JP7458570B2 - Contactless communication media - Google Patents

Description

TECHNICAL FIELD The present invention relates to a contactless communication medium that is attached to an object to be detected and that transmits a message to that effect in a non-contact manner when moisture is generated in the object to be detected.

Traditionally, in buildings such as apartment complexes and general buildings, pipes used for air conditioning and the like have been installed above the ceiling or between the walls, and these pipes are used to supply and drain fluids such as water. Because such pipes are installed above the ceiling or between the walls as described above, they are connected using connecting members such as joints depending on the structure of the building. However, although the joints are sealed with silicone or the like at the joints, there is a risk of water leakage if the sealing is incomplete.

Here, Patent Document 1 discloses a moisture detection sensor that detects the occurrence of moisture by shorting a pair of conductive patterns with the moisture when the moisture occurs, and reading whether the pair of conductive patterns is in an insulating state or a conductive state via an antenna. By using this technology, it becomes possible to detect water leaks as described above.

JP 2019-124657 Publication

In a non-contact communication medium such as the above-mentioned moisture detection sensor, when attached to a detected object made of metal, the antenna is affected by the metal, resulting in a short communication distance. Therefore, in order to avoid the influence of metal, it is possible to reduce the influence of metal on non-contact communication by placing a magnetic material, metal sheet, etc. between the non-contact communication medium and the detected object to which it is attached. .

However, when placing a magnetic material or metal sheet between the non-contact communication medium and the object to be detected to which it is attached, separate members such as the magnetic material or metal sheet are required, and their alignment is required. This poses problems in that the work becomes complicated and the structure becomes complicated and expensive. Further, Patent Document 1 describes that the base material itself on which the antenna and conductive pattern are formed is made of metal, and that the antenna and the conductive pattern are formed on the surface of the base material with an insulating film interposed therebetween. In that case, a delicate technique is required to laminate insulating films so that the antenna or conductive pattern and the base material do not short-circuit, resulting in a problem that the manufacturing process becomes complicated.

The present invention has been made in view of the problems of the conventional techniques as described above, and is attached to an object to be detected and transmits a message to that effect in a non-contact manner when moisture is generated in the object to be detected. An object of the present invention is to provide a non-contact communication medium that can alleviate the influence of metal on non-contact communication even when a detected object is metal with a simple structure.

In order to achieve the above object, the present invention has the following features:
a base material,
a communication antenna formed on one surface of the base material;
two detection wirings formed on the other surface of the base material;
Connected to the communication antenna and connected to one end of each of the two detection wirings, provided on the one surface of the base substrate, and conductive between the two detection wirings. Detection means for detecting a state and transmitting the detection result in a non-contact manner via the communication antenna;
an insulating layer laminated to cover at least the detection wiring on the other surface of the base substrate,
The detection wiring includes a conductive pattern having a shape that covers the communication antenna in a plan view, and a portion of each of the two detection wirings is exposed from the insulating layer.

In the present invention configured as described above, a communication antenna is formed on one surface of the base material, and two detection wirings are formed on the other surface of the base material. Since the communication wiring has a conductive pattern shaped to cover the communication antenna in plan view, if it is attached to the object to be detected with the other side of the base material facing the object to be detected, the A conductive pattern that covers the communication antenna in a plan view is interposed between the body and the communication antenna, and the influence of the detected object made of metal on non-contact communication is alleviated with a simple structure. In addition, since the detection wiring is formed on the surface of the base material that faces the object to be detected when the non-contact communication medium is attached to the object to be detected, it is possible to The two detection wirings become easily conductive, and the occurrence of moisture such as water leakage in the object to be detected becomes easier to detect. In addition, since the detection wiring is formed on the surface of the base material that faces the object to be detected when the non-contact communication medium is attached to the object, the detection wiring is will be protected from. Therefore, when laminating a protective layer on the base material to protect the communication antenna, detection wiring, and detection means from external forces, it is sufficient to simply laminate the protective layer so as to cover the communication antenna and detection means. In particular, even when the length of the detection wiring is increased in order to facilitate alignment with the object to be detected during the work of attaching it to the object to be detected, the size of the protective layer can be prevented from increasing.

Furthermore, if a protective layer covering at least the communication antenna and the detection means is laminated on the base material, direct application of external force to the communication antenna and the detection means can be avoided, and the communication antenna and the detection means can be protected. Ru.

According to the present invention, the communication antenna is formed on one surface of the base material, and the detection wiring is formed on the other surface of the base material, and the detection wiring communicates in a plan view. Since it has a conductive pattern shaped to cover the communication antenna, if the base material is attached to the object to be detected with the other side facing the object to be detected, there will be no interference between the object to be detected and the communication antenna. In plan view, there is a conductive pattern that covers the communication antenna, and by detecting the conduction state of the two detection wires formed on the base material, it is possible to detect that moisture has occurred in the detected object. In a non-contact communication medium for non-contact transmission, even when the object to be detected is metal, the influence of metal on non-contact communication can be alleviated with a simple structure. In addition, since the detection wiring is formed on the surface of the base material that faces the object to be detected when the non-contact communication medium is attached to the object to be detected, it is possible to The two detection wirings are easily electrically connected, and the occurrence of moisture such as water leakage in the object to be detected can be easily detected. In addition, since the detection wiring is formed on the surface of the base material that faces the object to be detected when the non-contact communication medium is attached to the object, the detection wiring is Therefore, when laminating a protective layer on the base material to protect the communication antenna, detection wiring, and detection means from external forces, it is necessary to protect the communication antenna and detection means by covering them. All you need to do is laminate layers, and the size of the protective layer is large, especially when the length of the sensing wiring is increased to facilitate alignment with the sensing object during installation work. can be avoided.

In addition, when a protective layer that covers at least the communication antenna and the detection means is laminated on the base substrate, the communication antenna and the detection means are prevented from being subjected to direct external forces, and the communication antenna and the detection means can be protected.

1A and 1B are diagrams showing one embodiment of a non-contact communication medium of the present invention, in which (a) is a diagram showing a laminated structure, and (b) is a diagram showing a configuration on one side of the base substrate shown in (a). FIG. 5C is a diagram showing the configuration on the other surface of the base material shown in FIG. FIG. 2 is a diagram showing an example of how the moisture detection label shown in FIG. 1 is used. FIG. 2 is a diagram for explaining the effect when water leaks from piping when the moisture detection label shown in FIG. 1 is attached to the floor as shown in FIG. A diagram showing a state when no water leakage occurs, and (b) a diagram showing a state when water leakage occurs from the piping. 2 is a diagram showing an example of a system for detecting water leakage from piping using the moisture detection label shown in FIG. 1. FIG. 5 is a flowchart for explaining a method for detecting water leakage from a pipe when the moisture detection label shown in FIG. 1 is attached to a floor surface as shown in FIG. 2 in the system shown in FIG. 4 . 2 is a diagram showing the relative position of the antenna and solid pattern of the moisture detection label shown in FIG. 1. FIG. FIG. 6 is a diagram showing another embodiment of the contactless communication medium of the present invention. FIG. 6 is a diagram showing another embodiment of the contactless communication medium of the present invention.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing one embodiment of a non-contact communication medium of the present invention, in which (a) is a diagram showing a laminated structure, and (b) is one surface of the base material 10 shown in (a). A diagram showing the above configuration, and (c) a diagram showing the configuration on the other surface of the base material 10 shown in (a).

As shown in FIG. 1, the non-contact communication medium in this embodiment is a moisture detection label 1 configured by a base material 10 sealed with a sealant 30 and an adhesive 20 applied to one surface thereof. .

The base substrate 10 is made of a non-conductive material such as a film. A communication antenna 12 is formed on the surface of the base substrate 10, and an IC chip 11 serving as a detection means is mounted thereon. Two detection wirings 13a and 13b are formed on the back surface of the base material 10.

The antenna 12 is formed on the surface of the base material 10 so that two isosceles triangular conductors are lined up with a gap in between.

One end of the two detection wirings 13a, 13b is connected to the IC chip 11 via through holes 15a, 15 formed through the front and back sides of the base material 10, and They extend in parallel to each other and terminate at the edge of the base material 10. Each of the detection wirings 13a and 13b includes solid patterns 14a and 14b as conductive patterns on the back surface of the base substrate 10, each having a shape that covers the antenna 12 when the moisture detection label 1 is viewed from above.

The IC chip 11 is provided with two antenna terminals (not shown) and two detection terminals (not shown), and the surface on which these antenna terminals and detection terminals are provided serves as a mounting surface. It is mounted on the surface of the base material 10. The antenna terminals of the IC chip 11 are each connected to the antenna 12, and the detection terminals of the IC chip 11 are connected to one end of each of the detection wirings 13a and 13b via through holes 15a and 15b. ing. The IC chip 11 detects the resistance value between the detection wirings 13a and 13b by passing a current generated by electric power obtained through non-contact communication via the antenna 12 through the detection wirings 13a and 13b, and detects the resistance value between the detection wirings 13a and 13b based on the resistance value. The conduction state between the detection wirings 13a and 13b is detected, and the detection result is converted into digital information and transmitted via the antenna 12 in a non-contact manner.

The sealing material 30 is made of a non-conductive material and serves as a protective layer and an insulating layer in the present invention. The sealing material 30 covers the base material 10 on which the antenna 12 and the detection wirings 13a, 13b are formed as described above and on which the IC chip 11 is mounted, and the edges where the detection wirings 13a, 13b terminate. It is covered and sealed from the front, back and sides.

The adhesive 20 is made of a non-conductive material and serves as an insulating layer in the present invention. It is applied to the back surface of the base substrate 10 in the sealing material 30 that seals the base substrate 10.

The moisture detection label 1 of this embodiment is configured as described above, so that the ends of the detection wirings 13a and 13b opposite to the ends connected to the IC chip 11 are connected to the edge of the base material 10. It is exposed from the sealing material 30 and the adhesive 20 at this point. As a result, a portion of the detection wirings 13a and 13b is exposed from the sealing material 30 and the adhesive 20.

Below, a method of using the moisture detection label 1 configured as described above and its effects will be explained.

FIG. 2 is a diagram showing an example of how the moisture detection label 1 shown in FIG. 1 is used.

The moisture detection label 1 shown in FIG. 1 is attached to a metal floor 3 on which piping 2 is installed, for example, as shown in FIG. 2, and is used to detect water leakage from the piping 2. At this time, the moisture detection label 1 detects the occurrence of moisture by detecting the conduction state between the two detection wirings 13a and 13b, as will be described later. The moisture detection label 1 is affixed to the floor surface 3 in a direction in which the end side with the exposed portion 13b approaches the piping 2.

FIG. 3 is a diagram for explaining the effect when water leaks from the piping 2 while the moisture detection label 1 shown in FIG. 1 is attached to the floor surface 3 as shown in FIG. 2. , (a) is a diagram showing a state when water does not leak from the pipe 2, and (b) is a diagram showing a state when water leaks from the pipe 2.

When the moisture detection label 1 shown in FIG. 1 is attached to the floor surface 3 as shown in FIG. 2 and no water leaks from the piping 2, as shown in FIG. 3(a), The two detection wirings 13a and 13b are not electrically connected and are in a non-conductive state.

On the other hand, when the moisture detection label 1 shown in FIG. 1 is attached to the floor surface 3 as shown in FIG. 2, if a water leak occurs in the pipe 2, the moisture from the leak travels along the pipe 2 and accumulates on the floor surface 3, adhering to the moisture detection label 1. As described above, the moisture detection label 1 is attached to the floor surface 3 with the exposed end of the detection wiring 13a, 13b of the base substrate 10 facing the pipe 2. Therefore, as shown in FIG. 3(b), the moisture 13c that has traveled along the pipe 2 and accumulated on the floor surface 3 adheres to the exposed end of the detection wiring 13a, 13b of the base substrate 10. Then, a short circuit 13d occurs between the ends of the two detection wirings 13a, 13b exposed at the end of the base substrate 10, which causes the two detection wirings 13a, 13b to become conductive. Then, by detecting the conductive state between the detection wirings 13a, 13b, it is possible to detect the occurrence of a water leak from the pipe 2.

In this way, when there is no water leakage from the pipe 2, there is no continuity between the detection wirings 13a and 13b, and on the other hand, when there is water leakage from the pipe 2, there is no continuity between the detection wirings 13a and 13b. Since the wirings 13a and 13b are in a conductive state, it is possible to detect that water is leaking from the pipe 2 by detecting the conductive state of the detection wirings 13a and 13b.

In this case, since the detection wirings 13a and 13b are formed on the surface of the base material 10 that faces the floor surface 3, when water leaks from the piping 2, moisture accumulated on the floor surface 3 can be detected. This makes it easier for water to adhere to the ends of the detection wirings 13a and 13b, making it easier to detect water leakage from the pipe 2.

Below, a specific method of detecting the occurrence of water leakage from the pipe 2 using the moisture detection label 1 will be described using the above-mentioned effect.

FIG. 4 is a diagram showing an example of a system for detecting water leakage from the piping 2 using the moisture detection label 1 shown in FIG. 1.

As a system for detecting water leakage from the pipe 2 shown in FIG. 2 using the moisture detection label 1 shown in FIG. 1, a system having a reader/writer 5 as a reading means capable of non-contact communication with the moisture detection label 1, and a management computer 6 as a processing means connected to the reader/writer 5 via wire or wirelessly, as shown in FIG. 4, is conceivable. Note that a handheld terminal incorporating not only the reading means but also the processing means may be used as the reader/writer, in which case the management computer is not necessary. FIG. 5 is a flow chart for explaining a method for detecting water leakage from the pipe 2 in the system shown in FIG. 4 when the moisture detection label 1 shown in FIG. 1 is affixed to the floor surface 3 as shown in FIG. 2.

In the moisture detection label 1 shown in FIG. 1, when the reader/writer 5 is brought close to the moisture detection label 1 and the moisture detection label 1 is detected by the reader/writer 5 (step 1), first, Power is supplied to the moisture detection label 1, and a command to detect the conduction state between the detection wirings 13a and 13b and to transmit the detection results is transmitted to the moisture detection label 1 (step 2). .

When the power supplied from the reader/writer 5 is obtained by the moisture detection label 1 and the command transmitted from the reader/writer 5 is received by the IC chip 11 via the antenna 12 of the moisture detection label 1 (step 3 ), a current is supplied between the detection wirings 13a and 13b by the power supplied from the reader/writer 5.

In the IC chip 11, the resistance value between the detection wirings 13a and 13b is detected using the supplied current, thereby detecting the conduction state between the detection wirings 13a and 13b (step 4). ). Here, if the moisture detection label 1 is attached to the floor surface 3 as shown in FIG. 2 and there is no water leakage from the piping 2, there is no continuity between the detection wirings 13a and 13b. There is. In this state, even if a current is supplied between the detection wiring 13a and 13b by the power supplied from the reader/writer 5, the detection wiring 13a and the detection wiring 13a are in a non-conducting state. , 13b, so that the resistance value detected in the IC chip 11 becomes almost infinite.

In the IC chip 11, when the detected resistance value is almost infinite, it is determined that there is no conduction between the detection wirings 13a and 13b, and the result of the determination is that the detection wirings 13a and 13b are in a non-conductive state. As a result of the detection of the conduction state, the digital information is converted into digital information and transmitted contactlessly to the reader/writer 5 via the antenna 12 (step 5). Note that the resistance value detected by the IC chip 11 when the detection wiring 13a and 13b are in a conductive state is the resistance value detected by the IC chip 11 when the detection wiring 13a and the detection wiring 13b are at the end of the base material 10. Since the resistance value is connected at the end exposed on the side, the resistance value for determining that there is no conduction between the detection wirings 13a and 13b in the IC chip 11 is not nearly infinite. Alternatively, a resistance value greater than a certain threshold value, which is greater than the resistance value at which the detection wiring 13a and the detection wiring 13b are connected at the exposed end of the base substrate 10, may be used.

On the other hand, if the moisture detection label 1 is attached to the floor surface 3 as shown in FIG. Since a short circuit has occurred between the ends of the two exposed detection wirings 13a and 13b, the detection wirings 13a and 13b are in a conductive state, so in the IC chip 11, the detection wiring 13a and The resistance value connected to the detection wiring 13b at the exposed end of the base material 10 is detected.

In the IC chip 11, if the detected resistance value is the resistance value where the detection wires 13a and 13b are connected at the end exposed at the edge of the base substrate 10, it is determined that the detection wires 13a and 13 are in a conductive state, and the determination result is converted into digital information as a detection result of the conductive state between the detection wires 13a and 13 and transmitted non-contact to the reader/writer 5 via the antenna 12. Note that, since the resistance value detected by the IC chip 11 when the detection wires 13a and 13 are in a non-conductive state is almost infinite as described above, the resistance value for determining that the detection wires 13a and 13 are in a conductive state in the IC chip 11 may be a value below a certain threshold value, rather than the resistance value where the detection wires 13a and 13b are connected at the end exposed at the edge of the base substrate 10.

In this way, the reader/writer 5 transmits the electrical continuity state between the detection wires 13a and 13b detected in the moisture detection label 1 in a non-contact manner via the antenna 12.

When the detection result transmitted contactlessly from the moisture detection label 1 to the reader/writer 5 as described above is received by the reader/writer 5 (step 6), the detection result received by the reader/writer 5 is transmitted to the management PC. 6 (step 7).

When the detection result transferred from the reader/writer 5 is received by the management computer 6 (step 8), the moisture detection label 1 is sent to the reader/writer 5 in a non-contact manner in the management computer 6. Based on the detection results transferred to , it is determined whether or not water is leaking from the pipe 2 (step 9). Specifically, in the detection results transferred from the reader/writer 5 to the management computer 6, if there is no continuity between the detection wirings 13a and 13b, it is determined that water is not leaking from the piping 2. If the detection wirings 13a and 13b are electrically connected, it is determined that water is leaking from the pipe 2.

Here, the effect of providing the solid patterns 14a and 14b will be explained.

FIG. 6 is a diagram showing the relative positions of the antenna 12 of the moisture detection label 1 shown in FIG. 1 and the solid patterns 14a, 14b.

As shown in FIG. 6, the moisture detection label 1 shown in FIG. 1 has a shape in which the solid patterns 14a and 14b cover the antenna 12 when the moisture detection label 1 is viewed in a plan view.

Therefore, if the base material 10 is attached to a detected object so that the surface on which the solid patterns 14a and 14b are formed faces the detected object side, the antenna 12 will be placed between the detected object and the antenna 12 in a plan view. Since the solid patterns 14a and 14b covering the substrate are interposed, it is possible to alleviate the influence of metal on non-contact communication when attached to metal. At that time, solid patterns 14a and 14b are formed as part of the detection wiring 13a and 13b to reduce the influence of the detected object made of metal on non-contact communication, so that the antenna 12 and the detected object are connected to each other. There is no need to provide a separate metal layer between the device and the body, and when attached to metal, the effect of metal on non-contact communication can be alleviated with a simple structure, and the manufacturing process is simplified. can do. Note that the distance between the antenna 12 and the solid patterns 14a, 14b is preferably 0.5 mm to 10 mm.

In this embodiment, the ends of the detection wirings 13a and 13b opposite to the ends connected to the IC chip 11 are exposed from the sealing material 30 and the adhesive 20 at the edge of the base substrate 10. Although some of the detection wirings 13a and 13b are exposed from the sealing material 30 and the adhesive 20, they are small enough not to short-circuit the two detection wirings 13a and 13b with the object to be detected. A configuration may also be adopted in which a portion of the detection wirings 13a and 13b are exposed from the sealing material 30 and the adhesive 20 by making holes in the sealing material 30 and the adhesive 20, or the like.

(Other embodiments)
7 and 8 are diagrams showing other embodiments of the contactless communication medium of the present invention, and show a laminated structure.

The moisture detection label 101 shown in Figure 7 can also be considered as a non-contact communication medium of the present invention.

As shown in FIG. 7, the moisture detection label 101 in this embodiment is different from the moisture detection label 1 shown in FIG. The difference is that only the sealing material 130 is covered with the sealing material 130. In addition, in this embodiment, the encapsulant 130 serves as a protective layer in the present invention, the IC chip 111 and the antenna 112 are covered with the encapsulant 130, and the adhesive 120 serves as an insulating layer in the present invention, and the base material The coating is applied to the entire surface on which the detection wirings 113a and 113b of No. 110 are formed, thereby avoiding a short circuit between the detection wirings 113a and 113b and the object to be detected.

Also in the moisture detection label 101 configured as described above, since the detection wirings 113a and 113b are provided with the solid patterns 114a and 114b shaped to cover the antenna 112 in plan view, the solid patterns 114a and 114b of the base substrate 110, If the surface on which 114b is formed is attached to the detected object using the adhesive 120, a solid pattern 114a that covers the antenna 112 in a plan view is formed between the detected object and the antenna 112. , 114b are present, and when the object to be detected is made of metal, the influence of metal on non-contact communication can be alleviated. At that time, since the solid patterns 114a and 114b are formed as part of the detection wiring 113a and 113b to alleviate the influence of the detected object made of metal on non-contact communication, the antenna 112 and the detected object There is no need to provide a separate metal layer between the two, and when attached to metal, the effect of metal on non-contact communication can be alleviated with a simple structure, and the manufacturing process can be simplified. can do. In addition, even in such a configuration, since the detection wirings 113a and 113b are formed on the surface of the base material 110 that faces the object to be detected, when moisture is generated on the object to be detected, the generated moisture can be removed. This makes it easier to adhere to the ends of the detection wirings 113a and 113b, making it easier to detect the state of the object to be detected.

Further, since the IC chip 111 and the antenna 112 are covered with the sealing material 130, direct application of external force to the IC chip 111 and the antenna 112 is avoided, and the IC chip 111 and the antenna 112 can be protected.

A moisture detection label 201 shown in FIG. 8 can also be considered as the non-contact communication medium of the present invention.

As shown in FIG. 8, the moisture detection label 201 in this embodiment is different from the moisture detection label 101 shown in FIG. The difference is that the layers are stacked to cover the IC chip 211 and the antenna 212 instead of being stacked to cover the entire surface on which the IC chip 211 is mounted. In this embodiment, the encapsulant 230 serves as a protective layer in the present invention, the IC chip 211 and the antenna 212 are covered with the encapsulant 230, and the adhesive 220 serves as an insulating layer in the present invention, and the base material The coating is applied to the entire surface on which the detection wirings 213a, 213b of 210 are formed, thereby avoiding short circuits between the detection wirings 213a, 213b and the object to be detected.

Also in the moisture detection label 201 configured as described above, since the detection wirings 213a and 213b have the solid patterns 214a and 214b shaped to cover the antenna 212 in plan view, the solid patterns 214a and 214b of the base material 210, If the surface on which the pattern 214b is formed is attached to the detected object using the adhesive 220, a solid pattern 214a that covers the antenna 212 in a plan view is formed between the detected object and the antenna 212. , 214b are interposed, and when the object to be detected is made of metal, the influence of metal on non-contact communication can be alleviated. At that time, since the solid patterns 214a and 214b are formed as part of the detection wiring 213a and 213b to alleviate the influence of the detected object made of metal on non-contact communication, the antenna 212 and the detected object There is no need to provide a separate metal layer between the two, and when attached to metal, the effect of metal on non-contact communication can be alleviated with a simple structure, and the manufacturing process can be simplified. can do. In addition, even in such a configuration, since the detection wirings 213a and 213b are formed on the surface of the base substrate 210 that faces the object to be detected, when moisture is generated on the object to be detected, the generated moisture can be removed. This makes it easier to adhere to the ends of the detection wirings 213a and 213b, making it easier to detect the state of the object to be detected.

In the case shown in FIGS. 7 and 8, the two detection wirings 113a, 113b, 213a, 213b are connected to the IC chips 111, 211 via through holes 115a, 115b, 215a, 215b, respectively. Since the end opposite to the exposed end is exposed from the adhesive 120, 220 at the edge of the base substrate 110, 210, moisture generated on the object to be detected is absorbed from the exposed end. Although the two detection wirings 113a, 113b, 213a, and 213b become conductive, the holes are small enough to prevent the two detection wirings 113a, 113b, 213a, and 213b from shorting with the object to be detected. The adhesive 120, 220 may be opened, or the adhesive 120b, 220b may be applied in a line shape to a part of the surface of the base material 110, 210 on which the detection wiring 113a, 113b, 213a, 213b is formed. By not applying the coating to the end side where the detection wiring 113a, 113b, 213a, 213b of 210 terminates, a part of the detection wiring 113a, 113b, 213a, 213b is exposed, and moisture is removed from the object to be detected. When this occurs, the two detection wirings 113a, 113b, 213a, and 213b may be brought into conduction by allowing the generated moisture to adhere to the exposed portion. In a configuration in which part of the detection wiring 113a, 113b, 213a, 213b is exposed by not applying the coating to the end side of the base substrate 110, 210 where the detection wiring 113a, 113b, 213a, 213b terminates. When moisture is generated in the object to be detected, the generation of moisture can be detected at an early stage.

In addition, the adhesives 120, 220 should be applied to the surfaces of the base materials 110, 210 to which the objects to be detected are attached in order to avoid short circuits between the detection wirings 113a, 113b, 213a, 213b and the objects to be detected. Of these, at least the detection wirings 113a, 113b, 213a, and 213b may be covered.

Further, in the embodiment described above, the detection wirings 13a, 13b, 113a, 113b, 213a, 213b are formed on the surface of the base material 10, 110, 210 that faces the object to be detected. , the detection wirings 13a, 13b, 113a, 113b, 213a, and 213b are protected from external forces by the base substrates 10, 110, and 210. Therefore, if the purpose is to protect communication antennas 12a, 12b, 112a, 112b, 212a, 212b, detection wiring 13a, 13b, 113a, 113b, 213a, 213b, and IC chips 11, 111, 211 from external force, As shown in FIG. 8, the sealing material 220 may be laminated to cover at least the antennas 212a, 212b and the IC chip 211. In that case, even if the length of the detection wiring 213a, 213b is increased in order to facilitate positioning with the object to be detected during the work of attaching it to the object to be detected, the protective layer formed by the sealant 230 may be too large. It is possible to avoid an increase in the size.

Further, in the embodiment described above, the two detection wirings 13a, 13b, 113a, 113b, 213a, 213b are connected to the through holes 15a, 15b, 115a, 115b formed in the base material 10, 110, 210. , 215a, 215b, the connection to the IC chips 11, 111, 211 has been described as an example, but the means for connecting the two detection wirings and the IC chip is not limited to through holes, for example. , these two detection wirings and the IC chip may be connected via appropriate means such as wiring provided along the end surfaces of the base materials 10, 110, and 210.

1,101,201 Moisture detection label 2 Piping 3 Floor surface 10,110,210 Base material 11,111,211 IC chip 12,112,212 Antenna 13a, 13b, 113a, 213a Detection wiring 14a, 14b, 114a, 214a Solid pattern 15a, 15b, 115a, 215a Through hole 20, 120, 220 Adhesive 30, 130, 230 Sealing material

Claims (2)

a base material,
a communication antenna formed on one surface of the base substrate;
two detection wirings formed on the other surface of the base material;
Connected to the communication antenna and connected to one end of each of the two detection wirings, provided on the one surface of the base material, and conductive between the two detection wirings. a detection means for detecting a state and transmitting the detection result in a non-contact manner via the communication antenna;
an insulating layer laminated to cover at least the detection wiring on the other surface of the base substrate,
The detection wiring includes a conductive pattern having a shape that covers the communication antenna in a plan view, and each of the two detection wirings is a non-contact type with a portion thereof exposed from the insulating layer. Communication medium. The contactless communication medium according to claim 1,
The base material is a non-contact communication medium, on which a protective layer covering at least the communication antenna and the detection means is laminated.

Images