JP7479139B2 - レジスト組成物及びレジストパターン形成方法 - Google Patents

レジスト組成物及びレジストパターン形成方法 Download PDF

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Publication number
JP7479139B2
JP7479139B2 JP2019223096A JP2019223096A JP7479139B2 JP 7479139 B2 JP7479139 B2 JP 7479139B2 JP 2019223096 A JP2019223096 A JP 2019223096A JP 2019223096 A JP2019223096 A JP 2019223096A JP 7479139 B2 JP7479139 B2 JP 7479139B2
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Japan
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carbon atoms
component
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acid
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JP2019223096A
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English (en)
Japanese (ja)
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JP2021092659A (ja
Inventor
智之 平野
文武 平山
架奈 野村
紳一 河野
裕介 中川
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Priority to JP2019223096A priority Critical patent/JP7479139B2/ja
Priority to CN202011423839.8A priority patent/CN112946998A/zh
Priority to KR1020200170680A priority patent/KR20210073472A/ko
Priority to SG10202012309RA priority patent/SG10202012309RA/en
Publication of JP2021092659A publication Critical patent/JP2021092659A/ja
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2019223096A 2019-12-10 2019-12-10 レジスト組成物及びレジストパターン形成方法 Active JP7479139B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019223096A JP7479139B2 (ja) 2019-12-10 2019-12-10 レジスト組成物及びレジストパターン形成方法
CN202011423839.8A CN112946998A (zh) 2019-12-10 2020-12-08 抗蚀剂组合物及抗蚀剂图案形成方法
KR1020200170680A KR20210073472A (ko) 2019-12-10 2020-12-08 레지스트 조성물 및 레지스트 패턴 형성 방법
SG10202012309RA SG10202012309RA (en) 2019-12-10 2020-12-09 Resist composition and method of forming resist pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019223096A JP7479139B2 (ja) 2019-12-10 2019-12-10 レジスト組成物及びレジストパターン形成方法

Publications (2)

Publication Number Publication Date
JP2021092659A JP2021092659A (ja) 2021-06-17
JP7479139B2 true JP7479139B2 (ja) 2024-05-08

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JP2019223096A Active JP7479139B2 (ja) 2019-12-10 2019-12-10 レジスト組成物及びレジストパターン形成方法

Country Status (4)

Country Link
JP (1) JP7479139B2 (ko)
KR (1) KR20210073472A (ko)
CN (1) CN112946998A (ko)
SG (1) SG10202012309RA (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023171305A (ja) 2022-05-20 2023-12-01 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004309776A (ja) 2003-04-07 2004-11-04 Tokyo Ohka Kogyo Co Ltd 厚膜用化学増幅型ポジ型ホトレジスト組成物、厚膜ホトレジスト積層体、厚膜レジストパターンの製造方法及び接続端子の製造方法
JP2015194715A (ja) 2014-03-20 2015-11-05 東京応化工業株式会社 厚膜用化学増幅型ポジ型感光性樹脂組成物
JP2017107211A (ja) 2015-12-09 2017-06-15 住友化学株式会社 レジスト組成物
JP2017116880A (ja) 2015-12-25 2017-06-29 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法及び電子デバイスの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3895224B2 (ja) 2001-12-03 2007-03-22 東京応化工業株式会社 ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004309776A (ja) 2003-04-07 2004-11-04 Tokyo Ohka Kogyo Co Ltd 厚膜用化学増幅型ポジ型ホトレジスト組成物、厚膜ホトレジスト積層体、厚膜レジストパターンの製造方法及び接続端子の製造方法
JP2015194715A (ja) 2014-03-20 2015-11-05 東京応化工業株式会社 厚膜用化学増幅型ポジ型感光性樹脂組成物
JP2017107211A (ja) 2015-12-09 2017-06-15 住友化学株式会社 レジスト組成物
JP2017116880A (ja) 2015-12-25 2017-06-29 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法及び電子デバイスの製造方法

Also Published As

Publication number Publication date
JP2021092659A (ja) 2021-06-17
CN112946998A (zh) 2021-06-11
KR20210073472A (ko) 2021-06-18
SG10202012309RA (en) 2021-07-29

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