JPH01100677U - - Google Patents
Info
- Publication number
- JPH01100677U JPH01100677U JP19576987U JP19576987U JPH01100677U JP H01100677 U JPH01100677 U JP H01100677U JP 19576987 U JP19576987 U JP 19576987U JP 19576987 U JP19576987 U JP 19576987U JP H01100677 U JPH01100677 U JP H01100677U
- Authority
- JP
- Japan
- Prior art keywords
- steel plate
- floater
- steel
- steel plates
- side guides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 238000007664 blowing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Butt Welding And Welding Of Specific Article (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19576987U JPH01100677U (enFirst) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19576987U JPH01100677U (enFirst) | 1987-12-25 | 1987-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100677U true JPH01100677U (enFirst) | 1989-07-06 |
Family
ID=31486427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19576987U Pending JPH01100677U (enFirst) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100677U (enFirst) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
-
1987
- 1987-12-25 JP JP19576987U patent/JPH01100677U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
| US7238543B2 (en) | 2000-08-25 | 2007-07-03 | Micron Technology, Inc. | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01100677U (enFirst) | ||
| JP2724395B2 (ja) | シート材浮揚用装置 | |
| JPH0359947U (enFirst) | ||
| JPH0440027U (enFirst) | ||
| JPS6145305U (ja) | シ−ト梱包装置 | |
| JPS60191967A (ja) | 折曲げ機 | |
| JPS5828831Y2 (ja) | シングルフエ−サの給紙装置 | |
| JPH0395170U (enFirst) | ||
| JPS63123519U (enFirst) | ||
| JPH0335965U (enFirst) | ||
| JP2599033Y2 (ja) | 板角こんにゃく連続自動製造機用ノズル | |
| JPS628262U (enFirst) | ||
| JPH0280501U (enFirst) | ||
| JPS63107793U (enFirst) | ||
| JPH0177660U (enFirst) | ||
| JPS63126363U (enFirst) | ||
| JPS646278Y2 (enFirst) | ||
| JPH036250U (enFirst) | ||
| JPH0321995Y2 (enFirst) | ||
| JPS63116426U (enFirst) | ||
| JPS6390628U (enFirst) | ||
| JPS6366104U (enFirst) | ||
| JPS60136888U (ja) | スポツト溶接機における二連式部品選別供給装置 | |
| JPS6234564U (enFirst) | ||
| JPS6326657U (enFirst) |