JP7328357B2 - contactless communication medium - Google Patents

Description

The present disclosure relates to contactless communication media.

Conventionally, articles are managed using RFID (Radio Frequency Identifier) tags.

Patent Literature 1 discloses a technique of sealing an RFID tag with a container having a heat insulating property in order to use the RFID tag for managing parts that are processed at high temperatures in a factory or the like. The container described in Patent Document 1 has a container containing an RFID tag and a lid joined to the container. The containing body in which the RFID tag is sealed is attached to the part and flows through the manufacturing process together with the part.

JP-A-2008-129838

A contactless communication medium according to one aspect of the present disclosure has an electronic component and a container. The electronic component performs contactless communication. The container accommodates the electronic component. Further, the container has a body portion, a plug portion, and an adhesive layer. The main body has an accommodation hole in which the electronic component is accommodated. The plug portion is inserted into the accommodation hole. The adhesive layer is positioned between the inner peripheral surface of the receiving hole and the outer peripheral surface of the plug, and joins the main body and the plug.

FIG. 1 is a plan view of a contactless communication medium according to an embodiment. FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. FIG. 3 is an enlarged cross-sectional view of a contactless communication medium according to a first modified example. FIG. 4 is an enlarged cross-sectional view of a contactless communication medium according to a second modification. FIG. 5 is an enlarged cross-sectional view of a contactless communication medium according to a third modified example. 6 is a cross-sectional view taken along the line VI-VI shown in FIG. 5. FIG. FIG. 7 is another example of a cross-sectional view taken along line VI-VI shown in FIG. FIG. 8 is an enlarged cross-sectional view of a contactless communication medium according to a fourth modification. 9 is a cross-sectional view taken along line IX-IX shown in FIG. 8. FIG. FIG. 10 is an enlarged cross-sectional view of a contactless communication medium according to a fifth modification. 11 is a cross-sectional view taken along line XI-XI shown in FIG. 10. FIG. FIG. 12 is an enlarged cross-sectional view of a contactless communication medium according to a sixth modification. FIG. 13 is an enlarged cross-sectional view of a contactless communication medium according to a seventh modification. FIG. 14 is an enlarged cross-sectional view of a contactless communication medium according to an eighth modification. FIG. 15 is an enlarged cross-sectional view of a contactless communication medium according to a ninth modification. FIG. 16 is an enlarged cross-sectional view of a contactless communication medium according to a tenth modification. FIG. 17 is a side view of a contactless communication medium according to the eleventh modification. FIG. 18 is a plan view of a contactless communication medium according to the eleventh modification. 19 is a cross-sectional view taken along line XIX-XIX shown in FIG. 18. FIG. FIG. 20 is an enlarged cross-sectional view of a contactless communication medium according to a twelfth modification. FIG. 21 is an enlarged cross-sectional view of a contactless communication medium according to a thirteenth modification. FIG. 22 is an enlarged cross-sectional view of a contactless communication medium according to a fourteenth modification. FIG. 23 is an enlarged cross-sectional view of a contactless communication medium according to a fifteenth modification. FIG. 24 is an enlarged cross-sectional view of a contactless communication medium according to a sixteenth modification. FIG. 25 is an enlarged cross-sectional view of a contactless communication medium according to the seventeenth modification. FIG. 26 is an enlarged cross-sectional view of a contactless communication medium according to an eighteenth modification. FIG. 27 is an enlarged cross-sectional view of a contactless communication medium according to the nineteenth modification. 28 is a cross-sectional view taken along line XXVIII-XXVIII shown in FIG. 27. FIG. FIG. 29 is an enlarged cross-sectional view of a contactless communication medium according to a twentieth modification. FIG. 30 is an enlarged cross-sectional view of a contactless communication medium according to a twenty-first modification.

Embodiments for implementing the non-contact communication medium according to the present disclosure (hereinafter referred to as "embodiments") will be described in detail below with reference to the drawings. Note that this embodiment does not limit the contactless communication medium according to the present disclosure. Further, each embodiment can be appropriately combined within a range that does not contradict the processing contents. Also, in each of the following embodiments, the same parts are denoted by the same reference numerals, and overlapping descriptions are omitted.

Further, in the embodiments described below, expressions such as "constant", "perpendicular", "perpendicular" or "parallel" may be used, but these expressions are strictly "constant", "perpendicular", " It does not have to be "perpendicular" or "parallel". That is, each of the expressions described above allows deviations in, for example, manufacturing accuracy and installation accuracy.

In addition, in each drawing referred to below, in order to make the explanation easier to understand, an orthogonal coordinate system is shown in which the X-axis direction, the Y-axis direction and the Z-axis direction that are orthogonal to each other are defined, and the Z-axis positive direction is the vertically upward direction. Sometimes.

<Configuration of contactless communication medium>
A configuration of a contactless communication medium according to an embodiment will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a plan view of a contactless communication medium according to an embodiment. FIG. 2 is a cross-sectional view taken along line II-II shown in FIG.

As shown in FIGS. 1 and 2, the contactless communication medium 1 according to the embodiment has an electronic component 10 and a container 20. As shown in FIGS. Electronic component 10 is, for example, an RFID tag.

The electronic component 10 as RFID includes, for example, an antenna for contactless communication, an IC chip for contactless communication via the antenna, and identification information on a substrate made of LTCC (Low Temperature Co-fired Ceramics) or the like. and a stored memory. Electronic component 10 as an RFID can transmit identification information stored in a memory to an external device (for example, an RFID reader) by non-contact communication using electromagnetic induction, radio waves, or the like.

The non-contact communication medium 1 according to the embodiment may be used, for example, in a high-temperature environment exceeding the heat-resistant temperature of the electronic component 10 . For example, the non-contact communication medium 1 according to the embodiment is attached to a component to be plated and plated together with this component. The temperature of the plating solution for hot-dip galvanizing is, for example, 75°C to 500°C. Moreover, the non-contact communication medium 1 according to the embodiment may be treated with acidic chemicals or alkaline chemicals along with the components. That is, the non-contact communication medium 1 according to the embodiment may be used in an acid/alkali environment that exceeds the chemical resistance of the electronic component 10 .

Therefore, in the non-contact communication medium 1 according to the embodiment, the electronic component 10 is sealed with the container 20 in order to protect the electronic component 10 from the high temperature environment and the acid/alkali environment.

On the other hand, if the container containing the electronic components is simply sealed with the lid, the joint between the container and the lid may come off during the manufacturing process. In view of this point, the non-contact communication medium 1 according to the embodiment has a structure in which the joint portion of the container 20 is less likely to come off.

The container 20 has a body portion 21 and a plug portion 22 made of ceramics, and an adhesive layer 23 . The body portion 21 and the plug portion 22 are joined to each other with an adhesive layer 23 interposed therebetween.

The body portion 21 has a columnar shape. The body portion 21 has flat surfaces (upper end surface and lower end surface) that are circular in plan view at both ends, and has a curved surface (peripheral surface) that connects these end surfaces.

A receiving hole 25 for receiving the electronic component 10 is opened in the first flat surface 211 of both end surfaces of the body portion 21 . The accommodation hole 25 opens in the central portion of the first flat surface 211 . Also, the accommodation hole 25 extends perpendicularly to the first flat surface 211 . The accommodation hole 25 has a circular shape in plan view. The accommodation hole 25 is an elongated hole, and the opening diameter of the accommodation hole 25 (the length in the X-axis direction in FIG. 2) is smaller than the depth of the accommodation hole 25 (the length in the Z-axis direction in FIG. 2). .

The plug portion 22 has a columnar shape. The plug portion 22 has flat surfaces (upper end surface and lower end surface) that are circular in plan view at both ends, and has a curved surface (outer peripheral surface) that connects these end surfaces. The planar shape of the plug portion 22 is the same circular shape as the planar shape of the accommodation hole 25 and has a smaller diameter than the planar shape of the accommodation hole 25 .

Such a plug portion 22 is inserted into the accommodation hole 25 . The second flat surface 221 of both end faces of the plug portion 22 is flush with the first flat surface 211 of the main body portion 21 when inserted into the housing hole 25 . In this manner, the plug portion 22 is inserted into the accommodation hole 25 in a telescopic manner.

The adhesive layer 23 is positioned between the inner peripheral surface 251 of the receiving hole 25 and the outer peripheral surface 222 of the plug portion 22 . The adhesive layer 23 joins the body portion 21 and the plug portion 22 . As a result, the accommodation hole 25 is closed by the plug portion 22 and the adhesive layer 23 . Then, the electronic component 10 housed in the housing hole 25 is sealed. The interior of the accommodation hole 25 closed by the plug portion 22 and the adhesive layer 23 is a space. Electronic component 10 is arranged at a position away from plug portion 22 and adhesive layer 23 .

As described above, the contactless communication medium 1 according to the embodiment has a structure in which the electronic component 10 in the accommodation hole 25 is sealed by closing the accommodation hole 25 with the plug portion 22 . In the non-contact communication medium 1, the adhesive layer 23 that joins the body portion 21 and the plug portion 22 is positioned between the inner peripheral surface 251 of the housing hole 25 and the outer peripheral surface 222 of the plug portion 22, that is, inside the housing hole 25. positioned. That is, the adhesive layer 23, which is the joint portion of the container 20, is hardly exposed to the outside. Therefore, according to the contactless communication medium 1 according to the embodiment, peeling of the joint portion of the container 20 is less likely to occur.

Further, in the contactless communication medium 1 according to the embodiment, the second flat surface 221 exposed to the outside of both end surfaces of the plug portion 22 is flush with the first flat surface 211 of the main body portion 21 . As described above, in the contactless communication medium 1, since the plug portion 22 does not protrude from the main body portion 21, it is difficult for the plug portion 22 to receive a direct impact. Therefore, according to the non-contact communication medium 1, peeling of the joint portion of the containing body 20 can be made more difficult to occur.

Further, in the contactless communication medium 1 according to the embodiment, the inside of the housing hole 25 closed by the plug portion 22 and the adhesive layer 23 is a space (cavity). Then, the electronic component 10 is arranged at a position away from the adhesive layer 23 . Therefore, heat from the outside is less likely to be transmitted to the electronic component 10 .

Cordierite, for example, can be used as the ceramics forming main body portion 21 and plug portion 22 . Cordierite has a small coefficient of thermal expansion, and is therefore excellent in thermal shock resistance. Moreover, since cordierite has a low thermal conductivity, it is difficult to conduct heat to the electronic component 10 . Thus, by using cordierite, the electronic component 10 can be appropriately protected from a high-temperature environment. It should be noted that the ceramics forming the body portion 21 and the plug portion 22 are not necessarily cordierite. This point will be described later.

The adhesive layer 23 is made of an adhesive. The adhesive only needs to have heat resistance that can withstand the usage environment of the non-contact communication medium 1 . As such an adhesive, for example, an inorganic adhesive can be used. Further, as the adhesive, an inorganic adhesive to which ceramic powder is added may be used.

<Manufacturing method>
Next, an example of a method for manufacturing the contactless communication medium 1 according to the embodiment will be described.

First, cordierite powder and sintering aid powder are prepared. Sintering aids are, for example, rare earth oxides (yttrium oxide, cerium oxide, etc.), alkali metal oxides (lithium oxide, sodium oxide, etc.), alkaline earth metals (calcium oxide). Instead of cordierite powder, a mixture of magnesium oxide, aluminum oxide, and silicon oxide at a desired cordierite composition ratio may be used. Subsequently, the prepared powder is put into a vibration mill together with water as a solvent, and pulverized and mixed to obtain a raw material.

Subsequently, organic components such as a binder, a plasticizer and a release agent are added to the raw material obtained by pulverizing and mixing. Then, these are stirred to prepare a slurry, and the prepared slurry is spray-dried using a spray dryer. Ceramic granules are thus obtained.

Subsequently, the produced ceramic granules are subjected to powder press molding to obtain molded bodies of the main body portion 21 and the plug portion 22 .

Subsequently, the compact is degreased by heat-treating it in an air atmosphere, a vacuum atmosphere, or a nitrogen gas atmosphere. After that, the body portion 21 and the plug portion 22 are obtained by firing the compact. In order to obtain a desired shape, the molded bodies of the body portion 21 and the plug portion 22 or the fired body portion 21 and the plug portion 22 may be cut and ground.

Subsequently, after housing the electronic component 10 in the housing hole 25 , the plug portion 22 having the outer peripheral surface 222 coated with an adhesive is inserted into the housing hole 25 . As a result, the body portion 21 and the plug portion 22 are joined via the adhesive layer 23, and the electronic component 10 housed in the housing hole 25 is sealed. As described above, the contactless communication medium 1 according to the embodiment is obtained. In this case, the adhesive is applied to the outer peripheral surface 222 of the plug 22 in advance. may be injected into the gap between

<First modification>
FIG. 3 is an enlarged cross-sectional view of a contactless communication medium according to a first modified example. As shown in FIG. 3, a container 20A included in a contactless communication medium 1A according to the first modified example has a main body 21A.

25 A of accommodation holes which the main-body part 21A has have 252 A of bottom surfaces curved concavely. By forming the bottom surface 252A of the housing hole 25A into a curved surface in this way, it is possible to prevent the housing hole 25A (body portion 21A) from being cracked when the housing body 20A thermally expands or contracts.

Further, by forming the bottom surface 252A of the housing hole 25A in a curved shape, the contact area between the bottom surface 252A of the housing hole 25A and the electronic component 10 can be reduced. Therefore, heat conduction from the body portion 21A to the electronic component 10 can be suppressed.

<Second modification>
FIG. 4 is an enlarged cross-sectional view of a contactless communication medium according to a second modification. As shown in FIG. 4, a container 20B included in a contactless communication medium 1B according to the second modification has a main body 21B.

The accommodation hole 25B of the body portion 21B has a concavely curved corner portion 253B between, for example, a flat bottom surface 252B and an inner peripheral surface 251B.

By curving the corner portion 253B between the bottom surface 252B and the inner peripheral surface 251B in this manner, cracks are less likely to occur in the accommodation hole 25B (main body portion 21B) when the accommodation body 20B thermally expands or contracts, for example. can do.

<Third modification>
FIG. 5 is an enlarged cross-sectional view of a contactless communication medium according to a third modified example. 6 is a cross-sectional view taken along line VI-VI shown in FIG. As shown in FIG. 5, a container 20C included in a contactless communication medium 1C according to the third modification has a plug portion 22C.

A plug portion 22C according to the third modification has a plurality of first protrusions 223C that protrude from an outer peripheral surface 222C. As shown in FIG. 6, the plurality (here, three) of the first protrusions 223C are evenly arranged in the circumferential direction with respect to the outer peripheral surface 222C.

By providing the plurality of first projections 223C on the outer peripheral surface 222C of the plug portion 22C in this way, the bias (eccentricity) of the plug portion 22C in the accommodation hole 25 can be suppressed. As a result, the gap between the housing hole 25 and the plug portion 22C is made uniform, and thin portions of the adhesive layer 23 are less likely to occur. For this reason, it is possible to make it more difficult for the joint portion of the container 20C to come off.

Here, an example in which the first protrusion 223C contacts the inner peripheral surface 251 of the accommodation hole 25 is shown. However, the first protrusion 223</b>C does not necessarily need to contact the inner peripheral surface 251 of the accommodation hole 25 . Also, here, an example in which the plug portion 22C has three first protrusions 223C is shown. The number of first protrusions 223C is not limited to this, and may be at least two or more. For example, when the number of first protrusions 223C is two, the two first protrusions 223C may be arranged at intervals of 180 degrees with respect to the outer peripheral surface 222C of the plug portion 22C.

Also, here, an example in which the plug portion 22C has a plurality of first protrusions 223C is shown. Not limited to this, the plug portion 22C may have a flange portion 228C projecting from the outer peripheral surface 222C over the entire circumference of the outer peripheral surface 222C (see FIG. 7). In this case as well, biasing of the plug portion 22C in the accommodation hole 25 can be suppressed. Further, by forming the flange shape, it is possible to suppress the intrusion of the plating solution or the like into the inner side of the accommodation hole 25 . Note that the contactless communication medium 1C may have a gap between the inner peripheral surface 251 of the accommodation hole 25 and the flange portion 228C.

<Fourth modification>
FIG. 8 is an enlarged cross-sectional view of a contactless communication medium according to a fourth modification. 9 is a cross-sectional view taken along line IX-IX shown in FIG. As shown in FIG. 8, a container 20D included in a contactless communication medium 1D according to the fourth modification has a main body 21D.

The accommodation hole 25D of the body portion 21D has a plurality of second protrusions 254D protruding from the inner peripheral surface 251D. As shown in FIG. 9, the plurality (here, three) of the second protrusions 254D are evenly arranged in the circumferential direction with respect to the inner peripheral surface 251D of the accommodation hole 25D.

By providing the plurality of second protrusions 254D on the inner peripheral surface 251D of the accommodation hole 25D in this manner, the bias of the plug portion 22 in the accommodation hole 25D can be suppressed. As a result, the gap between the housing hole 25 and the plug portion 22C is made uniform, and thin portions of the adhesive layer 23 are less likely to occur. For this reason, it is possible to make it more difficult for the joint portion of the container 20C to come off.

In addition, the plurality of second projections 254D protrude to a position overlapping the plug portion 22 in the cross-sectional view shown in FIG. The electronic component 10 is arranged deeper in the housing hole 25D than the surface of the second projection 254D that contacts the plug portion 22. As shown in FIG. Therefore, according to the contactless communication medium 1D, for example, when the plug portion 22 is inserted into the housing hole 25D in the manufacturing process of the contactless communication medium 1D, the tip of the plug portion 22 may contact the electronic component 10 unintentionally. Damage to the electronic component 10 can be suppressed.

Note that the plurality of second protrusions 254D may be formed integrally with the body portion 21D. Also, the plurality of second protrusions 254D may be retrofitted to the main body portion 21D. When retrofitted to the main body 21D, the plurality of second protrusions 254D do not necessarily need to be made of ceramics. For example, the plurality of second protrusions 254D may be made of resin or the like that is more flexible than ceramics.

<Fifth Modification>
FIG. 10 is an enlarged cross-sectional view of a contactless communication medium according to a fifth modification. 11 is a cross-sectional view taken along line XI-XI shown in FIG. As shown in FIGS. 10 and 11, a container 20E included in a contactless communication medium 1E according to the fifth modification has a main body 21E.

The accommodation hole 25E of the body portion 21E has a stepped surface 255E projecting from the inner peripheral surface 251E. In the fifth modification, the electronic component 10 is arranged at a position farther from the opening of the accommodation hole 25E than the step surface 255E. Specifically, the electronic component 10 is placed on the bottom surface 252E of the accommodation hole 25E.

Thus, by providing the step surface 255E inside the accommodation hole 25E, it is possible to lengthen the extended surface distance of the accommodation hole 25E. Accordingly, even if a liquid such as a plating solution or a gas such as a corrosive gas enters the housing hole 25</b>E from the outside, the liquid or gas is less likely to reach the electronic component 10 . Therefore, the electronic component 10 can be prevented from coming into contact with liquid or gas from the outside.

Further, the container 20E according to the fifth modification has a lid portion 27E placed on the stepped surface 255E. Lid portion 27E is made of, for example, ceramics. The lid portion 27E is fixed in the accommodation hole 25E by being sandwiched between the stepped surface 255E and the tip surface of the plug portion 22, and the space between the stepped surface 255E and the bottom surface 252E in the accommodation hole 25E, that is, the electronic The space in which the component 10 is accommodated is closed.

In this manner, the electronic component 10 can be double-sealed by placing the lid portion 27E on the step surface 255E. As a result, even if liquid or gas enters the housing hole 25E from the outside, the electronic component 10 can be protected from the liquid or gas.

<Sixth modification>
FIG. 12 is an enlarged cross-sectional view of a contactless communication medium according to a sixth modification. As shown in FIG. 12, a container 20F included in a contactless communication medium 1F according to the sixth modification has a plug portion 22F.

A container 20</b>F according to the sixth modification fixes the electronic component 10 by sandwiching the electronic component 10 between the tip surface 224</b>F of the plug portion 22</b>F and the bottom surface 252 of the containing hole 25 . Thereby, movement of the electronic component 10 within the accommodation hole 25 can be suppressed.

The interior of accommodation hole 25 is a space, and electronic component 10 is not in contact with members (for example, a filler) other than front end surface 224F of plug portion 22F and bottom surface 252 of accommodation hole 25 . Therefore, heat from the outside is less likely to be transmitted to the electronic component 10 as compared with the case where the electronic component 10 is fixed by a filler or the like.

In this way, by adopting a structure in which the electronic component 10 is sandwiched between the tip end surface 224F of the plug portion 22F and the bottom surface 252 of the housing hole 25, heat conduction to the electronic component 10 is suppressed, and damage to the electronic component 10 such as chipping is suppressed. Damage can be prevented.

Further, the tip surface 224F of the plug portion 22F is curved toward the bottom surface 252 of the housing hole 25, in other words, toward the electronic component 10. As shown in FIG. Thereby, the contact area between the plug portion 22F and the electronic component 10 can be reduced. Therefore, heat conduction from the plug portion 22F to the electronic component 10 can be suppressed.

<Seventh Modification>
FIG. 13 is an enlarged cross-sectional view of a contactless communication medium according to a seventh modification. As shown in FIG. 13, a container 20G included in a contactless communication medium 1G according to the seventh modification has a main body 21G and a plug 22G.

A housing hole 25G of a body portion 21G according to the seventh modification has a plurality of third projections 256G protruding from a bottom surface 252G. Further, the plug portion 22G according to the seventh modification has a plurality of fourth protrusions 225G that protrude from the tip surface 224G.

In the seventh modification, the electronic component 10 is sandwiched between the plurality of third projections 256G provided on the bottom surface 252G of the accommodation hole 25G and the plurality of fourth projections 225G provided on the plug portion 22G. ing.

Thereby, the contact area between the electronic component 10 and the main body portion 21G and the contact area between the electronic component 10 and the plug portion 22G can be reduced. Therefore, it is possible to suppress the movement of the electronic component 10 while suppressing heat conduction from the body portion 21G or the plug portion 22D to the electronic component 10 . Further, since the electronic component 10 is accommodated between the two third projections 256G, it is possible to suppress positional displacement of the electronic component 10. As shown in FIG.

Here, an example is shown in which a plurality of third projections 256G are provided on the bottom surface 252G of the accommodation hole 25G. The present invention is not limited to this, and the main body portion 21G may have at least one third protrusion 256G. Also, here, an example in which a plurality of fourth protrusions 225G are provided on the tip surface 224G of the plug portion 22G is shown. Not limited to this, the plug portion 22G may have at least one fourth projection 225G.

Also, here, an example in which projections (the third projection 256G and the fourth projection 225G) are provided on both the housing hole 25G and the plug portion 22G is shown. The projection is not limited to this, and may be provided only in one of the accommodation hole 25G and the plug portion 22G.

<Eighth modification>
FIG. 14 is an enlarged cross-sectional view of a contactless communication medium according to an eighth modification. As shown in FIG. 14, a container 20H included in a contactless communication medium 1H according to the eighth modification has a plug portion 22H.

The tip surface of the plug portion 22H according to the eighth modification is recessed, and the recessed surface 226H is, for example, a flat surface.

In the eighth modified example, an edge portion 227H located on the outer periphery of the recessed surface 226H is in contact with the bottom surface 252 of the housing hole 25, and the electronic component 10 is housed in the recessed portion of the plug portion 22H. there is

In this manner, the plug portion 22H according to the eighth modification can reduce the amount of movement of the electronic component 10 in the accommodation hole 25 by accommodating the electronic component 10 in the recessed portion of the plug portion 22H. As a result, damage such as chipping of the electronic component 10 can be suppressed.

<Ninth Modification>
FIG. 15 is an enlarged cross-sectional view of a contactless communication medium according to a ninth modification. As shown in FIG. 15, a container 20J included in a contactless communication medium 1J according to the ninth modification has an adhesive layer 23J.

The adhesive layer 23J according to the ninth modification protrudes from the housing hole 25. As shown in FIG. The adhesive layer 23J protrudes circumferentially from the gap between the body portion 21 and the plug portion 22 . In addition, the adhesive layer 23J should just protrude from at least one part in the circumferential direction of the container 20J.

Since the adhesive layer 23J protrudes from the housing hole 25 in this manner, the body portion 21 and the plug portion 22 can be joined more firmly.

<Tenth Modification>
FIG. 16 is an enlarged cross-sectional view of a contactless communication medium according to a tenth modification. As shown in FIG. 16, a container 20K included in a contactless communication medium 1K according to the tenth modification has a spherical shape. Specifically, the body portion 21K has a hemispherical shape, and the end surface 221K of the plug portion 22K is curved along the spherical surface of the body portion 21K. By bonding these through an adhesive layer 23K, a spherical container 20K is obtained.

In this way, by forming the container 20K into a spherical shape without corners, it is possible to further suppress damage such as chipping or cracking of the container 20K.

<Modified example of structure for holding down electronic components>
By the way, the prior art still has room for further improvement in terms of suppressing damage such as chipping of electronic parts caused by movement of electronic parts such as RFID tags within the housing space. Therefore, the non-contact communication medium may have a structure for holding down electronic components.

<Eleventh Modification>
First, with reference to FIGS. 17 to 19, the configuration of a contactless communication medium according to the eleventh modification having the holding structure will be described. FIG. 17 is a side view of a contactless communication medium according to the eleventh modification. Also, FIG. 18 is a plan view of a contactless communication medium according to the eleventh modification. 19 is a cross-sectional view taken along line XIX-XIX shown in FIG. 18. As shown in FIG.

It should be noted that the structures for holding down the electronic component 10 shown in the following 11th to 21st modifications can be appropriately incorporated in the non-contact communication media according to the above-described embodiment and the first to 10th modifications. be.

As shown in FIGS. 17 to 19, a contactless communication medium 1L according to the eleventh modification has an electronic component 10 and a container 200. FIG. Electronic component 10 is, for example, an RFID tag.

The container 200 has a first substrate 210 and a second substrate 220 made of ceramics, and an adhesive layer 230 . The first base material 210 and the second base material 220 are bonded to each other via the adhesive layer 230 . Specifically, the first base material 210 and the second base material 220 have flat surfaces 210a and 220a that face each other and have approximately the same diameter. The flat surfaces 210 a and 220 a of the first base material 210 and the second base material 220 are bonded via an adhesive layer 230 . Below, the flat surface 210a of the first substrate 210 is described as "first flat surface 210a", and the flat surface 220a of the second substrate 220 is described as "second flat surface 220a".

The first base material 210 has a housing recess 250 that houses the electronic component 10 . The accommodation recess 250 opens at the center of the first flat surface 210a. The first flat surface 210 a is closed by the second flat surface 220 a of the second substrate 220 . Thereby, the electronic component 10 is sealed inside the container 200 .

The adhesive layer 230 is made of an adhesive. The adhesive should just have heat resistance that can withstand the usage environment of the non-contact communication medium 1L.

Both the first base material 210 and the second base material 220 have a cylindrical shape. Specifically, the first base material 210 and the second base material 220 have circular flat surfaces (upper end surface and lower end surface) at both ends, and curved surfaces (peripheral surfaces) connecting the upper end surface and the lower end surface. have. The adhesive layer 230 is positioned between a first flat surface 210 a that is the upper end surface of the first substrate 210 and a second flat surface 220 a that is the lower end surface of the second substrate 220 . The first base material 210 and the second base material 220 joined by the adhesive layer 230 have a cylindrical shape (so-called coin shape) as a whole.

A receiving recess 250 is positioned on the first flat surface 210 a of the first base member 210 . The electronic component 10 is housed in the housing recess 250 . The interior of the accommodation recess 250 is a space, and no filler or the like is positioned therein.

As shown in FIG. 19 , the second base member 220 has a housing protrusion 260 that protrudes from the second flat surface 220 a and enters the housing recess 250 .

By inserting the housing protrusion 260 into the housing recess 250 in this manner, the internal space of the housing recess 250 can be narrowed. Since the internal space of the accommodating recess 250 is narrowed, even if the electronic component 10 moves in the internal space of the accommodating recess 250, the amount of movement is reduced. Therefore, according to the contactless communication medium 1</b>L according to the eleventh modification, it is possible to suppress damage such as chipping of the electronic component 10 due to movement of the electronic component 10 within the housing recess 250 .

Also, in the non-contact communication medium 1L according to the eleventh modification, the electronic component 10 is sandwiched between the tip end surface 260a of the accommodating convex portion 260 and the bottom surface 250a of the accommodating concave portion 250. FIG. Thereby, movement of the electronic component 10 within the housing recess 250 can be suppressed. In addition, the interior of housing recess 250 is a space, and electronic component 10 is not in contact with members (such as fillers) other than tip end surface 260 a of housing protrusion 260 and bottom surface 250 a of housing recess 250 . Therefore, heat from the outside is less likely to be transmitted to the electronic component 10 as compared with the case where the electronic component 10 is fixed by a filler or the like.

In this way, by adopting a structure in which the electronic component 10 is sandwiched between the tip surface 260a of the housing projection 260 and the bottom surface 250a of the housing recess 250, heat conduction to the electronic component 10 is suppressed, and damage to the electronic component 10, such as chipping, is prevented. damage can be suppressed.

In addition, the tip surface 260a of the housing projection 260 according to the eleventh modification curves toward the bottom surface 250a of the housing recess 250, in other words, toward the electronic component 10. As shown in FIG. As a result, the contact area between the housing convex portion 260 and the electronic component 10 can be reduced. Therefore, heat conduction from the second base material 220 to the electronic component 10 can be suppressed.

<Twelfth Modification>
FIG. 20 is an enlarged cross-sectional view of a contactless communication medium according to a twelfth modification. As shown in FIG. 20, a container 200M included in a contactless communication medium 1M according to the twelfth modification has a second base material 220M.

The tip end surface of the accommodation protrusion 260M of the second base member 220M is recessed in a curved shape, and at least part of the electronic component 10 is accommodated in this recessed portion. In the twelfth modified example, the electronic component 10 is in point contact with the recessed surface 260M1 of the housing projection 260M. The electronic component 10 is sandwiched between the concave surface 260</b>M<b>1 and the bottom surface 250 a of the housing concave portion 250 .

In this way, the tip end surface of the accommodation protrusion 260M may be recessed. Also in this case, the contact area between the electronic component 10 and the accommodation convex portion 260M can be reduced. Therefore, it is possible to suppress the movement of the electronic component 10 while suppressing heat conduction from the second base material 220M to the electronic component 10 .

<Thirteenth Modification>
FIG. 21 is an enlarged cross-sectional view of a contactless communication medium according to a thirteenth modification. As shown in FIG. 21, a container 200N included in a contactless communication medium 1N according to the thirteenth modification has a second base material 220N.

The tip end surface of the housing protrusion 260N of the second base member 220N is recessed. This concave surface 260N1 is, for example, a flat surface. The electronic component 10 is in surface contact with the recessed surface 260N1 and is sandwiched between the recessed surface 260N1 and the bottom surface 250a of the housing recess 250. As shown in FIG.

In this way, by bringing the electronic component 10 into surface contact with the accommodation convex portion 260N, the movement of the electronic component 10 can be suppressed more reliably. An edge portion 260N2 located on the outer periphery of the recessed surface 260N1 protrudes toward the bottom surface 250a of the housing recess 250 beyond the recessed surface 260N1. Therefore, even if the electronic component 10 moves, the electronic component 10 collides with the edge 260N2, so that the amount of movement of the electronic component 10 can be reduced. can be suppressed.

<14th Modification>
FIG. 22 is an enlarged cross-sectional view of a contactless communication medium according to a fourteenth modification. As shown in FIG. 22, a container 200P included in a contactless communication medium 1P according to the fourteenth modification has a second base material 220P.

The tip end face of the accommodation protrusion 260P of the second base material 220P is recessed. This concave surface 260P1 is a flat surface.

In the fourteenth modification, an edge portion 260P2 positioned on the outer circumference of the recessed surface 260P1 is in contact with the bottom surface 250a of the accommodating recess 250, and the electronic component 10 is completely accommodated in the recessed portion of the accommodating protrusion 260P. It has become.

In this manner, the edge 260P2 of the housing projection 260P may contact the bottom surface 250a of the housing recess 250. As shown in FIG. In this case, the accommodation protrusion 260P also functions as a spacer that defines the interval between the first flat surface 210a and the second flat surface 220a. Therefore, according to the non-contact communication medium 1P according to the fourteenth modification, variations in the thickness of the adhesive layer 230 among the plurality of non-contact communication media 1P can be suppressed. In other words, it is possible to suppress variations in quality among a plurality of contactless communication media 1P.

<Fifteenth Modification>
FIG. 23 is an enlarged cross-sectional view of a contactless communication medium according to a fifteenth modification. As shown in FIG. 23, a container 200Q included in a contactless communication medium 1Q according to the fifteenth modification has a second base material 220Q.

The accommodation convex portion 260Q of the second base member 220Q has a plurality of protrusions 260Q1 that protrude from the tip surface. In the fifteenth modification, the electronic component 10 is sandwiched between the plurality of projections 260Q1 and the bottom surface 250a of the housing recess 250. As shown in FIG.

Here, an example in which a plurality of protrusions 260Q1 are provided on the distal end surface of the accommodation protrusion 260Q is shown, but the accommodation protrusion 260Q may have at least one protrusion 260Q1.

In this way, the accommodation protrusion 260Q may have at least one protrusion 260Q1 protruding from the tip surface. Also in this case, the contact area between the electronic component 10 and the housing projection 260Q can be reduced. Therefore, it is possible to suppress the movement of the electronic component 10 while suppressing heat conduction from the second base material 220Q to the electronic component 10 .

In addition, by providing a plurality of projections 260Q1, the accommodation convex portion 260Q and the electronic component 10 come into contact with each other at multiple points. As a result, the movement of the electronic component 10 can be more reliably suppressed while reducing the contact area between the electronic component 10 and the housing projection 260Q.

<Sixteenth Modification>
FIG. 24 is an enlarged cross-sectional view of a contactless communication medium according to a sixteenth modification. As shown in FIG. 24, a container 200R included in a contactless communication medium 1R according to the sixteenth modification has a second base material 220Q similar to that of the fifteenth modification, for example.

Further, a container 200R according to the sixteenth modification has a first base material 210R. The first base material 210R has a housing recess 250R. The accommodation recess 250R has a plurality of protrusions 250R1 protruding from the bottom surface 250a. In the sixteenth modification, the electronic component 10 is sandwiched between a plurality of protrusions 260Q1 provided in the accommodation convex portion 260Q and a plurality of protrusions 250R1 provided in the accommodation recess portion 250R.

Here, an example in which a plurality of protrusions 250R1 are provided on the bottom surface 250a of the accommodation recess 250R is shown, but the accommodation recess 250R may have at least one protrusion 250R1.

Thus, the accommodation recess 250R may have at least one protrusion 250R1 protruding from the bottom surface 250a. Also in this case, the contact area between the electronic component 10 and the accommodation recess 250R can be reduced. Therefore, it is possible to suppress the movement of the electronic component 10 while suppressing heat conduction from the first base member 210R to the electronic component 10 .

Further, by providing a plurality of protrusions 250R1, the housing recess 250R and the electronic component 10 come into contact with each other at multiple points. movement can be suppressed more reliably.

Further, by setting the distance between the protrusions 250R1 so that the electronic component 10 can be accommodated between the two protrusions 250R1, the positioning of the electronic component 10 can be facilitated.

<Seventeenth Modification>
FIG. 25 is an enlarged cross-sectional view of a contactless communication medium according to the seventeenth modification. As shown in FIG. 25, a container 200S included in the contactless communication medium 1S according to the seventeenth modification has a cushion material 270S1 on the tip surface 260a of the convex container 260. As shown in FIG. Further, the containing body 200S also has a cushion material 270S2 on the bottom surface 250a of the containing concave portion 250. As shown in FIG.

The cushion materials 270S1 and 270S2 are made of a material having higher flexibility than the first base material 210 and the second base material 220 made of ceramics, such as resin. As such resins, for example, silicone, amide-based, imide-based, and amide-imide-based resins can be suitably used. Moreover, it is preferable that the cushion materials 270S1 and 270S2 have heat resistance.

In the seventeenth modification, the electronic component 10 is sandwiched between the accommodation protrusion 260 and the accommodation recess 250 via the cushion materials 270S1 and 270S2. Therefore, even if container 200S receives an impact, for example, cushion materials 270S1 and 270S2 absorb the impact, thereby suppressing transmission of the impact to electronic component 10. FIG. Therefore, according to the contactless communication medium 1S according to the seventeenth modification, damage to the electronic component 10 can be suppressed more reliably.

Here, an example in which the cushioning materials 270S1 and 270S2 are provided in both the accommodation convex portion 260 and the accommodation recessed portion 250 is shown, but the cushioning materials 270S1 and 270S2 are provided in at least one of the accommodation convex portion 260 and the accommodation recessed portion 250. It is good if it is

<18th Modification>
FIG. 26 is an enlarged cross-sectional view of a contactless communication medium according to an eighteenth modification. As shown in FIG. 26, a container 200T included in a contactless communication medium 1T according to the eighteenth modification has a second base material 220T.

A housing convex portion 260T of the second base material 220T according to the eighteenth modification is made of a cushioning material having higher flexibility than the first base material 210 and the second base material 220T.

In this way, the entire accommodation convex portion 260T may be formed of the cushion material. Accordingly, it is possible to replace the accommodation convex portion 260T according to the dimensions of the electronic component 10, for example.

<Nineteenth Modification>
FIG. 27 is an enlarged cross-sectional view of a contactless communication medium according to the nineteenth modification. 28 is a cross-sectional view taken along line XXVIII-XXVIII shown in FIG. As shown in FIG. 27, a container 200U included in a contactless communication medium 1U according to the nineteenth modification has a second base material 220U.

As shown in FIGS. 27 and 28, the housing convex portion 260U of the second base member 220U has a projection 260U1 circumferentially protruding from the tip surface. In the nineteenth modification, the electronic component 10 is sandwiched between the circumferential projection 260U1 and the bottom surface 250a of the housing recess 250. As shown in FIG.

In this way, the accommodation protrusion 260U may have a protrusion 260U1 that protrudes circumferentially from the distal end surface. As a result, the movement of the electronic component 10 can be more reliably suppressed while reducing the contact area between the electronic component 10 and the accommodation convex portion 260U.

<Twentieth Modification>
FIG. 29 is an enlarged cross-sectional view of a contactless communication medium according to a twentieth modification. As shown in FIG. 29, a container 200V included in a contactless communication medium 1V according to the twentieth modification has an adhesive layer 230V.

Adhesive layer 230V according to the twentieth modification protrudes from between first base material 210 and second base material 220 . The adhesive layer 230V protrudes over the entire circumference of the container 200V. In addition, the adhesive layer 230V only needs to protrude from at least a part of the container 200V in the circumferential direction.

Since the adhesive layer 230V protrudes from the first base material 210 and the second base material 220 in this manner, the first base material 210 and the second base material 220 can be bonded more firmly.

<21st Modification>
FIG. 30 is an enlarged cross-sectional view of a contactless communication medium according to a twenty-first modification. As shown in FIG. 30, a container 200W included in a contactless communication medium 1W according to the twenty-first modification has a spherical shape. Specifically, the first base material 210W and the second base material 220W have a hemispherical shape, and are joined via an adhesive layer 230W to obtain a spherical container 200W.

In this way, by forming the containing body 200W into a spherical shape without corners, it is possible to further suppress damage such as chipping or cracking of the containing body 200W.

<Other Modifications>
Ceramics constituting the first base material and the second base material are not limited to cordierite. For example, ceramics constituting the first base material and the second base material are Al ₂ O ₃ (alumina), Si ₃ N ₄ (silicon nitride), SiC (silicon carbide), and Al ₂ TiO ₅ (aluminum titanate). There may be. Also, the ceramics constituting the first base material and the second base material may be crystallized glass such as Li ₂ O—Al ₂ O ₃ —SiO ₂ .

The container preferably has a lightness index L* (value of dimension L representing lightness in Lab color space) of 50 or more. As a result, dirt attached to the container becomes more conspicuous, so that it is possible to easily determine when to replace the container. In addition, heat is less likely to accumulate than when the lightness index L* is set to less than 50 (that is, when the color is dark), so heat is less likely to be transmitted to electronic components. The lightness of the container can be adjusted, for example, by using a pigment (see, for example, Japanese Patent No. 5762522 and Japanese Patent No. 5744045).

Also, the first base material and the second base material may have different colors. As a result, since the visibility of the upper and lower sides is improved, the work of attaching the non-contact communication medium to the parts to be monitored can be facilitated. For example, when an operator wants to place an electronic component closer to a component to be monitored, the operator can easily move the first base material containing the electronic component out of the first base material and the second base material. can be specified. Thereby, the first base material can be arranged near the part or the like to be monitored.

When different colors are used for the first base material and the second base material, the color of the first base material containing the electronic components may be brighter than that of the second base material. As a result, it is possible to make it difficult for heat to be conducted to the electronic component while improving the visibility of the upper and lower sides. In addition, it is preferable that the electronic components are far away from members with a low brightness index. As a result, it is possible to make it difficult for heat to be conducted by the electronic component.

Electronic components are not limited to RFID tags, and may be other electronic components as long as they perform non-contact communication. For example, the electronic component may be a sensor with contactless communication capabilities. The sensor may also be a sensor that measures the processing environment of the monitored component, for example a temperature sensor.

Components to which contactless communication media according to the present disclosure are attached are not limited to plated components.

For example, a contactless communication medium according to the present disclosure may be attached to a component such as a billet produced in a metal material foundry.

Also, the non-contact communication medium according to the present disclosure may be used for article management in the vulcanization process in the manufacturing process of rubber products.

The vulcanization process is a process of chemically reacting sulfur, peroxide, or the like blended in the raw material with temperature and time to crosslink molecules in order to increase the elastic limit of the raw material of the rubber system. In addition, pressure may also be applied in the vulcanization process. The temperature in the vulcanization process is, for example, 100°C to 200°C. Also, the pressure in the vulcanization process is, for example, 0.5 MPa to 2 MPa.

As an example, a contactless communication medium according to the present disclosure may be attached to a used tire that is retreaded as a retread tire. A retread tire is obtained by scraping off the surface of a used tire, affixing a new rubber sheet thereon, and then vulcanizing it.

As vulcanization processes for retread tires, a remolding method and a precure method are known. The remolding method is a method in which an unvulcanized rubber sheet is attached to the surface of a used tire and then vulcanized at high temperature and high pressure using a mold. The pre-cure method is a method in which a vulcanized rubber sheet is attached to the surface of a used tire and then vulcanized at a low temperature and a low pressure in a vulcanizing can. The contactless communication medium according to the present disclosure is applicable to both the remolding method and the precure method. In particular, since the pre-cure method is intended for small-lot, high-mix production, there are relatively many manual inspection processes. On the other hand, by performing article management using the non-contact communication medium according to the present disclosure, it is possible to reduce personnel costs and improve the production efficiency of retread tires.

The contactless communication medium according to the present disclosure is preferably attached to a location other than the tread portion to which the rubber sheet is attached. For example, a contactless communication medium according to the present disclosure may be placed inside a used tire.

A contactless communication medium according to the present disclosure may also be attached to medical instruments (eg, forceps, needle holders, etc.).

In the medical field, how to prevent medical instruments from remaining in the body, rationalize the management of medical instruments, and prevent the misuse of medical instruments during surgery is a problem. On the other hand, by attaching the non-contact communication medium according to the present disclosure to medical instruments, it is possible to manage individual medical instruments using RFID tags, which can contribute to solving the above problems.

Also, the non-contact communication medium according to the present disclosure may be used for marking for identifying lesion sites in the body.

As a conventional marking method, a dye coloring method for a living body is known. The living body dye coloring method is to color the lesion site in the body found during the examination with a dye. However, it is difficult to precisely identify the lesion site with the dye coloring method for living body because the coloring range is wide and the dye diffuses with the lapse of time. In addition, as another marking method, a method of indwelling a metal needle or clip at a lesion site has been proposed. However, this method has problems such as the need to prepare a CT scanning device for the operation, and the risk of excessive radiation exposure.

When using the non-contact communication medium according to the present disclosure for marking, first, the non-contact communication medium according to the present disclosure is indwelled at the lesion site before surgery. Thereafter, during surgery, the sensor antenna is used to estimate the position of the RFID tag, ie, the position of the lesion site, by measuring the distance between the RFID tag and the sensor antenna, for example.

Thus, when using the non-contact communication medium according to the present disclosure for marking, the non-contact communication medium according to the present disclosure is desirably as small as possible because it is left in the body. In this regard, the ceramics forming the container of the present disclosure has a higher dielectric constant than resin, for example, and is less likely to interfere with RFID communication. Therefore, the non-contact communication medium of the present disclosure can be made smaller than, for example, a non-contact communication medium having a resin container.

As described above, the non-contact communication media according to the embodiment (the non-contact communication media 1, 1A to 1K as an example) include an electronic component (the electronic component 10 as an example) and a container (a container as an example 20, 20A to 20K). The electronic component performs contactless communication. The container accommodates the electronic component. In addition, the container includes a body portion (body portions 21, 21A, 21B, 21D, 21E, 21G, and 21K as examples) and plug portions (eg, plug portions 22, 22C, 22D, 22F, 22G, 22H, 22K) and adhesive layers (adhesive layers 23, 23J, and 23K, for example). The main body has accommodation holes (accommodation holes 25A, 25B, 25D, 25E, 25G, for example) in which electronic components are accommodated. The plug portion is inserted into the accommodation hole. The adhesive layer is positioned between the inner peripheral surface of the receiving hole and the outer peripheral surface of the plug, and joins the main body and the plug. Accordingly, it is possible to provide a non-contact communication medium in which peeling of the joint portion of the container is less likely to occur.

The bottom surface of the accommodation hole may be concavely curved. Further, the accommodation hole may have a curved corner portion (eg, corner portion 253B) between the inner peripheral surface and the bottom surface. As a result, cracks are less likely to occur in the accommodation hole when the accommodation body thermally expands or contracts, for example.

The body portion may have a first flat surface (as an example, the first flat surface 211) through which the accommodation hole opens. The plug portion may have a second flat surface (as an example, the second flat surface 221) that is flush with the first flat surface. Since the plug does not protrude from the main body, it is difficult to apply a direct impact to the plug. Therefore, peeling of the joint portion of the container can be made more difficult to occur.

The plug portion may have a plurality of protrusions (eg, first protrusion 223C) protruding from the outer peripheral surface. Moreover, the plurality of protrusions of the plug may be evenly arranged in the circumferential direction with respect to the outer peripheral surface. Also, the body portion may have a plurality of projections (as an example, second projections 254D) projecting from the inner peripheral surface. As a result, bias (eccentricity) of the plug portion in the accommodation hole can be suppressed. As a result, the gap between the housing hole and the plug portion becomes uniform, and a portion having a thin adhesive layer is less likely to occur, so that peeling of the joint portion of the container can be made more difficult to occur.

The housing hole may have a stepped surface (as an example, the stepped surface 255E) protruding from the inner peripheral surface. The electronic component may be arranged at a position farther from the opening of the accommodation hole than the step surface. By providing a stepped surface inside the accommodation hole, it is possible to lengthen the extended surface distance of the accommodation hole. As a result, even if a liquid such as a plating solution or a gas such as a corrosive gas enters the housing hole from the outside, it becomes difficult for the liquid or gas to reach the electronic component. of liquid or gas can be suppressed.

The container may have a lid portion (for example, lid portion 27E) placed on the stepped surface. The electronic component can be double-sealed by placing the lid portion on the stepped surface. Accordingly, even if liquid or gas enters the inside of the housing hole from the outside, the electronic component can be protected from the liquid or gas.

The electronic component may be placed at a location separate from the adhesive layer. As a result, it is possible to make it difficult for heat from the outside to be transmitted to the electronic component.

The plug portion may have a tip surface facing the bottom surface of the housing hole curved toward the bottom surface, and the electronic component may be sandwiched between the tip surface and the bottom surface of the housing hole. The plug portion may have a recessed front end surface located on the bottom side of the accommodation hole, and at least part of the electronic component may be accommodated in this recessed portion. As a result, movement of the electronic component within the housing hole can be suppressed.

The main body may have at least one protrusion (eg, third protrusion 256G) protruding from the bottom surface of the receiving hole. As a result, the contact area between the electronic component and the main body and the contact area between the electronic component and the plug can be reduced. Therefore, it is possible to suppress movement of the electronic component while suppressing heat conduction from the main body portion or the plug portion to the electronic component.

The adhesive layer may protrude from the accommodation hole. Thereby, the body portion and the plug portion can be joined more firmly.

Further advantages and modifications can be easily derived by those skilled in the art. Therefore, the broader aspects of the invention are not limited to the specific details and representative embodiments so shown and described. Accordingly, various changes may be made without departing from the spirit or scope of the general inventive concept defined by the appended claims and equivalents thereof.

Reference Signs List 1 : non-contact communication medium 10 : electronic component 20 : container 21 : main body 22 : plug 23 : adhesive layer 25 : accommodation hole 27E : lid 211 : first flat surface 221 : second flat surface 222 : outer peripheral surface 223C: first projection 225G: fourth projection 251: inner peripheral surface 252: bottom surface 254D: second projection 255E: stepped surface 256G: third projection

Claims (14)

an electronic component that performs contactless communication;
and a container for containing the electronic component,
The container is
a body portion having an accommodation hole in which the electronic component is accommodated;
a plug portion inserted into the accommodation hole;
A non-contact communication medium, comprising: an adhesive layer positioned between an inner peripheral surface of the housing hole and an outer peripheral surface of the plug, and bonding the main body and the plug. 2. The contactless communication medium according to claim 1, wherein the bottom surface of said accommodation hole is concavely curved. 2. The contactless communication medium according to claim 1, wherein said accommodation hole has a curved corner between an inner peripheral surface and a bottom surface. The main body has a first flat surface on which the accommodation hole opens,
The contactless communication medium according to any one of claims 1 to 3, wherein said plug has a second flat surface flush with said first flat surface. The contactless communication medium according to any one of claims 1 to 4, wherein said plug has a plurality of protrusions protruding from said outer peripheral surface. 6. The non-contact communication medium according to claim 5, wherein said plurality of projections of said plug portion are circumferentially evenly arranged with respect to said outer peripheral surface. The contactless communication medium according to any one of claims 1 to 6, wherein said accommodation hole has a plurality of projections projecting from said inner peripheral surface. The accommodation hole has a stepped surface protruding from the inner peripheral surface,
7. The non-contact communication medium according to claim 1, wherein said electronic component is arranged at a position farther from the opening of said accommodation hole than said step surface. 9. The non-contact communication medium according to claim 8, wherein said containing body has a cover placed on said stepped surface. The contactless communication medium according to any one of claims 1 to 9, wherein said electronic component is arranged at a position separated from said adhesive layer. 11. The plug part according to any one of claims 1 to 10, wherein the tip surface of the plug portion facing the bottom surface of the housing hole is curved toward the bottom surface, and the electronic component is sandwiched between the tip surface and the bottom surface of the housing hole. A non-contact communication medium according to any one of the above. 11. The non-contact device according to claim 1, wherein the plug portion has a recessed end surface located on the bottom surface side of the housing hole, and at least part of the electronic component is accommodated in the recessed portion. contact communication medium. The contactless communication medium according to any one of claims 1 to 12, wherein said main body has at least one protrusion protruding from the bottom surface of said receiving hole. The contactless communication medium according to any one of claims 1 to 13, wherein said adhesive layer protrudes from said accommodation hole.

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