JP7531346B2 - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

Info

Publication number
JP7531346B2
JP7531346B2 JP2020139499A JP2020139499A JP7531346B2 JP 7531346 B2 JP7531346 B2 JP 7531346B2 JP 2020139499 A JP2020139499 A JP 2020139499A JP 2020139499 A JP2020139499 A JP 2020139499A JP 7531346 B2 JP7531346 B2 JP 7531346B2
Authority
JP
Japan
Prior art keywords
adjustment
laser light
laser
processing
output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020139499A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022035286A (ja
Inventor
孝文 荻原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to JP2020139499A priority Critical patent/JP7531346B2/ja
Priority to TW110126360A priority patent/TW202222459A/zh
Priority to KR1020210108226A priority patent/KR20220023306A/ko
Priority to CN202110953923.9A priority patent/CN114074218A/zh
Publication of JP2022035286A publication Critical patent/JP2022035286A/ja
Application granted granted Critical
Publication of JP7531346B2 publication Critical patent/JP7531346B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Lasers (AREA)
JP2020139499A 2020-08-20 2020-08-20 レーザ加工装置 Active JP7531346B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020139499A JP7531346B2 (ja) 2020-08-20 2020-08-20 レーザ加工装置
TW110126360A TW202222459A (zh) 2020-08-20 2021-07-19 雷射加工裝置
KR1020210108226A KR20220023306A (ko) 2020-08-20 2021-08-17 레이저 가공 장치
CN202110953923.9A CN114074218A (zh) 2020-08-20 2021-08-19 激光加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020139499A JP7531346B2 (ja) 2020-08-20 2020-08-20 レーザ加工装置

Publications (2)

Publication Number Publication Date
JP2022035286A JP2022035286A (ja) 2022-03-04
JP7531346B2 true JP7531346B2 (ja) 2024-08-09

Family

ID=80283352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020139499A Active JP7531346B2 (ja) 2020-08-20 2020-08-20 レーザ加工装置

Country Status (4)

Country Link
JP (1) JP7531346B2 (ko)
KR (1) KR20220023306A (ko)
CN (1) CN114074218A (ko)
TW (1) TW202222459A (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007007975A (ja) 2005-06-30 2007-01-18 Rohm Co Ltd 画像形成装置
JP2018158375A (ja) 2017-03-24 2018-10-11 東レエンジニアリング株式会社 レーザー加工方法及びレーザー加工装置
JP2019064863A (ja) 2017-09-29 2019-04-25 三星ダイヤモンド工業株式会社 スクライブ加工方法及びスクライブ加工装置
JP2020006392A (ja) 2018-07-05 2020-01-16 浜松ホトニクス株式会社 レーザ加工装置
JP2021115613A (ja) 2020-01-28 2021-08-10 株式会社ディスコ レーザー加工装置およびレーザー加工方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007007975A (ja) 2005-06-30 2007-01-18 Rohm Co Ltd 画像形成装置
JP2018158375A (ja) 2017-03-24 2018-10-11 東レエンジニアリング株式会社 レーザー加工方法及びレーザー加工装置
JP2019064863A (ja) 2017-09-29 2019-04-25 三星ダイヤモンド工業株式会社 スクライブ加工方法及びスクライブ加工装置
JP2020006392A (ja) 2018-07-05 2020-01-16 浜松ホトニクス株式会社 レーザ加工装置
JP2021115613A (ja) 2020-01-28 2021-08-10 株式会社ディスコ レーザー加工装置およびレーザー加工方法

Also Published As

Publication number Publication date
CN114074218A (zh) 2022-02-22
JP2022035286A (ja) 2022-03-04
KR20220023306A (ko) 2022-03-02
TW202222459A (zh) 2022-06-16

Similar Documents

Publication Publication Date Title
US11612956B2 (en) Laser light radiation device and laser light radiation method
US9457424B2 (en) Laser machining device
KR20210027349A (ko) 레이저 가공 장치
KR20190071730A (ko) 레이저광 조사 장치
US20220410311A1 (en) Laser processing device
JP7531346B2 (ja) レーザ加工装置
JP6693040B1 (ja) レーザ加工装置の収差調整方法及び収差制御方法
CN112384324B (zh) 激光加工装置
JP2022035132A (ja) レーザ加工装置
US11131871B2 (en) Laser processing device and operation checking method
WO2022014603A1 (ja) レーザ加工装置及びレーザ加工方法
WO2022014619A1 (ja) レーザ加工装置及びレーザ加工方法
WO2022014618A1 (ja) レーザ加工装置及びレーザ加工方法
KR20220109315A (ko) 관찰 장치 및 관찰 방법
JP2022035948A (ja) レーザ加工装置及びレーザ加工方法
WO2024034193A1 (ja) レーザ加工装置及びレーザ加工方法
JP7303079B2 (ja) レーザ加工装置及びレーザ加工方法
JP7303080B2 (ja) レーザ加工装置及びレーザ加工方法
JP7303078B2 (ja) レーザ加工装置及びレーザ加工方法
JP7467208B2 (ja) レーザ加工装置、及び、レーザ加工方法
WO2022265046A1 (ja) レーザ加工装置及びレーザ加工方法
US20240082959A1 (en) Laser processing apparatus and laser processing method
WO2022249541A1 (ja) レーザ加工装置及びレーザ加工方法
WO2022085385A1 (ja) レーザ装置
JP6689649B2 (ja) レーザ光照射装置、及び、プロファイル取得方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230808

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240425

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240701

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240723

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240730

R150 Certificate of patent or registration of utility model

Ref document number: 7531346

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150