JP7689653B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7689653B2
JP7689653B2 JP2022023245A JP2022023245A JP7689653B2 JP 7689653 B2 JP7689653 B2 JP 7689653B2 JP 2022023245 A JP2022023245 A JP 2022023245A JP 2022023245 A JP2022023245 A JP 2022023245A JP 7689653 B2 JP7689653 B2 JP 7689653B2
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JP
Japan
Prior art keywords
semiconductor element
wiring
substrate
metal body
semiconductor device
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Active
Application number
JP2022023245A
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English (en)
Japanese (ja)
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JP2023120061A5 (https=
JP2023120061A (ja
Inventor
弘起 吉川
徳大 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2022023245A priority Critical patent/JP7689653B2/ja
Priority to CN202380022010.2A priority patent/CN118696411A/zh
Priority to PCT/JP2023/000865 priority patent/WO2023157522A1/ja
Publication of JP2023120061A publication Critical patent/JP2023120061A/ja
Publication of JP2023120061A5 publication Critical patent/JP2023120061A5/ja
Priority to US18/802,821 priority patent/US20240404981A1/en
Priority to JP2025080055A priority patent/JP2025109841A/ja
Priority to JP2025080054A priority patent/JP2025114782A/ja
Application granted granted Critical
Publication of JP7689653B2 publication Critical patent/JP7689653B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

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  • Inverter Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2022023245A 2022-02-17 2022-02-17 半導体装置 Active JP7689653B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022023245A JP7689653B2 (ja) 2022-02-17 2022-02-17 半導体装置
CN202380022010.2A CN118696411A (zh) 2022-02-17 2023-01-13 半导体装置
PCT/JP2023/000865 WO2023157522A1 (ja) 2022-02-17 2023-01-13 半導体装置
US18/802,821 US20240404981A1 (en) 2022-02-17 2024-08-13 Semiconductor device
JP2025080055A JP2025109841A (ja) 2022-02-17 2025-05-12 半導体装置
JP2025080054A JP2025114782A (ja) 2022-02-17 2025-05-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022023245A JP7689653B2 (ja) 2022-02-17 2022-02-17 半導体装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2025080055A Division JP2025109841A (ja) 2022-02-17 2025-05-12 半導体装置
JP2025080054A Division JP2025114782A (ja) 2022-02-17 2025-05-12 半導体装置

Publications (3)

Publication Number Publication Date
JP2023120061A JP2023120061A (ja) 2023-08-29
JP2023120061A5 JP2023120061A5 (https=) 2024-01-19
JP7689653B2 true JP7689653B2 (ja) 2025-06-09

Family

ID=87578094

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022023245A Active JP7689653B2 (ja) 2022-02-17 2022-02-17 半導体装置
JP2025080054A Pending JP2025114782A (ja) 2022-02-17 2025-05-12 半導体装置
JP2025080055A Pending JP2025109841A (ja) 2022-02-17 2025-05-12 半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2025080054A Pending JP2025114782A (ja) 2022-02-17 2025-05-12 半導体装置
JP2025080055A Pending JP2025109841A (ja) 2022-02-17 2025-05-12 半導体装置

Country Status (4)

Country Link
US (1) US20240404981A1 (https=)
JP (3) JP7689653B2 (https=)
CN (1) CN118696411A (https=)
WO (1) WO2023157522A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
DE102023205330A1 (de) * 2023-06-07 2024-12-12 Zf Friedrichshafen Ag Kontaktierungsanordnung für Leistungshalbleiterchips und Leistungselektronikmodul
JP2025017148A (ja) 2023-07-24 2025-02-05 トヨタ自動車株式会社 ロボット制御システム、その制御方法、及びプログラム
US20260031739A1 (en) * 2024-07-25 2026-01-29 GM Global Technology Operations LLC Power module including semiconductor devices

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188318A (ja) 2001-12-19 2003-07-04 Denso Corp 半導体装置及びその製造方法
JP2017208385A (ja) 2016-05-16 2017-11-24 株式会社デンソー 電子装置
JP2020057695A (ja) 2018-10-02 2020-04-09 株式会社デンソー 半導体装置
JP2020064907A (ja) 2018-10-15 2020-04-23 株式会社デンソー 半導体装置
JP2021176177A (ja) 2020-05-01 2021-11-04 株式会社デンソー 半導体装置および電力変換装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5709299B2 (ja) * 2010-09-29 2015-04-30 ローム株式会社 半導体パワーモジュールおよびその製造方法
JP6988345B2 (ja) * 2017-10-02 2022-01-05 株式会社デンソー 半導体装置
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188318A (ja) 2001-12-19 2003-07-04 Denso Corp 半導体装置及びその製造方法
JP2017208385A (ja) 2016-05-16 2017-11-24 株式会社デンソー 電子装置
JP2020057695A (ja) 2018-10-02 2020-04-09 株式会社デンソー 半導体装置
JP2020064907A (ja) 2018-10-15 2020-04-23 株式会社デンソー 半導体装置
JP2021176177A (ja) 2020-05-01 2021-11-04 株式会社デンソー 半導体装置および電力変換装置

Also Published As

Publication number Publication date
JP2025109841A (ja) 2025-07-25
WO2023157522A1 (ja) 2023-08-24
US20240404981A1 (en) 2024-12-05
JP2025114782A (ja) 2025-08-05
JP2023120061A (ja) 2023-08-29
CN118696411A (zh) 2024-09-24

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