を示す断面図、第7図はそのスタンパの測定状
態を示す断面図、第8図は従来のスタンパセツト
測定装置を示すその要部断面図である。 10……スタンパセツト、11……スタンパケ
ース、11a……上面、11b……凹部、12…
…スタンパ、13……段差、16……センサ固定
盤、16a……下面、16b……凹部、17……
センサ、17a……突起端部、20……固定台、
21……ゼロ点調整盤、22……スパン調整盤、
23……コントローラ、24……パネルメータ、
25……セツト台、26a……当接面、28a…
…上面(段差面)、S……段差の寸法、So……
段差寸法(設定段差寸法)。
1 to 7 are diagrams showing an embodiment of the stamper set measuring device according to the present invention, in which FIG. 1 is a cross-sectional view of the stamper set, FIG. 2 is a plan view of the sensor and sensor fixing plate, and FIG. Figure 3 is a cross-sectional view taken in the direction of the - arrow in Figure 2, Figure 4 is a perspective view showing the overall configuration, and Figures 5 and 6 show the sensor fixing plate in contact with the zero point adjustment board and the span adjustment board, respectively. FIG. 7 is a cross-sectional view showing the stamper in a measuring state, and FIG. 8 is a cross-sectional view of a main part of a conventional stamper set measuring device. DESCRIPTION OF SYMBOLS 10...Stamper set, 11...Stamper case, 11a...Top surface, 11b...Recessed part, 12...
...Stamper, 13...Step, 16...Sensor fixing plate, 16a...Bottom surface, 16b...Recess, 17...
Sensor, 17a... Projection end, 20... Fixing base,
21...Zero point adjustment board, 22...Span adjustment board,
23...controller, 24...panel meter,
25... Setting table, 26a... Contact surface, 28a...
...Top surface (step surface), S...Dimensions of step, So...
Step dimension (set step dimension).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上面に凹部が形成されたスタンパケースと、ス
タンパケースの凹部に嵌装され、スタンパケース
の上面との間に段差が形成されるスタンパと、か
らなるスタンパセツトの前記段差の寸法を測定す
るスタンパセツト測定装置において、下面に凹部
が形成されたセンサ固定盤と、センサ固定盤に配
設され、センサ固定盤の凹部から突起する突起端
部を有する複数のセンサと、センサ固定盤の下面
が当接し、センサの突起端部を当接させてセンサ
を突起方向に位置決めさせるゼロ点調整盤と、セ
ンサ固定盤の下面が当接する当接面を有するとと
もに該当接面から前記スタンパセツトの段差の寸
法を設定する設定段差寸法をもつて形成された段
差面を有するスパン調整盤と、複数のセンサおよ
び該センサと同数のパネルメータがそれぞれ接続
され、各センサの突起端部がゼロ点調整盤に当接
して位置決めされたときおよびセンサ固定盤の下
面がスパン調整盤の当接面に当接してゼロ点調整
盤により位置決めされた各センサの突起端部が段
差面から設定段差寸法だけ離隔したときに各セン
サが出力する信号に基づいて各パネルメータが指
示する指示値をそれぞれ第1所定値および第2所
定値に設定するコントローラと、前記スタンパセ
ツトを載置するセツト台と、ゼロ点調整盤、スパ
ン調整盤、コントローラ、パネルメータおよびセ
ツト台を載置する固定台と、を設け、センサが位
置決めされたセンサ固定盤の下面をセツト台に載
置されたスタンパセツトのスタンパケースの上面
に当接し、各センサの突起端部をスタンパから離
隔させた状態で各パネルメータの指示値を測定し
、該指示値と第2所定値の差異からスタンパセツ
トの段差の寸法とスパン調整盤の設定段差寸法の
差異を測定するようにしたことを特徴とするスタ
ンパセツト測定装置。
A stamper set for measuring the dimension of the step of a stamper set comprising a stamper case having a recess formed on the upper surface, and a stamper fitted into the recess of the stamper case and having a step formed between the stamper case and the upper surface of the stamper case. In a measuring device, a sensor fixing plate with a recess formed on the lower surface, a plurality of sensors disposed on the sensor fixing plate and having protruding ends protruding from the recesses of the sensor fixing plate, and the lower surface of the sensor fixing plate are in contact with each other. , a zero point adjustment board that positions the sensor in the direction of the projection by bringing the protruding end of the sensor into contact; and a contact surface that the lower surface of the sensor fixing board contacts, and the size of the step of the stamper set is measured from the contact surface. A span adjustment board having a step surface formed with a set step dimension to be set is connected to a plurality of sensors and the same number of panel meters as the sensors, and the protruding end of each sensor is in contact with the zero point adjustment board. and when the lower surface of the sensor fixing plate contacts the contact surface of the span adjustment board and the protruding end of each sensor positioned by the zero point adjustment board is separated from the step surface by the set step dimension. A controller that sets the indicated values indicated by each panel meter to a first predetermined value and a second predetermined value based on the signals output by the sensors, a setting table on which the stamper set is placed, a zero point adjustment board, and a span. A fixing base on which an adjustment board, a controller, a panel meter, and a setting base are placed is provided, and the bottom surface of the sensor fixing board on which the sensor is positioned is brought into contact with the top surface of the stamper case of the stamper set placed on the setting base, Measure the indicated value of each panel meter with the protruding end of each sensor separated from the stamper, and from the difference between the indicated value and the second predetermined value, determine the dimension of the step of the stamper set and the set step dimension of the span adjustment board. A stamp set measuring device characterized by being adapted to measure differences.
JP19684587U 1987-12-24 1987-12-24 Pending JPH01102707U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19684587U JPH01102707U (en) 1987-12-24 1987-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19684587U JPH01102707U (en) 1987-12-24 1987-12-24

Publications (1)

Publication Number Publication Date
JPH01102707U true JPH01102707U (en) 1989-07-11

Family

ID=31487437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19684587U Pending JPH01102707U (en) 1987-12-24 1987-12-24

Country Status (1)

Country Link
JP (1) JPH01102707U (en)

Similar Documents

Publication Publication Date Title
JPH01102707U (en)
JPH0267209U (en)
JPS63148810U (en)
JPS6425704U (en)
JPH02609U (en)
JPH02663U (en)
JPS6161410U (en)
JPS6312773U (en)
JPS62150616U (en)
JPS61199601U (en)
JPS61193539U (en)
JPS6390107U (en)
JPS6161408U (en)
JPH0349809U (en)
JPS6390104U (en)
JPS625227U (en)
JPS63159832U (en)
JPS632172U (en)
JPH0325174U (en)
JPS61140902U (en)
JPS6455436U (en)
JPH0199063U (en)
JPS6320001U (en)
JPH01118306U (en)
JPS59187702U (en) Governing plate for measuring hole spacing