JP7666759B1 - ポリイミド樹脂組成物、成形体及びその製造方法、金属箔積層板 - Google Patents

ポリイミド樹脂組成物、成形体及びその製造方法、金属箔積層板 Download PDF

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Publication number
JP7666759B1
JP7666759B1 JP2024553157A JP2024553157A JP7666759B1 JP 7666759 B1 JP7666759 B1 JP 7666759B1 JP 2024553157 A JP2024553157 A JP 2024553157A JP 2024553157 A JP2024553157 A JP 2024553157A JP 7666759 B1 JP7666759 B1 JP 7666759B1
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Japan
Prior art keywords
polyimide resin
group
resin composition
carbon atoms
formula
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JP2024553157A
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Japanese (ja)
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JPWO2025028162A5 (https=
JPWO2025028162A1 (https=
Inventor
良輔 藤井
敦史 酒井
勇希 佐藤
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
JP2024553157A 2023-08-02 2024-07-08 ポリイミド樹脂組成物、成形体及びその製造方法、金属箔積層板 Active JP7666759B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023126036 2023-08-02
JP2023126036 2023-08-02
PCT/JP2024/024518 WO2025028162A1 (ja) 2023-08-02 2024-07-08 ポリイミド樹脂組成物、成形体及びその製造方法、金属箔積層板

Publications (3)

Publication Number Publication Date
JPWO2025028162A1 JPWO2025028162A1 (https=) 2025-02-06
JP7666759B1 true JP7666759B1 (ja) 2025-04-22
JPWO2025028162A5 JPWO2025028162A5 (https=) 2025-07-08

Family

ID=94394422

Family Applications (1)

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JP2024553157A Active JP7666759B1 (ja) 2023-08-02 2024-07-08 ポリイミド樹脂組成物、成形体及びその製造方法、金属箔積層板

Country Status (5)

Country Link
JP (1) JP7666759B1 (https=)
KR (1) KR20260046294A (https=)
CN (1) CN121219364A (https=)
TW (1) TW202509121A (https=)
WO (1) WO2025028162A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016500746A (ja) * 2013-07-24 2016-01-14 ケムチュア コーポレイション リン含有難燃材
JP2017119865A (ja) * 2015-12-28 2017-07-06 荒川化学工業株式会社 ポリイミド系接着剤
JP2021176926A (ja) * 2020-05-07 2021-11-11 昭和電工マテリアルズ株式会社 樹脂組成物、プリプレグ、積層板、樹脂フィルム、多層プリント配線板及び半導体パッケージ
JP2022514658A (ja) * 2018-12-20 2022-02-14 ランクセス・コーポレーション リン含有難燃剤の調製方法及びポリマー組成物におけるそれらの使用
WO2022054862A1 (ja) * 2020-09-11 2022-03-17 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP2022150087A (ja) * 2021-03-26 2022-10-07 日鉄ケミカル＆マテリアル株式会社 ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016500746A (ja) * 2013-07-24 2016-01-14 ケムチュア コーポレイション リン含有難燃材
JP2017119865A (ja) * 2015-12-28 2017-07-06 荒川化学工業株式会社 ポリイミド系接着剤
JP2022514658A (ja) * 2018-12-20 2022-02-14 ランクセス・コーポレーション リン含有難燃剤の調製方法及びポリマー組成物におけるそれらの使用
JP2021176926A (ja) * 2020-05-07 2021-11-11 昭和電工マテリアルズ株式会社 樹脂組成物、プリプレグ、積層板、樹脂フィルム、多層プリント配線板及び半導体パッケージ
WO2022054862A1 (ja) * 2020-09-11 2022-03-17 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP2022150087A (ja) * 2021-03-26 2022-10-07 日鉄ケミカル＆マテリアル株式会社 ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板

Also Published As

Publication number Publication date
CN121219364A (zh) 2025-12-26
WO2025028162A1 (ja) 2025-02-06
JPWO2025028162A1 (https=) 2025-02-06
TW202509121A (zh) 2025-03-01
KR20260046294A (ko) 2026-04-07

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