JPH01101109A - Method for forming relief pattern in ceramic - Google Patents
Method for forming relief pattern in ceramicInfo
- Publication number
- JPH01101109A JPH01101109A JP25988287A JP25988287A JPH01101109A JP H01101109 A JPH01101109 A JP H01101109A JP 25988287 A JP25988287 A JP 25988287A JP 25988287 A JP25988287 A JP 25988287A JP H01101109 A JPH01101109 A JP H01101109A
- Authority
- JP
- Japan
- Prior art keywords
- water
- pattern
- room temperature
- solid
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000000919 ceramic Substances 0.000 title claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000007787 solid Substances 0.000 claims abstract description 21
- 238000010304 firing Methods 0.000 claims abstract description 20
- 238000001035 drying Methods 0.000 claims abstract description 10
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 8
- 239000004744 fabric Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000002612 dispersion medium Substances 0.000 claims abstract description 3
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims description 11
- 238000010422 painting Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000001246 colloidal dispersion Methods 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 abstract description 10
- 229920000178 Acrylic resin Polymers 0.000 abstract description 10
- 239000005060 rubber Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 239000006185 dispersion Substances 0.000 abstract description 5
- 229920001228 polyisocyanate Polymers 0.000 abstract description 5
- 239000005056 polyisocyanate Substances 0.000 abstract description 5
- 244000043261 Hevea brasiliensis Species 0.000 abstract description 2
- 229920003052 natural elastomer Polymers 0.000 abstract description 2
- 229920001194 natural rubber Polymers 0.000 abstract description 2
- 229920002857 polybutadiene Polymers 0.000 abstract description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 abstract description 2
- 239000011368 organic material Substances 0.000 abstract 4
- 235000015895 biscuits Nutrition 0.000 abstract 2
- 239000000084 colloidal system Substances 0.000 abstract 2
- 229920006311 Urethane elastomer Polymers 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 229920001971 elastomer Polymers 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000002174 Styrene-butadiene Substances 0.000 description 4
- 239000004927 clay Substances 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methylcyclopentane Chemical compound CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- IJVRPNIWWODHHA-UHFFFAOYSA-N 2-cyanoprop-2-enoic acid Chemical class OC(=O)C(=C)C#N IJVRPNIWWODHHA-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 241001062872 Cleyera japonica Species 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229920001800 Shellac Polymers 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- LBFUKZWYPLNNJC-UHFFFAOYSA-N cobalt(ii,iii) oxide Chemical compound [Co]=O.O=[Co]O[Co]=O LBFUKZWYPLNNJC-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000006114 decarboxylation reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- -1 etc. Polymers 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 206010016256 fatigue Diseases 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、陶磁器の表面に容易に浮き彫り状の装飾模様
を形成する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for easily forming a raised decorative pattern on the surface of ceramics.
従来、陶磁器の装飾方法として、主として芸術的価値を
高めるために様々な方法が用いられてきた。例えば、本
焼き後に施す方法としては、上絵づけ(赤緑)による方
法がある。素焼き後に施す方法としては、絵づけによる
方法及び榊薬による方法がある。また、素焼きまでに施
す方法としては、表面に模様を刻む方法、化粧泥を使う
方法、及び象嵌が挙′げられる。さらに詳しく説明する
と、表面に模様を刻む方法としては、は〕つけ、たたき
、ひつかき、削シ、押し等の方法が用いられている。t
た、化粧泥を使う方法としては、浸しかけ、ひしやくか
け、流しかけ、刷りかけ、たたきかけ、イツチン、かき
落とし、とびがんな、三島手、型紙、指かき、墨流し等
が用いられている。Conventionally, various methods have been used to decorate ceramics, mainly to enhance their artistic value. For example, one method of applying it after final firing is overglazing (red and green). There are two methods of applying after bisque firing: painting and sakaki medicine. In addition, methods for applying the material before bisque firing include carving a pattern on the surface, using decorative mud, and inlaying. To explain in more detail, methods such as plating, pounding, hitting, carving, and pressing are used to carve patterns on the surface. t
In addition, the methods of using makeup mud include dipping, hishiyakukake, nagashikake, brushing, takikake, ittsuchin, kakiochi, tobiganna, mishimate, stencil, fingerpicking, and suminagashi. .
このように、陶磁器の表面には種々の方法にょ〕様々な
模様が施されている(参考図書二江ロ基著「陶芸入門」
大冊出版、1973年)。In this way, various patterns are applied to the surface of ceramics using various methods.
Ohsho Publishing, 1973).
ところで、素焼き前に陶磁器の表面に浮き彫)の模様を
施す方法としては、一般にはシつけ、削〕、mおこしに
よる方法が用いられる。侍にPA〕Kついては、古来中
国で唐草模様などの施されたものが数多く創られている
。また、現在では、素焼き前あるいは素焼き後の陶磁器
の表面に型ど〕し光ゴム板等をはシつけ念り、ゴムラテ
ックス等で模様を描いた後、その周囲をサンドブラスト
5によシ削りとる方法も工場規模で行われている。しか
しながら、はシつけ又は削〕による方法は手間がかが力
、大量生産できないばか〕でなく、熟練者を必要とする
方法である。屋おとしくよる方法は、模様毎に型を造ら
ねばならず、決して容易な方法とはいえない。また、サ
ンドブラストによる方法は、大規模な装置を必要とする
ため、経済的であるとはいえない。さらに、個人が趣味
の陶芸として楽しむ場合にも適していない。本発明は、
このような点に鑑み、熟練者を必要とせずに容易に陶磁
器の表面に浮き彫り状の装飾模様を形成する方法を提供
しようと企図するものである。By the way, as a method for applying relief patterns on the surface of ceramics before unglazing, methods such as shitsutsuke, shaving, and mokoshi are generally used. As for Samurai PA]K, many items with arabesque patterns have been created in China since ancient times. In addition, at present, it is customary to place a mold on the surface of ceramics before or after unglazing, attaching a light rubber plate, etc., and after drawing a pattern with rubber latex, etc., the surrounding area is removed using sandblasting. The method is also carried out on a factory scale. However, the method of chipping or scraping is time-consuming and cannot be mass-produced, and requires a skilled person. The Yaotoshi method requires making a mold for each pattern, and is by no means an easy method. Furthermore, the sandblasting method requires large-scale equipment and is therefore not economical. Furthermore, it is not suitable for individuals to enjoy pottery as a hobby. The present invention
In view of these points, it is an object of the present invention to provide a method for easily forming a relief-like decorative pattern on the surface of ceramics without requiring a skilled person.
即ち、本発明は、素焼き前の陶磁器の表面に、水に不溶
で且つ常温で固体の有機物質あるいは常温で液体でも水
分等と反応することによ〕水に不溶の固体に変化しうる
有機物質等を有機溶剤に溶解し光溶液、又は水、有機溶
剤を分散媒とするコロイド分散液で文字、図形等適当な
模様を描き、乾燥固化しな後、湿らせ光布あるいは刷毛
等を用いて模様の周囲を水で洗い落とすことにより表面
に浮き彫〕模様を形成するというものである。本発明の
中で述べる常温で固体の有機物質としては、アクリル樹
脂、メタクリル樹脂、ウレタン樹脂、ポリエステル樹脂
、スチレン樹脂、ビニル樹脂【(酢酸ビニル、塩化ビニ
ル、ビニルアルコール等入アミド樹脂、固形エポキシ樹
脂、フェノール樹脂、ロジン系樹脂、セルロース系樹脂
、天然樹脂(シェラツク等)、ポリオレフィン樹脂、シ
リコン樹脂等のような樹脂類、あるいは天然ゴム、ポリ
ブタジェンゴム、スチレン−ブタジェン共4 合体:l
’ムrsBFL)、ニトリルゴム(NBR)、ポリクロ
ロプレンゴム、ポリイソプレンゴム、エチレン−プロピ
レン共重合体ゴム(EPR) 、エチレン−プロピレン
−ジエン三元共重合体ゴム(DPI)M)、アクリルゴ
ム、ハイスチレンゴム、ブチルゴム(工IR)、クロル
スルホン化ポリエチレン、シリコンゴム、フッ素ゴム等
のようなゴム類の単独及びそれらの混合物あるいは共重
合物(グラフト、ブロックも含まれる)があげられる。That is, the present invention applies an organic substance that is insoluble in water and solid at room temperature, or an organic substance that is liquid at room temperature but can be transformed into a solid insoluble in water by reacting with moisture, etc. to the surface of ceramics before bisque firing. etc. in an organic solvent and draw appropriate patterns such as letters or figures with a photo solution or a colloidal dispersion using water or an organic solvent as a dispersion medium, and after drying and solidifying, use a moistened photo cloth or brush. By washing away the area around the pattern with water, an embossed pattern is formed on the surface. In the present invention, organic substances that are solid at room temperature include acrylic resins, methacrylic resins, urethane resins, polyester resins, styrene resins, vinyl resins (vinyl acetate, vinyl chloride, vinyl alcohol-containing amide resins, solid epoxy resins, etc.). , phenolic resin, rosin resin, cellulose resin, natural resin (shellac, etc.), polyolefin resin, silicone resin, etc., or natural rubber, polybutadiene rubber, styrene-butadiene combination 4.
'MrsBFL), nitrile rubber (NBR), polychloroprene rubber, polyisoprene rubber, ethylene-propylene copolymer rubber (EPR), ethylene-propylene-diene terpolymer rubber (DPI) M), acrylic rubber, Rubbers such as high styrene rubber, butyl rubber (Ko-IR), chlorosulfonated polyethylene, silicone rubber, fluororubber, etc. may be used alone, or mixtures or copolymers thereof (including grafts and blocks).
ここで有機物に限定した理由は、素焼きあるいは本焼き
の過程で酸化焼成により燃焼し、残渣としてあとに残ら
ないからである。しかし、金属イオンを含有したキレー
ト化合物や金属塩、金属酸化物を一部添加すると素焼き
あるいは本焼きの過程で浮き彫ル部分の着色という効果
も現われる。常温で液体でも水分等と反応すること和よ
り固体に変化しうる有機物質としては、瞬間接着剤の主
成分として知ら九ている2−シアノアクリル酸エステル
類及びポリイソシアネート類が代表的な化合物として挙
げられる。前者は、素焼き前の陶磁器中和含まれる水分
によシ重合を開始し、アニオン重合反応を経て固化する
。後者は、まずイソシアネート基が水分と反応して脱炭
酸反応を経てアミノ基とな〕、これが他の未反応イソシ
アネート基と反応して固化する。また、必ずしも水分と
反応するものでなくてもよい。例えば、液状エポキシ樹
脂とボリアきンの混合物の場合は、エポキシ基とアきノ
基との反応により固化する。このように、模様を描く際
には有機溶剤に溶解することにより適度の粘度にIII
整し、溶剤の揮発あるいは水分等との反応によシ固化し
、素焼き前の陶磁器を構成する粘土粒子を水に不溶化さ
せようというのが本発明のポイントになっている。即ち
模様輪郭よル外部の粘土は水で洗い落されるが模様附着
部分の粘土粒子は再分散しないので流出することなくメ
確な浮き彫)模様が成形出来る効果があるのである。The reason why we have limited to organic substances here is that they are burned by oxidation firing during the bisque firing or final firing process, and do not leave any residue behind. However, if some chelate compounds, metal salts, or metal oxides containing metal ions are added, the effect of coloring the embossed parts during bisque firing or final firing will appear. Typical examples of organic substances that can react with water, etc. even though they are liquid at room temperature and can turn into solids include 2-cyanoacrylic acid esters and polyisocyanates, which are known as the main components of instant adhesives. Can be mentioned. The former starts polymerization due to water contained in neutralized ceramics before bisque firing, and solidifies through an anionic polymerization reaction. In the latter, an isocyanate group first reacts with moisture and undergoes a decarboxylation reaction to become an amino group], which reacts with other unreacted isocyanate groups and solidifies. Moreover, it does not necessarily have to react with moisture. For example, in the case of a mixture of liquid epoxy resin and polyaquine, it is solidified by the reaction between the epoxy group and the amine group. In this way, when drawing a pattern, it can be dissolved in an organic solvent to maintain an appropriate viscosity.
The key point of the present invention is to solidify the clay particles by evaporation of the solvent or reaction with water, etc., to make the clay particles that make up the unglazed ceramics insoluble in water. In other words, the clay outside the pattern outline is washed away with water, but the clay particles in the area where the pattern is attached are not redispersed, so there is an effect that a precise relief pattern can be formed without flowing out.
また、本発明の中で述さる有機溶剤としては、ベンゼン
、トルエン、キシレンなどの芳香族系溶iL n−ペン
タン、n−ヘキサンなどの脂肪族系溶剤、メチルシクロ
ペンタン、シクロヘキサンなどの脂環族系溶剤、メタノ
ール、エタノール、イソプロパツール、n−ブタノール
などのアルコール系溶剤、アセトン、メチルエチルケト
ン、メチルイソブチルケトン、シクロヘキサノンなどの
ケトン系溶剤、ジエチルエーテル、テトラヒドロフラン
などのエーテル系溶剤、酢酸メチル、酢酸エチル、酢酸
イングロビル、酢酸ブチルなどのエステル系溶剤、メチ
レンクロライド、トリクロルエチレン、1.1、l−ト
リクロルエタン、テトラクロルエチレン、クロロホルム
、クロルベンゼン、四塩化炭素などのハロゲン含有溶剤
等の単独あるいはそれらの混合物が使用される。In addition, the organic solvents mentioned in the present invention include aromatic solvents such as benzene, toluene, and xylene, aliphatic solvents such as n-pentane and n-hexane, and alicyclic solvents such as methylcyclopentane and cyclohexane. alcoholic solvents such as methanol, ethanol, isopropanol, n-butanol, ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, ether solvents such as diethyl ether and tetrahydrofuran, methyl acetate, ethyl acetate , ester solvents such as inglovir acetate and butyl acetate, halogen-containing solvents such as methylene chloride, trichloroethylene, 1.1, l-trichloroethane, tetrachlorethylene, chloroform, chlorobenzene, carbon tetrachloride, etc., or a combination thereof. A mixture is used.
次に、模様描写液の実施例について説明する。Next, examples of the pattern drawing liquid will be described.
(A) アクリル樹脂
メタクリル酸メチル 200アクリル酸ブ
チル 80メタクリル酸2−ヒドロキ
シエチル 20チオカルコール20(イ)3
.6
アゾビスイソブチロニトリル 1.8トルエン
?00(イ) 花王C株)製
上記配合物を70〜80℃にて窒素雰囲気下で約8時間
1合させ、固形公約151までトルエンで調整する(但
し固形分15%には固執しない)。(A) Acrylic resin methyl methacrylate 200 Butyl acrylate 80 2-hydroxyethyl methacrylate 20 Thiocalcol 20 (a) 3
.. 6 Azobisisobutyronitrile 1.8 Toluene
? 00 (a) Kao C Co., Ltd.) The above formulation was mixed at 70 to 80° C. under a nitrogen atmosphere for about 8 hours, and the solid content was adjusted to about 151 with toluene (however, the solid content did not stick to 15%).
rB) アクリル樹脂
メタクリル酸メチル 120アクリル酸エ
チル 180エマルゲン920(イ)
3エマール OCイ)1.5
過硫酸カリウム 0.5水
Wo。rB) Acrylic resin methyl methacrylate 120 ethyl acrylate 180 Emulgen 920 (a)
3 emal OC i) 1.5 potassium persulfate 0.5 water
Wo.
上記配合物を70℃にて窒素雰囲気下で約4時間重合さ
せ、固形分20%まで水で調整する(但し、固形分20
慢には固執しない)。The above formulation is polymerized at 70°C under a nitrogen atmosphere for about 4 hours, and the solid content is adjusted to 20% with water (however, the solid content is 20%).
Don't be arrogant).
(C) クラフト変性SBB。(C) Kraft modified SBB.
8B8150! (a) 150メタク
リル酸メチル 100スチレン
50過酸化ベンゾイル 1
トルエン +700C口) 日本
合成ゴム1株)m
上記配合物を70〜80℃にて窒素雰囲気下で約8時間
重合(重合本釣80係)させた後、固形分10係までト
ルエンで調整する(但し、固形分10幅には固執しない
)。8B8150! (a) 150 methyl methacrylate 100 styrene
50 benzoyl peroxide 1 toluene +700C) Japan Synthetic Rubber Co., Ltd.) m After polymerizing the above compound in a nitrogen atmosphere at 70 to 80°C for about 8 hours (polymerization line fishing 80 parts), the solid content was reduced to 10 parts. Adjust with toluene (however, do not stick to the solid content range of 10).
(D) 固形エポキシ樹脂
スミエポキシE8A−019(ハ)300メチルエチル
ケトン 560酢酸エチル
140(ハ) 住友化学工業C株)製
上記配合物を常温で攪拌し溶解させる。(D) Solid epoxy resin Sumiepoxy E8A-019 (c) 300 methyl ethyl ketone 560 ethyl acetate
140 (c) (Sumitomo Chemical Co., Ltd.) The above-mentioned formulation is stirred and dissolved at room temperature.
(E) ポリイソシアネート化合物
タケネー)D−12ON(ニ) 100メチレン
クロライド 100(ニ) 大田薬品工業
C株)製
上記配合物を均一になるまで十分に攪拌し、混合する。(E) Polyisocyanate compound D-12ON (D) 100 methylene chloride 100 (D) Manufactured by Ota Pharmaceutical Co., Ltd. The above formulation is thoroughly stirred and mixed until uniform.
本発明の施工例1
ロクロで成形したとっくり(とつくシ屋には限定されな
い以下同じ)を十分に乾燥させた後、(A)のアクリル
樹脂溶液、又Fi(B)のアクリル樹脂分散液、又は(
C)のグラフト変性SBR溶液、又は(D)の固形エポ
キシ樹脂溶液、又は(E)のポリインシアネート溶液を
用いて絵筆でとつ〈カの表面に模様を描いた。常温で約
1時間乾燥した後、その模様の周囲を刷毛又は布を用い
て水で洗い落とすと模様は浮き彫り状に現われた。(こ
のとき、長時間洗い続けると形が崩れてしtうので注意
を要する。)次に常温で24時間以上乾燥させた後、窯
の中に入れ、最終温度?00〜800 ”Qになるまで
数時間かけて徐々に昇温して素焼きを行った。素焼き後
%釉薬をかけて800〜1400℃で本焼きを行い(温
度は釉薬の種類によシ異なる)、浮き彫り模様の施され
たとつくシを得た。Construction example 1 of the present invention After thoroughly drying a pottery molded on a potter's wheel (the same applies hereinafter and not limited to potter's wheel), the acrylic resin solution of (A) or the acrylic resin dispersion of Fi (B), Or (
Using a graft-modified SBR solution (C), a solid epoxy resin solution (D), or a polyincyanate solution (E), a pattern was drawn on the surface of the film using a paintbrush. After drying at room temperature for about an hour, the area around the pattern was washed off with water using a brush or cloth, and the pattern appeared in relief. (At this time, be careful as it will lose its shape if you keep washing it for a long time.) Next, after drying it at room temperature for 24 hours or more, put it in the kiln to reach the final temperature. Bisque firing was carried out by gradually raising the temperature over several hours until it reached 00 to 800 "Q. After bisque firing, a percent glaze was applied and the final firing was performed at 800 to 1400℃ (temperature varies depending on the type of glaze) , I got a totsukushi with an embossed pattern.
施工例2
0クロで成形したとっくりの表面に化粧泥をかけて十分
に乾燥する。その上に、(A)のアクリル樹脂溶液、又
は(B)のアクリル樹脂分散液、又は(C)のグラフト
変性SBR溶液、又は(D)の固形エポキシ樹脂溶液、
又は(E)のポリイソシアネート溶液を用いて絵筆でと
つ〈シの表面に模様を描いた・常温で約1時間乾燥した
後、その模様の周囲を刷毛又は布を用いて水で洗い落と
し、浮き彫り模様の部分だけ化粧泥が残るよう和した。Construction example 2 Apply makeup mud to the surface of the tokkuri molded with 0 black and dry thoroughly. On top of that, the acrylic resin solution of (A), or the acrylic resin dispersion of (B), or the graft-modified SBR solution of (C), or the solid epoxy resin solution of (D),
Or, use the polyisocyanate solution of (E) to draw a pattern on the surface of the sheet with a paintbrush. After drying at room temperature for about an hour, wash off the area around the pattern with water using a brush or cloth to create an embossed pattern. I softened it so that only the patterned parts remained with the makeup mud.
常温で24時間以上乾燥させた後、実施例1と同様に素
焼き、本焼きを行い、着色した浮き彫り模様の施された
とつくシを得た。After drying at room temperature for 24 hours or more, bisque firing and final firing were carried out in the same manner as in Example 1 to obtain a colored embossed pattern.
施工例3
まず、(A)のアクリル樹脂溶液、又は(B)のアクリ
ル樹脂分散液、又は(C)のグラフト変性SBR溶液、
又はrD)の固形エポキシ樹脂、又は(E)のポリイソ
シアネート溶液に、乳鉢で十分にナシつぶしな酸化コバ
ルト粉C酸化コバルト粉には限定されない。通常・、陶
芸に使用される着色剤であれば何れでもよい)を少量添
加し十分攪拌する。この溶液を用いて、ロクロで成形し
たとつ〈シの表面に絵筆で模様を描いた。常温で約1時
間乾燥した後、その模様の周囲を刷毛又は布を用いて水
で洗い落とした。常温で24時間以上乾燥させた後、実
施例1と同様に素焼き、本焼きを行い、着色した浮き彫
り模様の施されたとつくシを得た。Construction Example 3 First, (A) acrylic resin solution, (B) acrylic resin dispersion, or (C) graft-modified SBR solution,
The solid epoxy resin (rD) or the polyisocyanate solution (E) is not limited to cobalt oxide powder C that can be thoroughly crushed in a mortar. Add a small amount of any coloring agent commonly used in pottery and stir thoroughly. Using this solution, a pattern was drawn with a paintbrush on the surface of a pottery molded on a potter's wheel. After drying at room temperature for about 1 hour, the area around the pattern was washed off with water using a brush or cloth. After drying at room temperature for 24 hours or more, bisque firing and final firing were carried out in the same manner as in Example 1 to obtain a colored embossed pattern.
本発明は上述する如く文字、絵画等の模様部分が洗い出
し式に形成されるので筆致^に描出されるので芸術的価
値の高い陶磁器を量産安価に提供出来る効果がある。As described above, the present invention has the effect of mass-producing ceramics with high artistic value at low cost because the patterns such as letters and paintings are formed in a washed-out manner and are drawn in the brushstrokes.
ポB鴇昨人紐纏−枚/74PoB Tokumasato string-sheets/74
Claims (1)
の有機物質、常温で液体でも水分等と反応することによ
り水に不溶の固体に変化しうる有機物質等を有機溶剤に
溶解した溶液又は水、有機溶剤を分散媒とするコロイド
分散液で文字、絵画等適当な模様を描き、乾燥固化後、
湿らせた布あるいは刷毛等を用いて模様の周囲を水で洗
い落とすことにより表面に浮き彫り模様を現わすことを
特徴とする陶磁器における浮き彫り模様形成方法。An organic substance that is insoluble in water and solid at room temperature is applied to the surface of ceramics before bisque firing, or a solution containing an organic substance that is liquid at room temperature but can turn into a solid that is insoluble in water by reacting with moisture etc. in an organic solvent. Alternatively, draw appropriate patterns such as letters or paintings with a colloidal dispersion using water or an organic solvent as a dispersion medium, and after drying and solidifying,
A method for forming relief patterns on ceramics, which is characterized by making relief patterns appear on the surface by washing off the area around the pattern with water using a damp cloth or brush.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25988287A JPH01101109A (en) | 1987-10-15 | 1987-10-15 | Method for forming relief pattern in ceramic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25988287A JPH01101109A (en) | 1987-10-15 | 1987-10-15 | Method for forming relief pattern in ceramic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01101109A true JPH01101109A (en) | 1989-04-19 |
Family
ID=17340252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25988287A Pending JPH01101109A (en) | 1987-10-15 | 1987-10-15 | Method for forming relief pattern in ceramic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01101109A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016087965A (en) * | 2014-11-06 | 2016-05-23 | 丸新製陶有限会社 | Pottery product production method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5537478A (en) * | 1978-09-11 | 1980-03-15 | Tanto Kk | Releaf tile manufacture |
-
1987
- 1987-10-15 JP JP25988287A patent/JPH01101109A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5537478A (en) * | 1978-09-11 | 1980-03-15 | Tanto Kk | Releaf tile manufacture |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016087965A (en) * | 2014-11-06 | 2016-05-23 | 丸新製陶有限会社 | Pottery product production method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE207101T1 (en) | METHOD FOR PRODUCING PIGMENT PARTICLES | |
JPH01101109A (en) | Method for forming relief pattern in ceramic | |
US2528219A (en) | Method of making thermoplastic articles | |
JPS57190675A (en) | Method and composition for stripping paint | |
JPH1161007A (en) | Aqueous multicolor coating composition, and manufacture of multicolor composite patterned coat | |
CN1064006C (en) | Technology for making imitation of bronze ware | |
JP2856017B2 (en) | Pattern forming method for concrete surface | |
JP2707905B2 (en) | Concrete surface treatment method and formwork used in the method | |
US1536099A (en) | Process of preparing a decorative facing | |
KR20120085583A (en) | Manufacturing method of ceramic stamp | |
JPH0722929B2 (en) | How to reveal a three-dimensional pattern of a ceramic body | |
GB623973A (en) | A new or improved method relating to decoration of ceramic articles | |
JPH0679065A (en) | Pattern formation of wooden doll pasted with cloths | |
JPH01192778A (en) | Engraving-resistant color for ceramics and method for forming ceramics using said color | |
JPS6111903B2 (en) | ||
JPS5556869A (en) | Coating method | |
JPS5579080A (en) | Forming method for colorful paint coat | |
JPS5581766A (en) | Production of granular coated sheet having uneven pattern | |
JPS57149494A (en) | Method of patterned surface treatment of aluminum or aluminum alloy | |
JPS57109691A (en) | Method of manufacturing ornamental plate | |
JPH05194059A (en) | Method for pattering ceramic building material | |
JPS618172A (en) | Formation of embossed pattern | |
JPH05338399A (en) | Production of bark-form and wood plate-form sheet | |
JPS5269943A (en) | Multi-color coating method | |
JPS5613064A (en) | Pattern forming method for decoration |