JP7452545B2 - Method for manufacturing a support piece, method for manufacturing a semiconductor device, and laminated film for forming a support piece - Google Patents

Description

The present disclosure provides a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a first chip supported by the plurality of support pieces and The present invention relates to a method for manufacturing a support piece used in a process for manufacturing a semiconductor device having a dolmen structure including a second chip arranged to cover a second chip. The present disclosure also relates to a method for manufacturing a semiconductor device having a dolmen structure and a laminated film for forming a support piece. Note that a dolmen is a type of stone tomb, and includes a plurality of support stones and a plate-shaped rock placed on top of the support stones. In a semiconductor device having a dolmen structure, the support piece corresponds to a "pillar stone" and the second chip corresponds to a "plate-shaped rock."

In recent years, in the field of semiconductor devices, there has been a demand for higher integration, smaller size, and higher speed. 2. Description of the Related Art As one aspect of a semiconductor device, a structure in which a semiconductor chip is stacked on a controller chip arranged on a substrate is attracting attention. For example, U.S. Pat. No. 5,202,300 discloses a semiconductor die assembly that includes a controller die and a memory die supported by a support member on the controller die. The semiconductor assembly 100 illustrated in FIG. 1A of Patent Document 1 can be said to have a dolmen structure. That is, the semiconductor assembly 100 includes a package substrate 102, a controller die 103 disposed on the surface thereof, memory dies 106a and 106b disposed above the controller die 103, and support members 130a and 130b that support the memory die 106a. Equipped with.

Special table 2017-515306 publication

Patent Document 1 discloses that a semiconductor material such as silicon can be used as a support member (support piece), and more specifically, a fragment of a semiconductor material obtained by dicing a semiconductor wafer can be used (Patent Document 1) 1 [0012], [0014] and FIG. 2). In order to manufacture a support piece for a dolmen structure using a semiconductor chip, the following steps are required, for example, as in the manufacture of a normal semiconductor chip.
(1) Step of attaching backgrind tape to semiconductor wafer (2) Step of backgrinding semiconductor wafer (3) Step of attaching adhesive layer and adhesive layer to dicing ring and backgrinded semiconductor wafer placed in it (4) Peeling off the backgrind tape from the semiconductor wafer (5) Separating the semiconductor wafer into pieces (6) Separating the semiconductor chips and adhesive pieces The process of picking up the support piece consisting of a laminate from the adhesive layer

According to studies conducted by the present inventors, it has been found that by using a material other than a semiconductor chip (for example, a resin material), it is possible to simplify the process of manufacturing a support piece in the manufacturing process of a semiconductor device having a dolmen structure. . By the way, when a support piece is picked up from an adhesive layer using a device (for example, a die bonder, etc.) used in the manufacture of normal semiconductor chips, the support piece to be picked up may not be picked up efficiently. One of the reasons for this is that before the step of picking up the support piece from the adhesive layer, the visibility of the support piece with a camera attached to a device such as a die bonder is insufficient.

Therefore, the present disclosure provides a method of manufacturing a support piece that efficiently manufactures a support piece that is highly visible to a camera. The present disclosure also provides a method for manufacturing a semiconductor device having a dolmen structure, and a laminated film for forming a support piece.

One aspect of the present disclosure relates to a method of manufacturing a support piece used in a manufacturing process of a semiconductor device having a dolmen structure. The method for manufacturing the support piece includes the following steps.
(A) Step of preparing a laminated film comprising a base film, an adhesive layer, and a supporting piece forming film having a color difference from the base film and the adhesive layer in this order. (B) Cutting the supporting piece forming film into individual pieces. (C) Step of picking up the support pieces from the adhesive layer by forming a plurality of support pieces on the surface of the adhesive layer.

According to the method for manufacturing a support piece according to one aspect of the present disclosure, the support piece can be obtained by dividing the film for forming a support piece into pieces. This simplifies the process of manufacturing the support piece compared to the conventional manufacturing method in which pieces of semiconductor material obtained by dicing a semiconductor wafer are used as the support piece. That is, whereas conventionally the steps (1) to (6) described above were required, since the support piece forming film does not include a semiconductor wafer, steps (1), (2) and Step (4) can be omitted. Furthermore, since semiconductor wafers, which are more expensive than resin materials, are not used, costs can be reduced.

Further, according to the method for manufacturing a support piece according to one aspect of the present disclosure, it is possible to efficiently manufacture a support piece that has excellent visibility with a camera. The reason why the visibility with a camera is improved is, for example, because the support piece forming film has a color difference with the base film and the adhesive layer, when the support piece forming film is separated into pieces, the supporting piece forming film is This is thought to be because the optical contrast between the film, the base film, and the adhesive layer becomes higher.

The supporting piece forming film may be a film made of a thermosetting resin layer containing a coloring agent, or may be a multilayer film having a thermosetting resin layer and a resin layer containing a coloring agent. By using these support piece forming films, it becomes possible to more efficiently manufacture support pieces that are highly visible with a camera.

The method for manufacturing a support piece according to the present disclosure may include a step of recognizing the position of the support piece with a camera between the step (B) and the step (C).

The adhesive layer of the laminated film prepared in step (A) may be of a pressure-sensitive type or an ultraviolet curing type. That is, the adhesive layer may or may not be cured by ultraviolet irradiation; in other words, it may or may not contain a resin having photoreactive carbon-carbon double bonds. You don't have to. Note that the pressure-sensitive adhesive layer may contain a resin having a photoreactive carbon-carbon double bond. For example, the adhesive layer may be made by irradiating a predetermined region with ultraviolet rays to reduce the adhesiveness of the region. For example, the adhesive layer may be made of a resin having photoreactive carbon-carbon double bonds. It may remain. When the adhesive layer is an ultraviolet curing type, the adhesiveness of the adhesive layer can be reduced by performing a step of irradiating the adhesive layer with ultraviolet rays between the steps (B) and (C).

One aspect of the present disclosure provides a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a first chip supported by the plurality of support pieces. The present invention also relates to a method of manufacturing a semiconductor device having a dolmen structure including a second chip disposed to cover the first chip. The method for manufacturing a semiconductor device includes the following steps.
(D) Step of placing the first chip on the substrate (E) Step of placing a plurality of support pieces obtained by the above manufacturing method on the substrate around the first chip (F) Step of placing the second chip on the substrate (G) preparing an adhesive-attached chip comprising a chip and an adhesive strip provided on one side of a second chip; (G) by placing the adhesive-attached chip on the surface of a plurality of support pieces; The process of building a dolmen structure

The step of heating the support piece forming film or the support piece to harden the thermosetting resin layer or adhesive piece may be performed at an appropriate timing, for example, before the step (G). At the stage of arranging the adhesive-attached chips so as to be in contact with the surfaces of multiple support pieces, the thermosetting resin layer is already hardened, which prevents the support pieces from deforming as the adhesive-attached chips are placed. can. Note that since the thermosetting resin layer has adhesive properties to other members (for example, the substrate), there is no need to separately provide an adhesive layer or the like on the support piece.

One aspect of the present disclosure provides a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a first chip supported by the plurality of support pieces. The present invention also relates to a laminated film for forming a support piece used in a manufacturing process of a semiconductor device having a dolmen structure including a second chip disposed so as to cover the first chip. The support piece forming laminated film includes a base film, an adhesive layer, and a support piece forming film having a color difference from the base film and the adhesive layer in this order.

The thickness of the supporting piece forming film may be, for example, 5 to 180 μm or 20 to 120 μm. When the thickness of the support piece forming film is within this range, it is possible to construct a dolmen structure with an appropriate height relative to the first chip (eg, controller chip).

The supporting piece forming film may be a film made of a thermosetting resin layer containing a coloring agent, or may be a multilayer film having a thermosetting resin layer and a resin layer containing a coloring agent. The supporting piece forming film may include a thermosetting resin layer. It is preferable that the thermosetting resin layer contains, for example, an epoxy resin.

One aspect of the present disclosure relates to a method for manufacturing a laminated film for forming a support piece. The method for producing a laminated film for forming a support piece includes the steps of preparing an adhesive film having a base film and an adhesive layer formed on one surface thereof, and forming a base film and an adhesive layer on the surface of the adhesive layer. and a step of laminating a support piece forming film having a color difference.

According to the present disclosure, there is provided a method for manufacturing a support piece that efficiently manufactures a support piece that is highly visible with a camera. Further, according to the present disclosure, a method for manufacturing a semiconductor device having a dolmen structure and a laminated film for forming a supporting piece are provided.

FIG. 1 is a cross-sectional view schematically showing a first embodiment of a semiconductor device. FIGS. 2(a), 2(b), and 2(c) are plan views schematically showing examples of the positional relationship between the first chip and the plurality of support pieces. FIG. 3(a) is a plan view schematically showing one embodiment of the support piece-forming laminated film, and FIG. 3(b) is a sectional view taken along line bb in FIG. 3(a). FIG. 4 is a cross-sectional view schematically showing the process of bonding the adhesive layer and the supporting piece forming film together. 5(a), FIG. 5(b), FIG. 5(c), and FIG. 5(d) are cross-sectional views schematically showing one embodiment of a method for manufacturing a support piece. FIG. 6(a) is a plan view schematically showing an embodiment of the supporting piece forming film after singulation, and FIG. 6(b) is an enlarged view of portion E in FIG. 6(a). be. FIG. 7 is a cross-sectional view schematically showing a state in which a plurality of support pieces are arranged around the first chip on the substrate. FIG. 8 is a cross-sectional view schematically showing an example of a chip with an adhesive piece. FIG. 9 is a cross-sectional view schematically showing a dolmen structure formed on a substrate. FIG. 10 is a cross-sectional view schematically showing a second embodiment of the semiconductor device. FIGS. 11(a) and 11(b) are cross-sectional views each schematically showing another embodiment of a laminated film for forming a support piece.

Embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the present invention is not limited to the following embodiments. In this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, and "(meth)acrylate" means acrylate or a methacrylate corresponding thereto. "A or B" may include either A or B, or both.

In this specification, the term "layer" includes not only a structure formed on the entire surface but also a structure formed on a part of the layer when observed in a plan view. In addition, in this specification, the term "process" does not only refer to an independent process, but also refers to a process that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved. included. Furthermore, a numerical range indicated using "~" indicates a range that includes the numerical values written before and after "~" as the minimum and maximum values, respectively.

In this specification, when there are multiple substances corresponding to each component in the composition, unless otherwise specified, the content of each component in the composition refers to the total amount of the multiple substances present in the composition. means. Further, unless otherwise specified, the exemplified materials may be used alone or in combination of two or more. Furthermore, in the numerical ranges described stepwise in this specification, the upper limit or lower limit of the numerical range of one step may be replaced with the upper limit or lower limit of the numerical range of another step.

<First embodiment>
(semiconductor device)
FIG. 1 is a cross-sectional view schematically showing a first embodiment of a semiconductor device. The semiconductor device 100 shown in FIG. 1 includes a substrate 10, a chip T1 (first chip) arranged on the surface of the substrate 10, and a plurality of A support piece Dc, a chip T2 (second chip) placed above the chip T1, an adhesive piece Tc sandwiched between the chip T2 and the plurality of support pieces Dc, and an adhesive piece Tc laminated on the chip T2. A plurality of wires w electrically connect the chips T3 and T4, electrodes (not shown) on the surface of the substrate 10, and the chips T1 to T4, respectively, and a seal filled in the gap between the chips T1 and T2. A retaining member 50 is provided.

In this embodiment, a dolmen structure is configured on the substrate 10 by a plurality of support pieces Dc, a chip T2, and an adhesive piece Tc located between the support piece Dc and the chip T2. The chip T1 is spaced apart from the adhesive piece Tc. By appropriately setting the thickness of the support piece Dc, it is possible to secure a space for the wire w that connects the top surface of the chip T1 and the substrate 10.

The substrate 10 may be an organic substrate or a metal substrate such as a lead frame. From the viewpoint of suppressing warpage of the semiconductor device 100, the thickness of the substrate 10 is, for example, 90 to 300 μm, and may be 90 to 210 μm.

The chip T1 is, for example, a controller chip, and is bonded to the substrate 10 by an adhesive piece Tc and electrically connected to the substrate 10 by a wire w. The shape of the chip T1 in plan view is, for example, rectangular (square or rectangle). The length of one side of the chip T1 is, for example, 5 mm or less, and may be 2 to 5 mm or 1 to 5 mm. The thickness of the chip T1 is, for example, 10 to 150 μm, and may be 20 to 100 μm.

The chip T2 is, for example, a memory chip, and is bonded onto the support piece Dc via an adhesive piece Tc. Chip T2 has a larger size than chip T1 in plan view. The shape of the chip T2 in plan view is, for example, rectangular (square or rectangle). The length of one side of the chip T2 is, for example, 20 mm or less, and may be 4 to 20 mm or 4 to 12 mm. The thickness of the chip T2 is, for example, 10 to 170 μm, and may be 20 to 120 μm. Note that the chips T3 and T4 are also memory chips, for example, and are bonded onto the chip T2 via an adhesive piece Tc. The length of one side of the chips T3 and T4 may be the same as that of the chip T2, and the thickness of the chips T3 and T4 may also be the same as that of the chip T2.

The support piece Dc serves as a spacer that forms a space around the chip T1. The support piece Dc includes a cured product of a support piece forming film (cured product of a thermosetting resin composition) having a color difference from the base film and the adhesive layer. It is preferable that the support piece Dc does not include a metal layer made of a metal material (for example, copper, nickel, titanium, stainless steel, aluminum, etc.). In addition, as shown in FIG. 2(a), two supporting pieces Dc (shape: rectangular) may be arranged at separate positions on both sides of the chip T1, or as shown in FIG. 2(b), One support piece Dc (shape: square, total of 4 pieces) may be placed at each position corresponding to the corner of the chip T1, or as shown in FIG. One supporting piece Dc (shape: rectangular, total of 4 pieces) may be arranged in each of the supporting pieces Dc. The length of one side of the support piece Dc in plan view is, for example, 20 mm or less, and may be 1 to 20 mm or 1 to 12 mm. The thickness (height) of the support piece Dc is, for example, 10 to 180 μm, and may be 20 to 120 μm.

(Method for manufacturing support piece)
An example of a method for manufacturing a support piece will be described. The manufacturing method according to this embodiment includes the following steps (A) to (C).
(A) Laminated film 20 for forming a support piece (hereinafter referred to as (referred to as "laminated film 20") (see FIGS. 3 and 4)
(B) Step of forming a plurality of support pieces Da on the surface of the adhesive layer 2 by dividing the support piece forming film D into pieces (see FIG. 5(b))
(C) Step of picking up the support piece Da from the adhesive layer 2 (see FIG. 5(d))

Note that the support piece Dc shown in FIG. 1 is obtained after the adhesive piece (thermosetting resin composition) contained therein is cured. On the other hand, the support piece Da is in a state before the adhesive piece (thermosetting resin composition) contained therein is completely cured (for example, see FIG. 5(b)).

Steps (A) to (C) are processes for manufacturing a plurality of support pieces Da. Hereinafter, steps (A) to (C) will be explained with reference to FIGS. 3 to 5.

[(A) Process]
Step (A) is a step of preparing the laminated film 20. The laminated film 20 includes a base film 1, an adhesive layer 2, and a supporting piece forming film D having a color difference from the base film 1 and the adhesive layer 2. The base film 1 is, for example, a polyethylene terephthalate film (PET film). The adhesive layer 2 is formed into a circular shape by punching or the like (see FIG. 3(a)). The adhesive layer 2 may be made of a pressure-sensitive adhesive or an ultraviolet curing adhesive. When the adhesive layer 2 is made of an ultraviolet curable adhesive, the adhesive layer 2 has a property that its adhesiveness decreases when irradiated with ultraviolet rays. The supporting piece forming film D is formed into a circular shape by punching or the like, and has a smaller diameter than the adhesive layer 2 (see FIG. 3(a)). The supporting piece forming film D may be made of a thermosetting resin composition.

The thermosetting resin composition constituting the supporting piece forming film D can go through a semi-cured (B stage) state and then become a completely cured product (C stage) state by a subsequent curing treatment. The thermosetting resin composition contains an epoxy resin, a curing agent, and an elastomer (for example, acrylic resin) from the viewpoint of easily adjusting the shear viscosity within a predetermined range and expressing a color difference between the base film and the adhesive layer. , a coloring agent, and may further contain an inorganic filler, a curing accelerator, and the like, if necessary. Details of the thermosetting resin composition constituting the support piece forming film D will be described later.

The thickness of the supporting piece forming film D may be, for example, 5 to 180 μm or 20 to 120 μm. When the thickness of the support piece forming film is within this range, it is possible to construct a dolmen structure with an appropriate height relative to the first chip (eg, controller chip).

The laminated film 20 includes, for example, a first laminated film having a base film 1 and an adhesive layer 2 on its surface, and a second laminated film having a cover film 3 and a supporting piece forming film D on its surface. It can be produced by bonding a film together (see FIG. 4). The first laminated film is obtained through a step of forming an adhesive layer on the surface of the base film 1 by coating, and a step of processing the adhesive layer into a predetermined shape (for example, circular) by punching or the like. The second laminated film is formed by forming a supporting piece forming film by coating on the surface of the cover film 3 (for example, PET film or polyethylene film), and punching the supporting piece forming film into a predetermined shape ( For example, it is obtained through a process of processing into a circular shape. When using the laminated film 20, the cover film 3 is peeled off at an appropriate timing.

[(B) Process]
Step (B) is a step of forming a plurality of support pieces Da on the surface of the adhesive layer 2 by dividing the support piece forming film D into pieces. As shown in FIG. 5(a), a dicing ring DR is attached to the laminated film 20. That is, the dicing ring DR is attached to the adhesive layer 2 of the laminated film 20, and the supporting piece forming film D is placed inside the dicing ring DR. The supporting piece forming film D is diced into pieces (see FIG. 5(b)). Thereby, a large number of support pieces Da are obtained from the support piece forming film D.

[(C) Process]
Step (C) is a step of picking up the support piece Da from the adhesive layer 2. As shown in FIG. 5(c), by expanding the base film 1, the supporting pieces Da are separated from each other. Next, as shown in FIG. 5(d), the support piece Da is pushed up with the push-up jig 42 to peel the support piece Da from the adhesive layer 2, and the support piece Da is picked up by suction with the suction collet 44. .

FIG. 6(a) is a plan view schematically showing an embodiment of the support piece forming film after singulation, and FIG. 6(b) is an enlarged view of part E in FIG. 6(a). be. In this specification, "visibility with a camera" refers to when the support piece forming film after singulation is observed with a camera attached to a device (for example, a die bonder, etc.) used for normal semiconductor chip manufacturing. , means ease of confirmation of the support piece Da relative to the base film 1 and the adhesive layer 2. The ease of this confirmation can be improved by, for example, increasing (enlarging) the optical contrast between the base film 1 and the adhesive layer 2 and the support piece Da. Since the base film 1 is usually white and the adhesive layer 2 is transparent, the color of the support piece Da is not particularly limited as long as it can exhibit optical contrast with these. The color of the support piece Da is preferably black because the optical contrast becomes clearer. The color of the support piece Da can be adjusted to a desired color by adjusting the components (in particular, the coloring agent) of the thermosetting resin composition described below.

The method for manufacturing a support piece according to this embodiment may include a step of recognizing the position of the support piece with a camera between the step (B) and the step (C).

According to the method for manufacturing a support piece according to the present embodiment, the laminated film 20 includes the base film 1, the adhesive layer 2, and the support piece forming film D having a color difference from the base film 1 and the adhesive layer 2. Therefore, due to the color difference between the support piece forming film, the base film, and the adhesive layer, the optical contrast becomes higher, the visibility of the support piece Da with a camera improves, and the support piece Da is picked up more efficiently. becomes possible.

(Method for manufacturing semiconductor devices)
A method for manufacturing the semiconductor device 100 will be described. The manufacturing method according to this embodiment includes the following steps (D) to (H).
(D) Step of arranging the first chip T1 on the substrate 10 (E) Step of arranging a plurality of support pieces Da obtained by the above manufacturing method around the first chip T1 on the substrate 10 ( (See Figure 7)
(F) Step of preparing a chip T2a with an adhesive piece including a second chip T2 and an adhesive piece Ta provided on one surface of the second chip T2 (see FIG. 8)
(G) Step of constructing a dolmen structure by arranging the adhesive chip T2a on the surface of the plurality of support pieces Dc (see FIG. 9)
(H) A step of sealing the gap between the chip T1 and the chip T2 with the sealing material 50 (see FIG. 1)

Steps (D) to (H) are processes in which a dolmen structure is constructed on the substrate 10 using a plurality of supporting pieces Da. Hereinafter, steps (D) to (H) will be explained with reference to FIGS. 7 to 9.

[(D) Process]
Step (D) is a step of arranging the first chip T1 on the substrate 10. For example, first, the chip T1 is placed at a predetermined position on the substrate 10 via the adhesive layer T1c. Thereafter, the chip T1 is electrically connected to the substrate 10 by the wire w.

[(E) Process]
Step (E) is a step of arranging a plurality of support pieces Da on the substrate 10 around the first chip T1. Through this process, a structure 30 shown in FIG. 7 is manufactured. The structure 30 includes a substrate 10, a chip T1 disposed on the surface thereof, and a plurality of support pieces Da. The support pieces Da may be arranged by pressure bonding. The pressure bonding process is preferably performed, for example, at 80 to 180° C. and 0.01 to 0.50 MPa for 0.5 to 3.0 seconds. Note that the adhesive piece 5p included in the support piece Da may be completely cured to become the support piece Dc at the time of step (E), or may not be completely cured at this point. It is preferable that the adhesive piece 5p included in the support piece Da is completely cured and becomes the adhesive piece 5c before the start of the step (G).

[(F) Process]
Step (F) is a step of preparing a chip T2a with an adhesive piece shown in FIG. The chip T2a with an adhesive piece includes a chip T2 and an adhesive piece Ta provided on one surface of the chip T2. The adhesive chip T2a can be obtained, for example, by using a semiconductor wafer and a dicing/die bonding integrated film, and through a dicing process and a pickup process.

[(G) Process]
Step (G) is a step of arranging the chip T2a with the adhesive piece above the chip T1 so that the adhesive piece Ta is in contact with the upper surface of the plurality of support pieces Dc. Specifically, the chip T2 is pressure-bonded to the upper surface of the support piece Dc via the adhesive piece Ta. This pressure bonding process is preferably carried out under conditions of 80 to 180° C. and 0.01 to 0.50 MPa for 0.5 to 3.0 seconds, for example. Next, the adhesive piece Ta is cured by heating. This curing treatment is preferably performed, for example, at 60 to 175° C. and 0.01 to 1.0 MPa for 5 minutes or more. As a result, the adhesive piece Ta is cured and becomes an adhesive piece Tc. Through this process, a dolmen structure is constructed on the substrate 10 (see FIG. 9).

After the (G) process and before the (H) process, a chip T3 is placed on top of the chip T2 via an adhesive piece, and a chip T4 is further placed on top of the chip T3 via an adhesive piece. . The adhesive piece may be made of the same thermosetting resin composition as the adhesive piece Ta described above, and becomes an adhesive piece Tc by heating and curing (see FIG. 1). On the other hand, the chips T2, T3, and T4 are electrically connected to the substrate 10 using wires w. Note that the number of chips stacked above the chip T1 is not limited to three in this embodiment, and may be set as appropriate.

[(H) Process]
Step (H) is a step of sealing the gap between the chip T1 and the chip T2 with the sealing material 50. Through this process, the semiconductor device 100 shown in FIG. 1 is completed.

(Thermosetting resin composition)
As described above, the thermosetting resin composition constituting the supporting piece forming film D contains an epoxy resin, a curing agent, an elastomer, and a colorant, and if necessary, an inorganic filler, a curing accelerator, etc. further including.
・Characteristic 1: When the support piece Da is thermocompression bonded to a predetermined position of the substrate 10, positional displacement is unlikely to occur (the melt viscosity (shear viscosity) of the adhesive piece 5p at 120° C. is, for example, 4300 to 50000 Pa·s or 5000-40000Pa・s)
- Characteristic 2: The adhesive piece 5c exhibits stress relaxation properties within the semiconductor device 100 (the thermosetting resin composition contains an elastomer (rubber component))
・Characteristic 3: The adhesive strength of the adhesive piece 5c (i.e., the cured product of the film consisting of a thermosetting resin layer) of the adhesive piece 5c to the adhesive piece Tc is sufficiently high. (Shear strength) is, for example, 2.0 to 7.0 Mpa or 3.0 to 6.0 Mpa)
・Property 4: The shrinkage rate due to curing is sufficiently small. ・Property 5: The adhesive piece 5c has sufficient mechanical strength.

[Epoxy resin]
The epoxy resin is not particularly limited as long as it hardens and has an adhesive effect. Bifunctional epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, and bisphenol S epoxy resin, novolak epoxy resins such as phenol novolak epoxy resin, and cresol novolak epoxy resin can be used. Additionally, commonly known resins such as polyfunctional epoxy resins, glycidylamine type epoxy resins, heterocycle-containing epoxy resins, and alicyclic epoxy resins can be used. These may be used alone or in combination of two or more.

[Curing agent]
Examples of the curing agent include phenolic resins, ester compounds, aromatic amines, aliphatic amines, and acid anhydrides. Among these, phenolic resins are preferred from the viewpoint of achieving high die shear strength (shear strength). Commercially available phenolic resins include, for example, LF-4871 (trade name, BPA novolac type phenol resin) manufactured by DIC Corporation, HE-100C-30 (trade name, phenylarachyl type phenol resin) manufactured by Air Water Co., Ltd. resins), Phenolite KA and TD series manufactured by DIC Corporation, Mirex XLC-series and XL series (e.g. Mirex XLC-LL) manufactured by Mitsui Chemicals, HE series (e.g. HE100C) manufactured by Air Water Corporation. -30), MEHC-7800 series (e.g. MEHC-7800-4S) manufactured by Meiwa Kasei Co., Ltd., JDPP series manufactured by JEF Chemical Co., Ltd., PSM series (e.g. PSM-4326) manufactured by Gunei Chemical Co., Ltd., etc. can be mentioned. These may be used alone or in combination of two or more.

From the viewpoint of achieving high die shear strength (shear strength), it is preferable that the compounding amount of the epoxy resin and the phenol resin is such that the equivalent ratio of epoxy equivalent to hydroxyl group is 0.6 to 1.5, and 0.7 to 1.5. It is more preferably 1.4, and even more preferably 0.8 to 1.3. When the blending ratio is within the above range, it is easy to achieve sufficiently high levels of both curability and fluidity.

[Elastoma]
Examples of the elastomer include acrylic resin, polyester resin, polyamide resin, polyimide resin, silicone resin, polybutadiene, acrylonitrile, epoxy-modified polybutadiene, maleic anhydride-modified polybutadiene, phenol-modified polybutadiene, and carboxy-modified acrylonitrile.

From the viewpoint of achieving high die shear strength (shear strength), an acrylic resin is preferable as the elastomer, and further, an acrylic resin obtained by polymerizing a functional monomer having an epoxy group or a glycidyl group as a crosslinkable functional group such as glycidyl acrylate or glycidyl methacrylate. Acrylic resins such as epoxy group-containing (meth)acrylic copolymers are more preferred. Among the acrylic resins, epoxy group-containing (meth)acrylic ester copolymers and epoxy group-containing acrylic rubbers are preferred, and epoxy group-containing acrylic rubbers are more preferred. The epoxy group-containing acrylic rubber is a rubber having an epoxy group, which is mainly composed of an acrylic acid ester, and is mainly composed of a copolymer such as butyl acrylate and acrylonitrile, or a copolymer such as ethyl acrylate and acrylonitrile. Note that the acrylic resin may have not only an epoxy group but also a crosslinkable functional group such as an alcoholic or phenolic hydroxyl group or a carboxyl group.

Commercially available acrylic resins include, for example, SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23, and SG-P3 solvent-modified products (product name, acrylic rubber, manufactured by Nagase Chemtech Corporation). Weight average molecular weight: 800,000, Tg: 12°C, solvent: cyclohexanone), etc.

From the viewpoint of achieving high die shear strength (shear strength), the glass transition temperature (Tg) of the acrylic resin is preferably -50 to 50°C, more preferably -30 to 30°C. The weight average molecular weight (Mw) of the acrylic resin is preferably 100,000 to 3,000,000, more preferably 500,000 to 2,000,000 from the viewpoint of achieving high die shear strength (shear strength). Here, Mw means a value measured by gel permeation chromatography (GPC) and converted using a standard polystyrene calibration curve. It should be noted that by using an acrylic resin with a narrow molecular weight distribution, highly elastic adhesive pieces tend to be formed.

From the viewpoint of achieving high die shear strength (shear strength), the amount of elastomer contained in the thermosetting resin composition should be 10 to 200 parts by mass based on 100 parts by mass of the epoxy resin and epoxy resin curing agent in total. The amount is preferably 20 to 100 parts by mass, and more preferably 20 to 100 parts by mass.

The colorant is not particularly limited as long as it can express a color difference between the base film and the adhesive layer, and known pigments, dyes, etc. can be used. Since the base film is usually white and the adhesive layer is transparent, any coloring agent can be used without particular restriction as long as it can exhibit an optical contrast with these. The color of the colorant is preferably black, as this provides clearer optical contrast. Examples of the black colorant include carbon black.

The amount of coloring agent contained in the thermosetting resin composition is 0.1 to 10 parts by mass per 100 parts by mass of the resin component of the thermosetting resin composition, from the viewpoint of developing a higher color difference with the adhesive layer. parts, more preferably 0.1 to 5 parts by mass.

[Inorganic filler]
Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whiskers, boron nitride, and crystals. Examples include crystalline silica and amorphous silica. These may be used alone or in combination of two or more.

The average particle size of the inorganic filler is preferably 0.005 μm to 1.0 μm, more preferably 0.05 μm to 0.5 μm, from the viewpoint of achieving high die shear strength. The surface of the inorganic filler is preferably chemically modified from the viewpoint of achieving high die shear strength (shear strength). Examples of materials that chemically modify the surface include silane coupling agents and the like. Examples of the functional group of the silane coupling agent include vinyl group, acryloyl group, epoxy group, mercapto group, amino group, diamino group, alkoxy group, and ethoxy group.

From the viewpoint of achieving high die shear strength (shear strength), the content of the inorganic filler is preferably 20 to 200 parts by mass, and 30 to 100 parts by mass, relative to 100 parts by mass of the resin component of the thermosetting resin composition. It is more preferable that it is part.

[Curing accelerator]
Examples of the curing accelerator include imidazoles and derivatives thereof, organic phosphorus compounds, secondary amines, tertiary amines, and quaternary ammonium salts. From the viewpoint of achieving high die shear strength (shear strength), imidazole-based compounds are preferred. Examples of imidazoles include 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-methylimidazole. These may be used alone or in combination of two or more.

From the viewpoint of achieving high die shear strength (shear strength), the content of the curing accelerator in the thermosetting resin composition is 0.04 to 3 parts by mass per 100 parts by mass of the epoxy resin and epoxy resin curing agent in total. is preferable, and 0.04 to 0.2 parts by mass is more preferable.

<Second embodiment>
FIG. 10 is a cross-sectional view schematically showing a second embodiment of the semiconductor device. In the semiconductor device 100 according to the first embodiment, the chip T1 is separated from the adhesive piece Tc, whereas in the semiconductor device 200 according to the present embodiment, the chip T1 is in contact with the adhesive piece Tc. That is, the adhesive piece Tc is in contact with the top surface of the chip T1 and the top surface of the support piece Dc. For example, by appropriately setting the thickness of the support piece forming film D, the position of the top surface of the chip T1 and the position of the top surface of the support piece Dc can be made to match.

In the semiconductor device 200, the chip T1 is connected to the substrate 10 by flip-chip connection rather than by wire bonding. Note that if the chip T2 is embedded in the adhesive piece Ta constituting the adhesive piece T2a, even if the chip T1 is wire-bonded to the substrate 10, the chip T1 will not be in contact with the adhesive piece Tc. The state can be set as follows.

Although the embodiments of the present disclosure have been described in detail above, the present invention is not limited to the above embodiments. For example, in the above embodiment, as shown in FIG. 3(b), the laminated film 20 for forming a support piece is provided with a support piece forming film D made of a thermosetting resin layer containing a coloring agent. The laminated film for forming a piece may include a multilayer film having a thermosetting resin layer and a resin layer containing a colorant (a resin layer made of a resin containing a colorant). FIGS. 11(a) and 11(b) are cross-sectional views each schematically showing another embodiment of a laminated film for forming a support piece. The support piece forming laminated film 20A shown in FIG. 11(a) has a two-layer film D2 (support piece forming film) having a thermosetting resin layer 5 and a resin layer 6 containing a colorant. That is, in the support piece forming laminated film 20A, the thermosetting resin layer 5 is disposed between the adhesive layer 2 and the outermost resin layer 6 containing a colorant. Note that the thermosetting resin layer 5 may be made of the thermosetting resin composition that constitutes the support piece forming film D according to the first embodiment, but the thermosetting resin composition may contain a colorant. It does not have to be included. The thickness of the thermosetting resin layer 5 may be the same as the thickness of the support piece forming film D. The thickness of the resin layer 6 containing the colorant is, for example, 5 to 100 μm, and may be 10 to 90 μm or 20 to 80 μm. Since the base film is usually white and the adhesive layer is transparent, the colorant is not particularly limited as long as it has a color that can create an optical contrast with these. The color of the coloring agent is preferably black because it provides a clearer contrast. Examples of the black colorant include the same black colorants as exemplified above. The colorant-containing resin is made of a colorant-containing resin, and can be formed using a commercially available colorant-containing resin. For example, the resin layer containing a black colorant is made of a resin containing a black colorant, and can be formed using a commercially available resin containing a black colorant. The resin containing the black colorant may be, for example, black polyimide because it has sufficient mechanical strength.

The support piece forming laminated film 20B shown in FIG. 11(b) is a three-layer film D3 having a resin layer 6 containing a colorant and two thermosetting resin layers 5 sandwiching the resin layer 6 containing a colorant. (support piece forming film). In the support piece forming laminated film 20B, a three-layer film D3 is arranged on the surface of the adhesive layer 2.

By including the resin layer 6 containing a coloring agent, the support piece forming laminated film 20A has a higher optical contrast between the support piece forming film and the adhesive layer, so that the support piece has better visibility with a camera. can be manufactured efficiently.

The support piece forming laminated film 20A can be manufactured, for example, through the following steps.
- A process of preparing a laminated film comprising the base film 1, an adhesive layer 2, and a thermosetting resin layer 5 in this order - A process of laminating a resin layer 6 containing a colorant on the surface of the laminated film

The support piece forming laminated film 20B can be manufactured by, for example, adding the step of providing the thermosetting resin layer 5 on the colorant-containing resin layer 6 to the manufacturing method of the support piece forming laminated film 20A. can.

According to the present disclosure, there is provided a method for manufacturing a support piece that efficiently manufactures a support piece that is highly visible with a camera. Further, according to the present disclosure, a method for manufacturing a semiconductor device having a dolmen structure and a laminated film for forming a supporting piece are provided.

DESCRIPTION OF SYMBOLS 1... Base film, 2... Adhesive layer, 5... Thermosetting resin layer, 6... Resin layer, 10... Substrate, 20, 20A, 20B... Laminated film for forming support piece, 50... Sealing material, 100,200 ...Semiconductor device, D...Film for forming support piece, D2...Two-layer film (film for forming support piece), Da, Dc...Support piece, T1...First chip, T2...Second chip, T2a...Adhesive Single chip, Ta, Tc...Adhesive piece.

Claims (9)

a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a first chip supported by the plurality of support pieces and A method for manufacturing a support piece used in a manufacturing process of a semiconductor device having a dolmen structure including a second chip arranged to cover one chip,
(A) preparing a laminated film comprising a base film, an adhesive layer, and a supporting piece forming film having a color difference from the base film and the adhesive layer in this order;
(B) forming a plurality of support pieces on the surface of the adhesive layer by dividing the support piece forming film into pieces;
(C) picking up the support piece from the adhesive layer;
A method of manufacturing a support piece, comprising: The method for manufacturing a support piece according to claim 1, wherein the support piece forming film is a film made of a thermosetting resin layer containing a colorant. The method for manufacturing a support piece according to claim 1, wherein the film for forming a support piece is a multilayer film having a thermosetting resin layer and a resin layer containing a colorant. The method for manufacturing a support piece according to any one of claims 1 to 3, comprising a step of recognizing the position of the support piece with a camera between steps (B) and (C). a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a first chip supported by the plurality of support pieces and A method for manufacturing a semiconductor device having a dolmen structure including a second chip arranged to cover one chip,
(D) placing a first chip on the substrate;
(E) arranging a plurality of support pieces obtained by the manufacturing method according to any one of claims 1 to 4 on the substrate and around the first chip;
(F) preparing a chip with an adhesive piece comprising a second chip and an adhesive piece provided on one surface of the second chip;
(G) constructing a dolmen structure by placing the adhesive chip on the surface of a plurality of the support pieces;
A method for manufacturing a semiconductor device, including: 6. The method for manufacturing a semiconductor device according to claim 5, further comprising a step of heating the supporting piece forming film or the supporting piece before the step (G). a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a first chip supported by the plurality of support pieces and A laminated film for forming a support piece used in a manufacturing process of a semiconductor device having a dolmen structure including a second chip arranged to cover one chip,
base film,
an adhesive layer;
a supporting piece forming film having a color difference from the base film and the adhesive layer;
A laminated film for forming a supporting piece, comprising: in this order. The laminated film for forming a support piece according to claim 7, wherein the film for forming a support piece is a film made of a thermosetting resin layer containing a colorant. The laminated film for forming a support piece according to claim 7, wherein the film for forming a support piece is a multilayer film having a thermosetting resin layer and a resin layer containing a colorant.

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