JP7518032B2 - Contactless communication media - Google Patents

Description

This disclosure relates to a non-contact communication medium.

Traditionally, items are managed using RFID (Radio Frequency Identifier) tags.

Patent Document 1 discloses a technology for sealing an RFID tag in a thermally insulating container so that the RFID tag can be used to manage parts that are processed at high temperatures in factories, etc. The container described in Patent Document 1 has a container that contains the RFID tag and a lid that is joined to the container. The RFID tag sealed in the container is passed through the manufacturing process together with the parts.

JP 2008-129838 A

However, in the conventional technology described above, for example, during the manufacturing process, liquids such as plating solution or gases such as corrosive gases may enter through the joint between the container and the lid and cause damage to the RFID tag inside.

The present disclosure has been made in consideration of the above, and aims to provide a non-contact communication medium that can prevent external liquids or gases from entering through the joints of the housing.

A non-contact communication medium according to one aspect of the present disclosure includes a housing and an electronic component. The housing has an internal storage space. The electronic component is located in the storage space and performs non-contact communication. The housing also has at least two substrates made of ceramics and an adhesive layer located between the two substrates and bonding the two substrates. A portion of the adhesive layer also faces the storage space, and the porosity at an end relatively close to the exterior of the housing is lower than the porosity at the interior relatively close to the storage space.

According to the present disclosure, it is possible to prevent external liquids and gases from entering through the joints of the container.

FIG. 1 is a plan view of a non-contact communication medium according to an embodiment. FIG. 2 is a cross-sectional view taken along line II-II of FIG. FIG. 3 is a schematic enlarged view of a portion H shown in FIG. FIG. 4 is an enlarged cross-sectional view of a non-contact communication medium according to a first modified example. FIG. 5 is a diagram showing another example of the covering layer according to the first modified example. FIG. 6 is an enlarged cross-sectional view of a non-contact communication medium according to a second modified example. FIG. 7 is a diagram showing another example of the covering layer according to the second modified example. FIG. 8 is an enlarged cross-sectional view of a non-contact communication medium according to a third modified example. FIG. 9 is a diagram showing another example of the covering layer according to the third modified example. FIG. 10 is an enlarged cross-sectional view of a non-contact communication medium according to a fourth modified example. FIG. 11 is a diagram showing another example of the covering layer according to the fourth modified example. FIG. 12 is a cross-sectional view of a non-contact communication medium according to a fifth modified example. FIG. 13 is a plan view of a non-contact communication medium according to a sixth modified example. FIG. 14 is a cross-sectional view taken along line XIV-XIV of FIG. FIG. 15 is a plan view of a non-contact communication medium according to a seventh modified example. 16 is a cross-sectional view taken along line XVI-XVI in FIG. FIG. 17 is a cross-sectional view of a non-contact communication medium according to an eighth modified example. FIG. 18 is a cross-sectional view of a non-contact communication medium according to a ninth modified example. FIG. 19 is a cross-sectional view of a non-contact communication medium according to a tenth modification. FIG. 20 is a perspective view of a non-contact communication medium according to an eleventh modified example. FIG. 21 is a cross-sectional view of a non-contact communication medium according to an eleventh modified example. FIG. 22 is a view of the receiving hole according to the twelfth modified example seen along the extending direction of the receiving hole. FIG. 23 is a cross-sectional view of a non-contact communication medium according to a thirteenth modified example. FIG. 24 is a cross-sectional view of a non-contact communication medium according to a fourteenth modification. FIG. 25 is a plan view of a first base material according to a fourteenth modified example. FIG. 26 is an enlarged cross-sectional view of a non-contact communication medium according to a fifteenth modification. FIG. 27 is an enlarged cross-sectional view of a non-contact communication medium according to a sixteenth modification. FIG. 28 is an enlarged cross-sectional view of a non-contact communication medium according to a seventeenth modification. FIG. 29 is an enlarged cross-sectional view of a non-contact communication medium according to an eighteenth modification. FIG. 30 is a cross-sectional view of a non-contact communication medium according to a nineteenth modification. FIG. 31 is a plan view of a first base material according to a nineteenth modification.

Below, a detailed description will be given of a form for implementing a non-contact communication medium according to the present disclosure (hereinafter, referred to as an "embodiment") with reference to the drawings. Note that the non-contact communication medium according to the present disclosure is not limited to this embodiment. Furthermore, each embodiment can be appropriately combined as long as the processing content is not contradictory. Furthermore, the same parts in each of the following embodiments are given the same reference numerals, and duplicated descriptions will be omitted.

In addition, in the embodiments described below, expressions such as "constant," "orthogonal," "vertical," and "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "vertical," or "parallel" in the strict sense. In other words, each of the above expressions allows for deviations due to, for example, manufacturing precision, installation precision, and the like.

In addition, in order to make the explanation easier to understand, the drawings referenced below may show an orthogonal coordinate system that defines mutually orthogonal X-axis, Y-axis, and Z-axis directions, with the positive Z-axis direction being the vertically upward direction.

<Configuration of non-contact communication medium>
A configuration of a non-contact communication medium according to an embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a plan view of the non-contact communication medium according to the embodiment. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1.

As shown in Figs. 1 and 2, the non-contact communication medium 1 according to the embodiment has an electronic component 10 and a housing 20. The electronic component 10 is, for example, an RFID tag.

The electronic component 10 as an RFID has an antenna for non-contact communication, an IC chip that performs non-contact communication via the antenna, and a memory that stores identification information, all on a substrate made of, for example, LTCC (Low Temperature Co-fired Ceramics). The electronic component 10 as an RFID can transmit the identification information stored in the memory to an external device (for example, an RFID reader) by non-contact communication using electromagnetic induction, radio waves, etc.

The non-contact communication medium 1 according to the embodiment is used, for example, in a high-temperature environment that exceeds the heat resistance temperature of the electronic component 10. For example, the non-contact communication medium 1 according to the embodiment is attached to a part to be plated and plated together with the part. The temperature of the plating solution for hot-dip galvanizing or the like is, for example, 75°C to 500°C.

The non-contact communication medium 1 according to the embodiment may be treated with acidic or alkaline chemicals together with the components. In this way, the non-contact communication medium 1 according to the embodiment may be used in an acidic or alkaline environment that exceeds the chemical resistance of the electronic component 10.

The non-contact communication medium 1 according to the embodiment has a housing 20 that seals the electronic component 10 to protect the electronic component 10 from high-temperature and acidic/alkaline environments. The housing 20 has an internal housing space 25, and houses the electronic component 10 in the housing space 25.

The container 20 has a first substrate 21, a second substrate 22, and an adhesive layer 5. The first substrate 21 and the second substrate 22 are bonded to each other via the adhesive layer 5.

The first substrate 21 and the second substrate 22 have a relatively flat cylindrical shape. Specifically, the first substrate 21 and the second substrate 22 have two flat surfaces (upper end surface and lower end surface) that are circular in plan view, and a curved surface (outer peripheral surface) that connects these two flat surfaces. One flat surface 21a (upper end surface) of the first substrate 21 and one flat surface 22a (lower end surface) of the second substrate 22 face each other with approximately the same diameter, and the adhesive layer 5 is located between them.

The first substrate 21 has a storage recess 25a that stores the electronic component 10. The storage recess 25a opens in the center of the flat surface 21a. The first substrate 21 and the second substrate 22 are joined via an adhesive layer 5, thereby closing the flat surface 21a of the first substrate 21. This seals the electronic component 10 inside the container 20.

The first substrate 21 and the second substrate 22 are made of ceramics. For example, cordierite can be used as the ceramics constituting the first substrate 21 and the second substrate 22. Cordierite has excellent thermal shock resistance due to its small thermal expansion coefficient, and also has low thermal conductivity, making it difficult for heat to be transferred to the electronic component 10. In this way, by using cordierite, the electronic component 10 can be appropriately protected from high-temperature environments. Note that the ceramics constituting the first substrate 21 and the second substrate 22 do not necessarily have to be cordierite. This point will be described later.

The adhesive layer 5 is located between the flat surface 21a of the first substrate 21 and the flat surface 22a of the second substrate 22, and bonds the first substrate 21 and the second substrate 22. The adhesive layer 5 spreads over the entire flat surface 22a of the second substrate 22. Therefore, a part of the adhesive layer 5 faces the storage space 25.

In this embodiment, the adhesive layer 5 has a lower porosity at the end 5a than at the inside 5b. "Low porosity" means, in other words, that the adhesive layer 5 is dense. "High porosity" means, in other words, that the adhesive layer 5 is sparse.

The end 5a of the adhesive layer 5 refers to a portion of the adhesive layer 5 that is relatively close to the outside of the container 20. Specifically, the end 5a of the adhesive layer 5 is a region that includes the end surface of the adhesive layer 5 that is exposed to the outside and may come into contact with the plating solution, etc. For example, the end 5a of the adhesive layer 5 is a region that is up to 300 μm from the end surface of the adhesive layer 5.

The interior 5b of the adhesive layer 5 refers to a portion of the adhesive layer 5 that is relatively close to the storage space 25 of the housing 20. Specifically, the interior 5b of the adhesive layer 5 is a portion that is located inside the housing 20 relative to the end 5a of the adhesive layer 5. For example, the interior 5b of the adhesive layer 5 may be a region that faces the storage space 25 formed inside the housing 20.

In this way, the adhesive layer 5 according to the embodiment has a density difference such that the "outside (end 5a) is greater than the inside (inside 5b)."

This point will be explained in more detail with reference to Figure 3, which is a schematic enlarged view of part H shown in Figure 2.

As shown in FIG. 3, the adhesive layer 5 according to the embodiment has an adhesive 51 and a sealant 52.

The adhesive 51 only needs to have heat resistance sufficient to withstand the environment in which the non-contact communication medium 1 is used. For example, an inorganic adhesive can be used as such an adhesive. Alternatively, an inorganic adhesive with ceramic powder added can be used as the adhesive.

For example, adhesive 51 is mainly composed of silica and contains alumina, calcia, zircon, sodium glass, etc.

The adhesive 51 has voids 511 throughout its entire area, including the ends 5a and the interior 5b. The voids 511 are distributed almost evenly throughout the entire area of the adhesive 51.

The sealant 52 fills the voids 511 in the adhesive 51 by penetrating into the voids 511. Specifically, the sealant 52 fills the voids 511 located at the end 5a among the voids 511 distributed throughout the entire area of the adhesive 51.

Specifically, the sealant 52 contains fine particles and a binder, and the fine particles enter the voids 511, and the binder connects the fine particles that have entered the voids 511 to the adhesive 51, thereby sealing the voids 511. In terms of the manufacturing process, it is preferable that the sealant 52 contains a solvent. By containing a solvent, it is possible to easily penetrate the fine particles and the binder into the adhesive 51. The solvent does not have to be contained in the finished product, because the solvent evaporates from the voids 511 during the manufacturing process.

The fine particles are, for example, silica fine particles. The binder is, for example, silicone or epoxy. From the viewpoint of heat resistance, it is preferable to use silicone as the binder. The sealing agent 52 does not contain alumina or zircon.

The sealant 52 may be any material capable of sealing the voids 511 in the adhesive 51, and is not limited to the above-mentioned components. For example, a resin may be used as the sealant 52.

The gap 511 located at the end 5a of the adhesive 51 is filled with the sealant 52, creating a density difference in the adhesive layer 5 such that the outside (end 5a) is greater than the inside (inside 5b). In other words, the porosity at the end 5a of the adhesive layer 5 is lower than the porosity at the inside 5b of the adhesive layer 5.

The porosity of the end 5a of the adhesive layer 5, which is relatively close to the outside of the housing 20, is low, in other words, the end 5a of the adhesive layer 5 is dense, which can prevent the intrusion of plating solution and the like from the outside of the housing 20 into the housing space 25. In addition, the porosity of the inside 5b of the adhesive layer 5, which is relatively close to the housing space 25 of the housing 20, is high, in other words, the inside 5b of the adhesive layer 5 is sparse, which can improve the thermal insulation of the adhesive layer 5.

In this way, the non-contact communication medium 1 according to the embodiment can appropriately protect the electronic component 10 from high-temperature environments while preventing external liquids and gases from entering through the joints of the container 20.

<Production Method>
Next, an example of a method for manufacturing the non-contact communication medium 1 according to the embodiment will be described.

First, cordierite powder and sintering aid powder are prepared. The sintering aid is, for example, a rare earth oxide (yttrium oxide, cerium oxide, etc.), an alkali metal oxide (lithium oxide, sodium oxide, etc.), or an alkaline earth metal (calcium oxide). Note that instead of cordierite powder, a mixture of magnesium oxide, aluminum oxide, and silicon oxide in the desired cordierite composition ratio may be used. Next, the prepared powder is put into a vibration mill together with water as a solvent, and is pulverized and mixed to obtain the raw material.

Next, organic components such as binders, plasticizers, and release agents are added to the raw materials obtained by grinding and mixing, and then the mixture is stirred to produce a slurry. The slurry is then spray-dried using a spray dryer to produce ceramic granules.

Next, the produced ceramic granules are powder-pressed to obtain the green bodies of the first substrate 21 and the second substrate 22. The accommodating recess 25a is also formed by a die in this process.

Then, the molded body is degreased by heat treatment in an air atmosphere, a vacuum atmosphere, or a nitrogen gas atmosphere, and then the molded body is fired to obtain the first substrate 21 and the second substrate 22. Note that, in order to obtain a desired shape, cutting and grinding processes may be performed on the molded body of the first substrate 21 and the second substrate 22 or the first substrate 21 and the second substrate 22 after firing.

Next, after the electronic component 10 is accommodated in the accommodation recess 25a, the flat surface 21a of the first substrate 21 and the flat surface 22a of the second substrate 22 are joined together using adhesive 51.

Then, a sealing agent 52 is applied to the end face (outer peripheral surface) of the adhesive 51. As described above, the sealing agent 52 may contain a solvent in order to enhance permeability. The sealing agent 52 penetrates into the voids 511 located at the end 5a of the adhesive 51, and seals the voids 511. This creates a density difference in the adhesive layer 5 of "outside (end 5a) > inside (inside 5b)". As a result, a non-contact communication medium 1 according to the embodiment is obtained.

<First Modification>
Fig. 4 is an enlarged cross-sectional view of the non-contact communication medium according to the first modified example, and Fig. 5 is a diagram showing another example of the covering layer according to the first modified example.

As shown in FIG. 4, the non-contact communication medium 1A according to the first modified example further includes a coating layer 30A. The coating layer 30A is located outside the area between the first substrate 21 and the second substrate 22, i.e., the area where the adhesive layer 5 is present, and covers the end 5a of the adhesive layer 5.

Specifically, the covering layer 30A in the first modified example covers the end 5a of the adhesive layer 5, and also covers the exposed surface of the outer surface of the container 20 where the end 5a of the adhesive layer 5 is exposed, in this case, a part of the outer peripheral surfaces 21b, 22b of the first substrate 21 and the second substrate 22.

In the first modified example, the coating layer 30A is made of a sealant 52. As shown in FIG. 5, the coating layer 30A may be made of an adhesive 51 and a sealant 52. In this case, the adhesive 51 may be located closer to the adhesive layer 5, and the sealant 52 may be located on the outside of the adhesive 51. The sealant 52 enters the gaps 511 (not shown here) of the adhesive 51 contained in the coating layer 30A, so that the porosity of the adhesive 51 contained in the coating layer 30A is equal to or lower than the porosity at the end 5a of the adhesive layer 5. Note that FIG. 5 shows an example in which the adhesive 51 and the sealant 52 are clearly separated, but the adhesive 51 and the sealant 52 may be mixed.

In this way, by covering the outside of the adhesive layer 5 with a coating layer 30A having a porosity similar to that of the end 5a of the adhesive layer 5, it is possible to further prevent the plating solution and the like from entering the storage space 25.

<Second Modification>
Fig. 6 is an enlarged cross-sectional view of the non-contact communication medium according to the second modified example, and Fig. 7 is a diagram showing another example of the covering layer according to the second modified example.

As shown in FIG. 6, the non-contact communication medium 1B according to the second modified example further includes a coating layer 30B. The coating layer 30B is made of, for example, a sealing agent 52.

The covering layer 30B of the second modified example covers the end 5a of the adhesive layer 5 and covers the entire outer surfaces 21b, 22b of the first substrate 21 and the second substrate 22.

In this way, the coating layer 30B may extend over the entire outer surfaces 21b, 22b of the first substrate 21 and the second substrate 22. This makes it possible to more reliably prevent the plating solution and the like from entering the storage space 25.

As shown in FIG. 7, the coating layer 30B may be made of an adhesive 51 and a sealant 52. In this case, the adhesive 51 may be located closer to the adhesive layer 5, and the sealant 52 may be located on the outside of the adhesive 51. The sealant 52 enters the voids 511 (not shown here) of the adhesive 51 contained in the coating layer 30B, so that the porosity of the adhesive 51 contained in the coating layer 30B is equal to or lower than the porosity at the end 5a of the adhesive layer 5. Note that, although FIG. 7 shows an example in which the adhesive 51 and the sealant 52 are clearly separated, the adhesive 51 and the sealant 52 may be mixed.

In this way, by covering the entire outer surfaces 21b, 22b of the first substrate 21 and the second substrate 22 with adhesive 51, the heat resistance and chemical resistance of the container 20 can be improved.

<Third Modification>
Fig. 8 is an enlarged cross-sectional view of the non-contact communication medium according to the third modified example, and Fig. 9 is a diagram showing another example of the covering layer according to the third modified example.

As shown in FIG. 8, the non-contact communication medium 1C according to the third modified example further includes a coating layer 30C. The coating layer 30C is made of, for example, a sealing agent 52.

The coating layer 30C according to the third modification covers the end 5a of the adhesive layer 5 and covers the entire outer surfaces 21b, 22b of the first substrate 21 and the second substrate 22. Furthermore, the coating layer 30C according to the third modification covers a part including the outer periphery of the lower end surface 21c of the first substrate 21 that is continuous with the outer periphery 21b of the first substrate 21, and a part including the outer periphery of the upper end surface 22c of the second substrate 22 that is continuous with the outer periphery 22b of the second substrate 22.

In this way, the coating layer 30C may extend over a portion of the other surfaces (lower end surface 21c and upper end surface 22c) of the outer surface of the housing 20 that are continuous with the outer peripheral surfaces 21b, 22b of the first substrate 21 and the second substrate 22. This makes it possible to more reliably prevent the plating solution and the like from entering the housing space 25.

As shown in FIG. 9, the coating layer 30C may be composed of an adhesive 51 and a sealing agent 52. In this case, the adhesive 51 of the coating layer 30C may be located only on the outer peripheral surfaces 21b, 22b of the first substrate 21 and the second substrate 22.

<Fourth Modification>
Fig. 10 is an enlarged cross-sectional view of a non-contact communication medium according to the fourth modified example, and Fig. 11 is a diagram showing another example of a covering layer according to the fourth modified example.

As shown in FIG. 10, the non-contact communication medium 1D according to the fourth modified example further includes a coating layer 30D. The coating layer 30D is made of, for example, a sealing agent 52.

The coating layer 30D in the fourth modified example covers the entire surface of the container 20. In this way, by covering the entire container 20 with the coating layer 30D, it is possible to more reliably prevent the plating solution and the like from entering the container space 25.

As shown in FIG. 11, the coating layer 30D may be composed of an adhesive 51 and a sealing agent 52. In this case, the adhesive 51 of the coating layer 30D may be located only on the outer peripheral surfaces 21b, 22b of the first substrate 21 and the second substrate 22.

<Fifth Modification>
Fig. 12 is a cross-sectional view of a non-contact communication medium according to a fifth modified example. A container 20E of a non-contact communication medium 1E shown in Fig. 12 has a dense member 40 between a first base material 21 and a second base material 22 and on the outside of an adhesive layer 5E.

The dense member 40 may have a lower porosity than the end 5a of the adhesive layer 5E, i.e., may be denser than the end 5a of the adhesive layer 5E. For example, the dense member 40 may be the sealing agent 52 described above. The dense member 40 may also be a heat-resistant resin such as PEEK (polyether ether ketone), polyimide, or silicone.

In this way, the non-contact communication medium 1E may have a dense member 40 between the first substrate 21 and the second substrate 22 and on the outside of the adhesive layer 5E. By covering the outside of the adhesive layer 5E with the dense member 40, it is possible to more reliably prevent the intrusion of plating solution and the like into the storage space 25. In addition, by positioning the dense member 40 between the first substrate 21 and the second substrate 22, it is possible to reduce unevenness in the storage body 20E, thereby preventing damage to the storage body 20E such as chipping or cracking.

<Sixth Modification>
Fig. 13 is a plan view of a non-contact communication medium according to a sixth modified example, and Fig. 14 is a cross-sectional view taken along line XIV-XIV in Fig. 13.

As shown in Figures 13 and 14, the non-contact communication medium 1H according to the sixth modified example has a container 20H.

The container 20H according to the sixth modified example has a first substrate 21H and a second substrate 22 made of ceramics, and an adhesive layer 5H, and the first substrate 21H and the second substrate 22 are bonded to each other via the adhesive layer 5H.

The first substrate 21H has a cylindrical shape, with flat surfaces (upper end surface and lower end surface) that are circular when viewed from above at both ends, and a curved surface (outer peripheral surface) that connects these end surfaces.

One end face of the first substrate 21H (hereinafter referred to as the first flat surface 211) has an accommodation hole 25Ha in which the electronic component 10 is accommodated. The accommodation hole 25Ha opens in the center of the first flat surface 211 and extends perpendicular to the first flat surface 211. The accommodation hole 25Ha has a circular shape in a plan view.

The second substrate 22H has a cylindrical shape, with flat surfaces (upper and lower end surfaces) that are circular in plan view at both ends, and a curved surface (outer peripheral surface) that connects these end surfaces. The planar shape of the second substrate 22H is the same circle as the planar shape of the accommodation hole 25Ha, and has a smaller diameter than the planar shape of the accommodation hole 25Ha.

Such second substrate 22H is inserted into accommodation hole 25Ha. When inserted into accommodation hole 25Ha, one end surface of second substrate 22H (hereinafter referred to as second flat surface 221) is flush with first flat surface 211 of first substrate 21H. In this manner, second substrate 22H is nested and inserted into accommodation hole 25Ha.

The adhesive layer 5H is located between the inner circumferential surface 251 of the accommodation hole 25Ha and the outer circumferential surface 222 of the second substrate 22H, and bonds the first substrate 21H and the second substrate 22H. As a result, the accommodation hole 25Ha is blocked by the second substrate 22 and the adhesive layer 5H, and the electronic component 10 accommodated in the accommodation hole 25Ha is sealed. The inside of the accommodation hole 25Ha blocked by the second substrate 22H and the adhesive layer 5H becomes the accommodation space 25H, and the electronic component 10 is positioned away from the second substrate 22H and the adhesive layer 5H.

In this way, the non-contact communication medium 1H according to the embodiment has a structure in which the electronic component 10 in the accommodation hole 25Ha is sealed by blocking the accommodation hole 25Ha with the second substrate 22H. In such a non-contact communication medium 1H, the adhesive layer 5H that bonds the first substrate 21H and the second substrate 22H is located between the inner peripheral surface of the accommodation hole 25Ha and the outer peripheral surface of the second substrate 22, i.e., within the accommodation hole 25Ha. In other words, the adhesive layer 5H, which is the joint portion of the accommodation body 20H, is hardly exposed to the outside. Therefore, according to the non-contact communication medium 1H according to the embodiment, peeling of the joint portion of the accommodation body 20H is unlikely to occur.

In such a non-contact communication medium 1H, the adhesive layer 5H has a lower porosity at the end 5Ha, which is relatively close to the outside of the housing 20H, than at the inside 5Hb, which is relatively close to the housing space 25H. This makes it possible to prevent external liquids and gases from entering through the joints of the housing 20H. In addition, the electronic component 10 can be appropriately protected from high-temperature environments.

The non-contact communication medium 1H may have a coating layer, as in the first to fifth modified examples described above. That is, the non-contact communication medium 1H may have a coating layer that covers the end 5Ha of the adhesive layer 5H. This coating layer may cover not only the adhesive layer 5H, but also part or all of the first flat surface 211 and the second flat surface 221. The coating layer may also cover part or all of the outer circumferential surface of the first substrate 21H.

<Seventh Modification>
In the seventh to tenth modified examples shown below, examples in which the container is composed of three or more base materials will be described. First, the seventh modified example will be described with reference to Fig. 15 and Fig. 16. Fig. 15 is a plan view of a non-contact communication medium according to the seventh modified example. Fig. 16 is a cross-sectional view taken along the line XVI-XVI shown in Fig. 15.

As shown in Figs. 15 and 16, the non-contact communication medium 1J according to the seventh modified example has an electronic component 10 and a container 20J. The electronic component 10 is, for example, an RFID tag.

The container 20J according to the seventh modified example has a first substrate 21J, a second substrate 22J, a third substrate 23J, and two adhesive layers 5J. In the example shown in FIG. 16, the first substrate 21J, the second substrate 22J, and the third substrate 23J are stacked from the bottom in the order of the third substrate 23J, the first substrate 21J, and the second substrate 22J.

The first substrate 21J has a relatively flat cylindrical shape. Specifically, the first substrate 21J has a through hole 25Ja that passes through the first substrate 21J from top to bottom. The second substrate 22J and the third substrate 23J each have a relatively flat cylindrical shape.

The first substrate 21J and the second substrate 22J are bonded to each other via an adhesive layer 5J. Similarly, the second substrate 22J and the third substrate 23J are bonded to each other via an adhesive layer 5J. This closes the through-hole 25Ja of the first substrate 21J, forming a storage space 25J for the electronic component 10 inside the housing body 20J.

In this manner, the housing 20J may be formed by bonding three base materials 21J to 23J with an adhesive layer 5J. By stacking three or more base materials 21J to 23J, the housing 20J can be made thicker in the stacking direction of the base materials 21J to 23J. This can improve, for example, the heat resistance and chemical resistance of the housing 20J.

<Eighth Modification>
Fig. 17 is a cross-sectional view of a non-contact communication medium according to Modification Example 8. As shown in Fig. 17, a container 20K of a non-contact communication medium 1K according to Modification Example 8 has a first base material 21K.

The first substrate 21K may have an annular recess 25Jb surrounding the through hole 25Ja, for example, on the surface (upper end surface) facing the second substrate 22J. The recess 25Jb functions, for example, as a space for storing plating solution or the like that has entered from the outside. This makes it possible to prevent external liquid or gas from reaching the storage space 25J through the joint portion of the storage body 20K.

Note that the recesses 25Jb do not necessarily have to be circumferential. For example, the first substrate 21K may have multiple recesses that are circular in plan view, and these multiple recesses may be arranged circumferentially.

In addition, while an example is shown here in which the recess 25Jb is provided in the first substrate 21K, the recess 25Jb may be provided in the second substrate 22 or the third substrate 23J.

<Ninth Modification>
Fig. 18 is a cross-sectional view of a non-contact communication medium according to a ninth modification. As shown in Fig. 18, a container 20L of a non-contact communication medium 1L according to the ninth modification has a first base material 21L.

The first substrate 21L according to the ninth modified example is made up of two cylindrical members arranged concentrically. Specifically, the first substrate 21L has a first cylindrical member 21L1 and a second cylindrical member 21L2 located outside the first cylindrical member 21L1. The first cylindrical member 21L1 has a first through hole 25La which serves as the storage space 25J for the electronic component 10. Furthermore, the second cylindrical member 21L2 has a second through hole 25Lb.

The container 20L having the first base material 21L has a gap between the first cylindrical member 21L1 and the second cylindrical member 21L2. This gap, like the recess 25Jb described above, functions as a space for storing, for example, plating solution that has entered from the outside. This makes it possible to prevent external liquids or gases from reaching the container space 25J through the joints of the container 20L.

<Tenth Modification>
Fig. 19 is a cross-sectional view of a non-contact communication medium according to Modification 10. As shown in Fig. 19, a container 20M of a non-contact communication medium 1M according to Modification 10 has a second base material 22M and a third base material 23M.

The second substrate 22M according to the tenth modified example has a recess 22Ma on the surface (lower end surface) facing the first substrate 21J. The recess 22Ma communicates with the through hole 25Ja of the first substrate 21J when the first substrate 21J and the second substrate 22M are joined.

Similarly, the third substrate 23M according to the tenth modified example has a recess 23Ma on the surface (upper end surface) facing the first substrate 21J. The recess 23Ma communicates with the through hole 25Ja of the first substrate 21J when the first substrate 21J and the third substrate 23M are joined.

In this way, by providing the recesses 22Ma, 23Ma in the second substrate 22M and the third substrate 23M, which communicate with the through-hole 25Ja in the first substrate 21J, the storage space 25J for the electronic component 10 can be made larger. This can make it difficult for heat from the outside to be transferred to the electronic component 10, for example. Note that the recesses 22Ma, 23Ma do not necessarily need to be formed in the second substrate 22M and the third substrate 23M. The recesses 22Ma, 23Ma may be formed in only one of the second substrate 22M and the third substrate 23M.

In the sixth to tenth modified examples described above, the storage space 25J for the electronic component 10 may be filled with, for example, a porous body. The same applies to the recess 25Jb in the eighth modified example and the gap between the first cylindrical member 21L1 and the second cylindrical member 21L2 in the ninth modified example.

In the sixth to tenth modified examples described above, the adhesive layer 5J may have a density difference such that the outside is greater than the inside. In other words, the porosity of the adhesive layer 5J at the ends may be lower than the porosity at the inside.

In the sixth to tenth modified examples described above, examples were described in which the container has three base materials, but the container may also be formed by stacking four or more base materials.

<Eleventh Modification>
Fig. 20 is a perspective view of a non-contact communication medium according to an eleventh modified example, and Fig. 21 is a cross-sectional view of the non-contact communication medium according to the eleventh modified example.

As shown in FIG. 20, the non-contact communication medium 1N according to the eleventh modified example has a container 20N. The container 20N has a first substrate 21N, a second substrate 22N, and an adhesive layer 5N.

The first substrate 21N has a relatively flat cylindrical shape. Specifically, the first substrate 21N has two flat surfaces (upper end surface and lower end surface) that are circular in plan view, and a curved surface (outer peripheral surface) that connects these two flat surfaces.

More specifically, the first substrate 21N has a first substrate 21N1 and a second substrate 21N2. The first substrate 21N1 and the second substrate 21N2 have a relatively flat cylindrical shape.

The first first substrate 21N1 and the second first substrate 21N2 are joined at the lower end surface 215 of the first first substrate 21N1 and the upper end surface 216 of the second first substrate 21N2. The first first substrate 21N1 and the second first substrate 21N2 are joined, for example, when the molded or sintered bodies of the first first substrate 21N1 and the second first substrate 21N2 are stacked and fired, glass components in the grain boundaries are fused and fixed to each other. The lower end surface 215 of the first first substrate 21N1 and the upper end surface 216 of the second first substrate 21N2 may be joined, for example, by an adhesive layer.

The first substrate 21N has a storage hole 25N that extends from the outer peripheral surface of the first substrate 21N toward the inside of the first substrate 21N. The storage hole 25N is composed of a first groove portion 217 located on the lower end surface 215 of the first substrate 21N1 and a second groove portion 218 located on the upper end surface 216 of the second substrate 21N2.

Specifically, the first groove portion 217 extends, for example, from the outer edge of the first substrate 21N1 toward the center. When the first groove portion 217 is viewed along the extending direction of the first groove portion 217, the first groove portion 217 has, for example, a semicircular shape. The second groove portion 218 extends from the outer edge of the second substrate 21N2 toward the center. When the second groove portion 218 is viewed along the extending direction of the second groove portion 218, the second groove portion 218 has, for example, a semicircular shape. The accommodation hole 25N formed by the first groove portion 217 and the second groove portion 218 is a cylindrical space extending from the outer peripheral surface of the first substrate 21N toward the inside (center) of the first substrate 21N. The electronic component 10 is accommodated in the accommodation hole 25N.

The second substrate 22N has a cylindrical shape. Specifically, the second substrate 22N has flat surfaces that are circular when viewed from above at both ends (the left and right end faces in FIG. 21), and a curved surface (outer peripheral surface) that connects these end faces. The planar shape of the second substrate 22N is the same circle as the planar shape of the accommodation hole 25N, and has a smaller diameter than the planar shape of the accommodation hole 25N.

The second substrate 22N is inserted into the accommodation hole 25N. When inserted into the accommodation hole 25N, one end face of the second substrate 22N (hereinafter referred to as the first flat surface 225) is flush with, for example, the outer peripheral surface of the first substrate 21N. In this way, the second substrate 22N is nested and inserted into the accommodation hole 25N.

The adhesive layer 5N is located between the inner circumferential surface of the accommodation hole 25N and the outer circumferential surface of the second substrate 22N, and bonds the first substrate 21N and the second substrate 22N. As a result, the accommodation hole 25N is blocked by the second substrate 22N and the adhesive layer 5N, and the electronic component 10 accommodated in the accommodation hole 25N is sealed. The inside of the accommodation hole 25N blocked by the second substrate 22N and the adhesive layer 5N becomes an accommodation space, and the electronic component 10 is positioned away from the second substrate 22N and the adhesive layer 5N.

In this way, the non-contact communication medium 1N according to the embodiment has a structure in which the electronic component 10 in the accommodation hole 25N is sealed by blocking the accommodation hole 25N with the second substrate 22N. In such a non-contact communication medium 1N, the adhesive layer 5N that bonds the first substrate 21N and the second substrate 22N is located between the inner peripheral surface of the accommodation hole 25N and the outer peripheral surface of the second substrate 22, i.e., within the accommodation hole 25N. In other words, the adhesive layer 5N, which is the bonding portion of the accommodation body 20N, is hardly exposed to the outside. Therefore, according to the non-contact communication medium 1N according to the embodiment, peeling of the bonding portion of the accommodation body 20N is unlikely to occur.

In the non-contact communication medium 1N, the adhesive layer 5N may have a lower porosity at the end relatively close to the outside of the housing 20N than the porosity at the inside relatively close to the housing hole 25N. This can prevent external liquids and gases from entering through the joint of the housing 20N. Also, the electronic component 10 can be appropriately protected from high-temperature environments. The non-contact communication medium 1N may also have a coating layer. That is, the non-contact communication medium 1N may have a coating layer that covers at least the end of the adhesive layer 5N.

<Twelfth Modification>
22 is a view of the accommodation hole according to the 12th modification seen along the extension direction of the accommodation hole. Note that the configuration of the non-contact communication medium 1P according to the 12th modification other than the accommodation hole 25P is the same as the configuration of the non-contact communication medium 1N according to the 11th modification.

As shown in FIG. 22, the accommodation hole 25P of the non-contact communication medium 1P according to the 12th modified example may have a shape in which the first groove portion 217 of the first first substrate 21P1 and the second groove portion 218 of the second first substrate 21P2 are offset in the circumferential direction of the first substrate 21P. With this configuration, the bonding area of the adhesive layer 5P is increased, so that the first substrate 21P and the second substrate 22P can be bonded more firmly. Therefore, the non-contact communication medium 1P according to the 12th modified example can improve reliability.

The non-contact communication medium 1P may have a coating layer. That is, the non-contact communication medium 1P may have a coating layer that covers at least the end of the adhesive layer 5P.

<Thirteenth Modification>
23 is a cross-sectional view of a non-contact communication medium according to the 13th modification. The configuration of the non-contact communication medium 1Q according to the 13th modification, other than the accommodation hole 25Q, is the same as the configuration of the non-contact communication medium 1N according to the 11th modification.

As shown in FIG. 23, the non-contact communication medium 1Q of the thirteenth modified example has a first substrate 21Q, a second substrate 22Q, and an adhesive layer (not shown here).

The accommodation hole 25Q of the non-contact communication medium 1Q according to the thirteenth modified example may have a step 255 at the bottom in the extension direction. For example, the accommodation hole 25Q having the step 255 can be obtained by forming the first groove portion 217 of the first first substrate 21Q1 longer than the second groove portion 218 of the second first substrate 21Q2. The same applies when the second groove portion 218 is formed longer than the first groove portion 217. The first first substrate 21Q1 and the second first substrate 21Q2 may also be joined in a state where they are shifted along the extension direction of the first groove portion 217 and the second groove portion 218. In this case as well, the accommodation hole 25Q having the step 255 can be obtained.

In this way, by providing a step 255 at the bottom of the accommodation hole 25Q, the electronic component 10 is less likely to come into surface contact with the first substrate 21Q, and the contact area between the electronic component 10 and the first substrate 21Q can be reduced. This makes it more difficult for heat to be transferred to the electronic component 10, thereby improving the reliability of the non-contact communication medium 1Q.

The non-contact communication medium 1Q may have a coating layer. That is, the non-contact communication medium 1Q may have a coating layer that covers at least the end of the adhesive layer (not shown here).

<Fourteenth Modification>
Fig. 24 is a cross-sectional view of a non-contact communication medium according to the fourteenth modification. Fig. 25 is a plan view of a first substrate according to the fourteenth modification. The cross-sectional view shown in Fig. 24 is a cross-sectional view taken along the arrows XXIV-XXIV shown in Fig. 25. The configuration of the non-contact communication medium 1R according to the fourteenth modification, other than the first substrate 21R, is the same as the configuration of the non-contact communication medium 1 according to the embodiment.

As shown in FIG. 24, the container 20R of the non-contact communication medium 1R according to the 14th modified example has a first substrate 21R, a second substrate 22R, and an adhesive layer 5R. The first substrate 21R and the second substrate 22R are bonded to each other via the adhesive layer 5R.

A storage recess 25a is located on the flat surface 21a (upper end surface) of the first substrate 21R. The storage recess 25a opens in the center of the flat surface 21a. The first substrate 21R and the second substrate 22R are joined via an adhesive layer 5R, thereby closing off the flat surface 21a of the first substrate 21R. This forms a sealed storage space 25R. The electronic component 10 is sealed in this storage space 25R.

Furthermore, a plurality of protrusions 26 are located on the flat surface 21a of the first substrate 21R. As shown in FIG. 25, the plurality of protrusions 26 are arranged, for example, in a circumferential manner so as to surround the accommodation recess 25a. Here, an example is shown in which four protrusions 26 are located on the flat surface 21a of the first substrate 21R, but the number of protrusions 26 may be five or more. The number of protrusions 26 may also be three or less. The plurality of protrusions 26 does not necessarily have to be arranged in a circumferential manner.

In addition, although an example is shown here in which the multiple protrusions 26 are located inside the housing 20R relative to the end 5a of the adhesive layer 5R, the multiple protrusions 26 may also be located at the end 5a of the adhesive layer 5R. Also, the multiple protrusions 26 may be located on the flat surface 22a of the second substrate 22R.

In this way, the non-contact communication medium 1R according to the 14th modified example has multiple protrusions 26. In this case, the protrusions 26 can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1R via the adhesive layer 5R. Therefore, according to the non-contact communication medium 1R according to the 14th modified example, the heat insulating effect can be improved. In addition, the progression of cracks can be suppressed.

The non-contact communication medium 1R may have a coating layer. That is, the non-contact communication medium 1R may have a coating layer that covers at least the end of the adhesive layer 5R.

<Fifteenth Modification>
Fig. 26 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 15. As shown in Fig. 26, a container 20S of a non-contact communication medium 1S according to Modification 15 has a first base material 21S, a second base material 22S, and an adhesive layer 5S.

The convex portion 26S of the first substrate 21S has a curved convex shape in a cross-sectional view. The second substrate 22S also has a concave portion 27S at a position on the flat surface 22a opposite the convex portion 26S.

In the cross-sectional view shown in FIG. 26, specifically, in a cross-sectional view of the container 20S cut along a plane perpendicular to the flat surface 21a of the first substrate 21S and the flat surface 22a of the second substrate 22S and passing through the centers of the flat surfaces 21a and 22a, the width W1 of the recess 27S is smaller than the width W2 of the protrusion 26S. In this case, the protrusion 26S contacts the opening end 27S1 of the recess 27S to close the recess 27S. The internal space 27S2 of the recess 27S closed by the protrusion 26S may have a cavity that is not filled with adhesive.

In this way, by making the width of the recess 27S smaller than the width of the protrusion 26S, an internal space 27S2 can be formed between the recess 27S and the protrusion 26S. In this case, the internal space 27S2 acts as a heat insulating layer, and the transfer of heat from the outside to the inside of the non-contact communication medium 1S via the adhesive layer 5S can be inhibited. Therefore, according to the non-contact communication medium 1S of the 15th modified example, the heat insulating effect can be further improved. In addition, the progression of cracks can be further suppressed.

In addition, in the non-contact communication medium 1S according to the fifteenth modification, the position of the recess 27S corresponds to the position of the protrusion 26S, which facilitates the alignment of the first substrate 21S and the second substrate 22S during the manufacturing process of the non-contact communication medium 1S.

The non-contact communication medium 1S may have a coating layer. That is, the non-contact communication medium 1S may have a coating layer that covers at least the end of the adhesive layer 5S.

<16th Modification>
Fig. 27 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 16. As shown in Fig. 27, a container 20T of a non-contact communication medium 1T according to Modification 16 has a first base material 21T, a second base material 22T, and an adhesive layer 5T.

The convex portion 26T of the first substrate 21T is rectangular and has a flat tip surface. On the other hand, the inner surface of the concave portion 27T of the second substrate 22T is curved. In addition, the width W1 of the concave portion 27T of the second substrate 22T is greater than the width W2 of the convex portion 26T.

In this case, the protrusion 26T contacts the curved inner surface of the recess 27T to close the recess 27T. The internal space 27T2 of the recess 27T closed by the protrusion 26T may have a cavity that is not filled with adhesive. In such a case, the internal space 27T2 serves as a heat insulating layer, which can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1T via the adhesive layer 5T. Therefore, according to the non-contact communication medium 1T of the 16th modified example, the heat insulating effect can be further improved. In addition, the progression of cracks can be further suppressed.

In addition, in the non-contact communication medium 1T according to the 16th modified example, the position of the recess 27T corresponds to the position of the protrusion 26T, which makes it easier to align the first substrate 21T and the second substrate 22T during the manufacturing process of the non-contact communication medium 1T.

The non-contact communication medium 1T may have a coating layer. That is, the non-contact communication medium 1T may have a coating layer that covers at least the end of the adhesive layer 5T.

<Seventeenth Modification>
Fig. 28 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 17. As shown in Fig. 28, a container 20U of a non-contact communication medium 1U according to Modification 17 has a first base material 21U, a second base material 22U, and an adhesive layer 5U.

The protrusion 26U of the first substrate 21U and the recess 27U of the second substrate 22U have a curved concave shape in cross-sectional view. Furthermore, the width W1 of the recess 27U is greater than the width W2 of the protrusion 26U. In this case, the protrusion 26U comes into contact with the recess 27U.

In this way, it is not necessary that an internal space (cavity) is located between the first substrate 21U and the second substrate 22U. Even in such a case, the transfer of heat from the outside to the inside of the non-contact communication medium 1U via the adhesive layer 5U can be inhibited by the convex portion 26U. Therefore, according to the non-contact communication medium 1U of the 17th modification, the heat insulating effect can be improved. In addition, the progression of cracks can be suppressed. Furthermore, according to the non-contact communication medium 1U of the 17th modification, the alignment of the first substrate 21U and the second substrate 22U can be facilitated in the manufacturing process of the non-contact communication medium 1U.

The non-contact communication medium 1U may have a covering layer. That is, the non-contact communication medium 1U may have a covering layer that covers at least the end of the adhesive layer 5U.

<18th Modification>
Fig. 29 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 18. As shown in Fig. 29, a container 20V of a non-contact communication medium 1V according to Modification 18 has a first base material 21V, a second base material 22V, and an adhesive layer 5V.

The convex portion 26V of the first substrate 21V and the concave portion 27V of the second substrate 22V have a curved concave shape in a cross-sectional view. The width of the concave portion 27V of the second substrate 22V is the same as the width of the convex portion 26V of the first substrate 21V. In addition, the depth of the concave portion 27V is the same as the protruding height of the convex portion 26V.

In the non-contact communication medium 1V according to the 18th modification, the convex portion 26V is not in contact with the concave portion 27V, and the adhesive layer 5V is interposed between the convex portion 26V and the concave portion 27V. In this way, the convex portion 26V does not necessarily need to be in contact with the second substrate 22V. Even in such a case, the convex portion 26V can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1V via the adhesive layer 5V. Therefore, according to the non-contact communication medium 1V according to the 18th modification, the heat insulating effect can be improved. In addition, the progression of cracks can be suppressed. In addition, according to the non-contact communication medium 1V according to the 18th modification, the alignment of the first substrate 21V and the second substrate 22V can be facilitated in the manufacturing process of the non-contact communication medium 1V.

The non-contact communication medium 1V may have a coating layer. That is, the non-contact communication medium 1V may have a coating layer that covers at least the end of the adhesive layer 5V.

<Nineteenth Modification>
Fig. 30 is a cross-sectional view of a non-contact communication medium according to the 19th modified example. Fig. 31 is a plan view of a first substrate according to the 19th modified example. The cross-sectional view shown in Fig. 31 is a cross-sectional view taken along the arrows of line XXXI-XXXI shown in Fig. 30. The configuration of the non-contact communication medium 1W according to the 19th modified example, other than the first substrate 21W, is the same as the configuration of the non-contact communication medium 1 according to the embodiment.

As shown in FIG. 30, the container 20W of the non-contact communication medium 1W according to the 19th modified example has a first substrate 21W, a second substrate 22W, and an adhesive layer 5W. The first substrate 21W and the second substrate 22W are bonded to each other via the adhesive layer 5W.

An accommodating recess 25a is located on the flat surface 21a (upper end surface) of the first substrate 21W. The accommodating recess 25a opens in the center of the flat surface 21a. The first substrate 21W and the second substrate 22W are joined via an adhesive layer 5W, thereby closing the flat surface 21a of the first substrate 21W. This forms a sealed accommodating space 25W. The electronic component 10 is sealed in this accommodating space 25W.

Furthermore, a plurality of recesses 28 are located on the flat surface 21a of the first substrate 21W. As shown in FIG. 31, the plurality of recesses 28 are arranged, for example, in a circumferential manner so as to surround the accommodating recess 25a. Here, an example is shown in which four recesses 28 are located on the flat surface 21a of the first substrate 21W, but the number of recesses 28 may be five or more. The number of recesses 28 may also be three or less.

The recesses 28 do not necessarily have to be arranged circumferentially. Although an example is shown here in which the recesses 28 are located inside the housing 20W relative to the end 5a of the adhesive layer 5W, the recesses 28 may be located at the end 5a of the adhesive layer 5W. The recesses 28 may also be located on the flat surface 22a of the second substrate 22W.

In this way, the non-contact communication medium 1W according to the 19th modified example has multiple recesses 28. In this case, the space inside the recesses 28 acts as an insulating layer, which can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1W. Therefore, according to the non-contact communication medium 1W according to the 19th modified example, the insulating effect can be improved. In addition, the gaps in the recesses 28 can suppress the progression of cracks.

Note that, although an example in which the inside of the recess 28 is hollow has been shown here, the inside of the recess 28 may be filled with adhesive. Even in such a case, the recess 28 can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1W.

The non-contact communication medium 1W may have a coating layer. That is, the non-contact communication medium 1W may have a coating layer that covers at least the end of the adhesive layer 5W.

In this example, a case where multiple recesses 28 are arranged circumferentially has been shown, but the first substrate 21W may have an annular recess 28 surrounding the accommodating recess 25a. By having an annular recess 28, the heat insulating effect can be improved and the progression of cracks can be suppressed. The first substrate 21W may have multiple such annular recesses 28. In this case, the heat insulating effect can be further improved and the progression of cracks can be further suppressed.

<Other Modifications>
The end of the adhesive layer may be covered with, for example, water glass, metal, etc. That is, the covering layer may be water glass, metal, etc. In this case, the covering layer may have, for example, a second covering layer made of at least one of water glass and metal on the outside of a first covering layer made of at least one of an adhesive and a sealant. This can further prevent external liquid or gas from entering through the joint of the container.

The ceramics constituting the first and second substrates are not limited to cordierite. For example, the ceramics constituting the first and second substrates may be Al ₂ O ₃ (alumina), Si ₃ N ₄ (silicon nitride), SiC (silicon carbide), or Al ₂ TiO ₅ (aluminum titanate). The ceramics constituting the first and second substrates may be crystallized glass such as Li ₂ O-Al ₂ O ₃ -SiO ₂ .

The container preferably has a lightness index L* (a value of the dimension L that represents lightness in the Lab color space) of 50 or more. This makes dirt on the container more noticeable, making it easier to determine when to replace it. Also, compared to a container with a lightness index L* of less than 50 (i.e., a dark color), heat is less likely to build up, making it harder for heat to be transferred to electronic components. The lightness of the container can be adjusted, for example, by using pigments (see, for example, Patent No. 5762522 and Patent No. 5744045).

The first and second substrates may also be different colors. This improves top and bottom visibility, making it easier to attach the non-contact communication medium to the components to be monitored. For example, when an operator wishes to place an electronic component closer to the components to be monitored, the operator can easily identify the first substrate, of the first and second substrates, that houses the electronic component, and place the first substrate closer to the components to be monitored.

When the first and second substrates are different in color, the color of the first substrate on which the electronic components are housed may be brighter than the color of the second substrate. This improves top and bottom visibility while making it difficult for heat to be transferred to the electronic components. In addition, it is preferable that the electronic components are far away from members with a low brightness index. This makes it difficult for heat to be transferred by the electronic components.

The electronic component is not limited to an RFID tag, but may be any other electronic component that performs non-contact communication. For example, the electronic component may be a sensor with a non-contact communication function. The sensor may also be a sensor that measures the processing environment of the component to be monitored, such as a temperature sensor.

The part to which the non-contact communication medium is attached is not limited to a part to be plated. For example, the non-contact communication medium may be attached to a part such as a cast piece produced in a metal casting factory.

The non-contact communication medium according to the present disclosure may also be used for item management during the vulcanization process in the manufacturing process of rubber products.

The vulcanization process is a process in which the sulfur or peroxides blended into the rubber-based raw materials are chemically reacted over time and temperature to crosslink the molecules in order to increase the elastic limit of the raw materials. Note that pressure may also be applied during the vulcanization process. The temperature during the vulcanization process is, for example, 100°C to 200°C. The pressure during the vulcanization process is, for example, 0.5 MPa to 2 MPa.

As an example, the non-contact communication medium according to the present disclosure may be attached to a used tire that is to be recycled as a retread tire. A retread tire is obtained by scraping the surface of a used tire, attaching a new rubber sheet on top of it, and then vulcanizing it.

There are two known vulcanization processes for retread tires: the remolding method and the precure method. The remolding method is a method in which an unvulcanized rubber sheet is bonded to the surface of a used tire, and then the tire is vulcanized at high temperature and high pressure using a mold. The precure method is a method in which a vulcanized rubber sheet is bonded to the surface of a used tire, and then the tire is vulcanized at low temperature and low pressure in a vulcanizer. The non-contact communication medium according to the present disclosure can be applied to both the remolding method and the precure method. In particular, the precure method is intended for small-lot, high-mix production, and therefore involves a relatively large number of manual inspection processes. In contrast, by managing items using the non-contact communication medium according to the present disclosure, it is possible to reduce personnel costs and increase the production efficiency of retread tires.

It is preferable that the non-contact communication medium according to the present disclosure is attached to a location other than the tread portion where the rubber sheet is attached. For example, the non-contact communication medium according to the present disclosure may be placed inside a used tire.

The non-contact communication medium according to the present disclosure may also be attached to a medical instrument (e.g., forceps, needle holder, etc.).

In the medical field, issues include how to prevent medical instruments from being left behind in the body, streamline the management of medical instruments, and prevent the mix-up of medical instruments during surgery. In response to these issues, attaching the non-contact communication medium disclosed herein to medical instruments makes it possible to manage each individual medical instrument using an RFID tag, which can contribute to solving the above issues.

The non-contact communication medium according to the present disclosure may also be used for marking to identify lesions within the body.

A conventional marking method is the use of a dye for biological tissue staining. With this method, lesions found inside the body during an examination are stained with a dye. However, with this method, the staining range is wide and the dye diffuses over time, making it difficult to precisely identify the lesion. Another proposed marking method involves placing a metal needle or clip at the lesion. However, this method has issues such as the need to prepare a CT scan device during surgery and the risk of excessive radiation exposure.

When using the non-contact communication medium according to the present disclosure for marking, first, the non-contact communication medium according to the present disclosure is placed at the lesion site before surgery. Then, during surgery, a sensor antenna is used to measure, for example, the distance between the RFID tag and the sensor antenna, thereby estimating the position of the RFID, i.e., the position of the lesion site.

As described above, when the non-contact communication medium according to the present disclosure is used for marking, it is desirable that the non-contact communication medium according to the present disclosure be as small as possible, since it is placed inside the body. In this regard, the ceramics constituting the container of the present disclosure have a higher dielectric constant than, for example, resin, and are less likely to impede RFID communication. For this reason, the non-contact communication medium of the present disclosure can be made smaller than, for example, a non-contact communication medium having a container made of resin.

The adhesive layer may contain more chemical-resistant resin at the end relatively closer to the exterior of the container than at the interior relatively closer to the container space.

The chemical-resistant resin is, for example, a resin that is more chemically resistant than the glass component contained in the adhesive 51. Examples of chemical-resistant resins include PEEK (polyether ether ketone), PI (polyimide), and PBI (polybenzimidazole).

In this way, by containing a large amount of chemical-resistant resin at the end of the adhesive layer, it is possible to provide a non-contact communication medium suitable for use in acidic or alkaline liquids.

The peripheral edges of the upper and lower end faces of the container may be chamfered. Specifically, the container may have a C-surface or R-surface between the upper end face and the outer periphery. Similarly, the container may have a C-surface or R-surface between the lower end face and the outer periphery. With this configuration, chipping of the container can be suppressed.

In the above-mentioned embodiment and modified example, an exception has been described in which the container has a cylindrical shape, but the shape of the container is not limited to a cylindrical shape. For example, the container may have a spherical shape. For example, a spherical container can be obtained by joining a hemispherical first base material and a second base material with an adhesive layer. In this way, by making the container into a spherical shape without corners, damage such as chipping or cracking of the container 20 can be further suppressed.

As described above, the non-contact communication medium according to the embodiment (for example, non-contact communication media 1, 1A-1E, 1H, 1J-1N, 1P-1W) has a container (for example, containers 20, 20E, 20H, 20J, 20K-20N, 20P-20W) and an electronic component (for example, electronic component 10). The container has an internal storage space (for example, storage spaces 25, 25H, 25J, 25N, 25R, 25W). The electronic component is located in the storage space and performs non-contact communication. The container has at least two ceramic substrates (for example, first substrate 21, 21J-21N, 21P-21W and second substrate 22, 22J, 22M, 22N, 22P-22W) and an adhesive layer (for example, adhesive layers 5, 5E, 5H, 5J, 5N, 5P, 5R-5W) located between the two substrates and bonding the two substrates. A portion of the adhesive layer faces the container space, and the porosity of the end portion (for example, end portion 5a, 5Ha) relatively close to the outside of the container is lower than the porosity of the interior portion (for example, interior portion 5b, 5Hb) relatively close to the container space.

Therefore, the non-contact communication medium according to the embodiment can prevent external liquids or gases from entering through the joints of the container.

The non-contact communication medium according to the embodiment may have a coating layer (as an example, coating layers 30A to 30D) located outside between the two substrates and covering the end of the adhesive layer. In this case, the porosity of the coating layer may be equal to or less than the porosity of the end of the adhesive layer. This can further suppress the intrusion of liquids and the like from the outside.

The covering layer (for example, covering layer 30A) may cover the end of the adhesive layer and a part of the exposed surface of the outer surface of the container where the end is exposed (for example, the outer peripheral surfaces 21b, 22b of the first substrate 21 and the second substrate). This can further prevent the intrusion of liquids, etc. from the outside.

The coating layer (for example, coating layer 30B) may extend over the entire exposed surface. This can further prevent liquids and the like from entering from the outside.

The coating layer (as an example, coating layer 30C) may extend over at least a portion of other surfaces (as an example, lower end surface 21c of first substrate 21 and upper end surface 22c of second substrate 22) that are continuous with the exposed surface of the outer surface of the container. This can further prevent liquids and the like from entering from the outside.

Further advantages and modifications may readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and equivalents thereof.

1: Non-contact communication medium 5: Adhesive layer 5a: End portion 5b: Inside 10: Electronic component 20: Container 21: First substrate 22: Second substrate 25: Storage spaces 30A to 30D: Covering layer 51: Adhesive 52: Sealing agent 511: Gap

Claims (7)

A container having an internal storage space;
and an electronic component that is located in the accommodation space and performs non-contact communication;
The container is
At least two substrates made of ceramics;
an adhesive layer located between the two substrates and bonding the two substrates together;
A non-contact communication medium, wherein a portion of the adhesive layer faces the storage space, and the porosity at an end portion relatively close to the outside of the storage body is lower than the porosity at an inside portion relatively close to the storage space. a covering layer positioned outside the two substrates and covering the end of the adhesive layer;
The non-contact communication medium according to claim 1 , wherein the porosity of the covering layer is equal to or less than the porosity of the end portion of the adhesive layer. The coating layer is
The non-contact communication medium according to claim 2 , wherein the adhesive layer covers the end portion and a part of an exposed surface of the outer surface of the container where the end portion is exposed. The coating layer is
The non-contact communication medium according to claim 3 , wherein the non-contact communication medium extends over the entire exposed surface. The coating layer is
The non-contact communication medium according to claim 4 , which extends over at least a part of another surface of the outer surface of the container that is continuous with the exposed surface. The non-contact communication medium according to any one of claims 2 to 5, wherein the coating layer is made of a sealing agent. The non-contact communication medium according to any one of claims 2 to 5, wherein the coating layer is made of an adhesive and a sealant.

Images