JPH01100677U - - Google Patents
Info
- Publication number
- JPH01100677U JPH01100677U JP19576987U JP19576987U JPH01100677U JP H01100677 U JPH01100677 U JP H01100677U JP 19576987 U JP19576987 U JP 19576987U JP 19576987 U JP19576987 U JP 19576987U JP H01100677 U JPH01100677 U JP H01100677U
- Authority
- JP
- Japan
- Prior art keywords
- steel plate
- floater
- steel
- steel plates
- side guides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 238000007664 blowing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Butt Welding And Welding Of Specific Article (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19576987U JPH01100677U (enExample) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19576987U JPH01100677U (enExample) | 1987-12-25 | 1987-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100677U true JPH01100677U (enExample) | 1989-07-06 |
Family
ID=31486427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19576987U Pending JPH01100677U (enExample) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100677U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
-
1987
- 1987-12-25 JP JP19576987U patent/JPH01100677U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
| US7238543B2 (en) | 2000-08-25 | 2007-07-03 | Micron Technology, Inc. | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties |
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