JPH01100467U - - Google Patents
Info
- Publication number
- JPH01100467U JPH01100467U JP19569687U JP19569687U JPH01100467U JP H01100467 U JPH01100467 U JP H01100467U JP 19569687 U JP19569687 U JP 19569687U JP 19569687 U JP19569687 U JP 19569687U JP H01100467 U JPH01100467 U JP H01100467U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- pattern lands
- integrated circuit
- disposed
- support protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Waveguides (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19569687U JPH01100467U (sv) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19569687U JPH01100467U (sv) | 1987-12-25 | 1987-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01100467U true JPH01100467U (sv) | 1989-07-05 |
Family
ID=31486360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19569687U Pending JPH01100467U (sv) | 1987-12-25 | 1987-12-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01100467U (sv) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100579441B1 (ko) * | 2003-11-21 | 2006-05-12 | 학교법인 동국대학교 | 표면 멤스 기술을 이용한 다공성 실리콘 기반마이크로스트립 전송선로 |
JP2015517209A (ja) * | 2012-03-30 | 2015-06-18 | ノキア コーポレイション | 変形可能な装置および方法 |
-
1987
- 1987-12-25 JP JP19569687U patent/JPH01100467U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100579441B1 (ko) * | 2003-11-21 | 2006-05-12 | 학교법인 동국대학교 | 표면 멤스 기술을 이용한 다공성 실리콘 기반마이크로스트립 전송선로 |
JP2015517209A (ja) * | 2012-03-30 | 2015-06-18 | ノキア コーポレイション | 変形可能な装置および方法 |