JP7633094B2 - 弱いラベル付けを使用した半導体試料内の欠陥の検出 - Google Patents

弱いラベル付けを使用した半導体試料内の欠陥の検出 Download PDF

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JP7633094B2
JP7633094B2 JP2021093501A JP2021093501A JP7633094B2 JP 7633094 B2 JP7633094 B2 JP 7633094B2 JP 2021093501 A JP2021093501 A JP 2021093501A JP 2021093501 A JP2021093501 A JP 2021093501A JP 7633094 B2 JP7633094 B2 JP 7633094B2
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ペレグ イラド
シュレイェン ラン
コーエン ボアズ
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アプライド マテリアルズ イスラエル リミテッド
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    • G06T7/0004—Industrial image inspection
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    • G01N21/84—Systems specially adapted for particular applications
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    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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    • G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
    • G06V10/449—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters
    • G06V10/451—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters with interaction between the filter responses, e.g. cortical complex cells
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
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    • G06T2207/30148—Semiconductor; IC; Wafer

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JP2021093501A 2020-06-03 2021-06-03 弱いラベル付けを使用した半導体試料内の欠陥の検出 Active JP7633094B2 (ja)

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US16/892,139 US11379972B2 (en) 2020-06-03 2020-06-03 Detecting defects in semiconductor specimens using weak labeling
US16/892,139 2020-06-03

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US (2) US11379972B2 (https=)
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US20220301151A1 (en) 2022-09-22
CN118297906B (zh) 2025-07-29
CN113763312A (zh) 2021-12-07
CN118297906A (zh) 2024-07-05
CN113763312B (zh) 2024-04-19
TWI864281B (zh) 2024-12-01
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