JP7446098B2 - Vinyl chloride resin composition for paste processing, plastisol for paste processing, and manufacturing method thereof - Google Patents
Vinyl chloride resin composition for paste processing, plastisol for paste processing, and manufacturing method thereof Download PDFInfo
- Publication number
- JP7446098B2 JP7446098B2 JP2019221511A JP2019221511A JP7446098B2 JP 7446098 B2 JP7446098 B2 JP 7446098B2 JP 2019221511 A JP2019221511 A JP 2019221511A JP 2019221511 A JP2019221511 A JP 2019221511A JP 7446098 B2 JP7446098 B2 JP 7446098B2
- Authority
- JP
- Japan
- Prior art keywords
- vinyl chloride
- paste processing
- plastisol
- phosphoric acid
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 title claims description 133
- 229920001944 Plastisol Polymers 0.000 title claims description 55
- 239000004999 plastisol Substances 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000011342 resin composition Substances 0.000 title description 19
- 238000003672 processing method Methods 0.000 title 1
- 229920005989 resin Polymers 0.000 claims description 109
- 239000011347 resin Substances 0.000 claims description 109
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 60
- 239000002994 raw material Substances 0.000 claims description 41
- 239000008187 granular material Substances 0.000 claims description 39
- 239000003945 anionic surfactant Substances 0.000 claims description 37
- 239000000203 mixture Substances 0.000 claims description 34
- 239000002245 particle Substances 0.000 claims description 33
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 30
- 239000004014 plasticizer Substances 0.000 claims description 27
- 238000002156 mixing Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 239000006185 dispersion Substances 0.000 claims description 12
- 239000011164 primary particle Substances 0.000 claims description 12
- 125000003342 alkenyl group Chemical group 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000010419 fine particle Substances 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 150000001340 alkali metals Chemical class 0.000 claims description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 5
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 3
- -1 polyoxyethylene Polymers 0.000 description 90
- 229910019142 PO4 Inorganic materials 0.000 description 22
- 239000010452 phosphate Substances 0.000 description 22
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 20
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 20
- 150000005215 alkyl ethers Chemical class 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 18
- 239000000843 powder Substances 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 238000004062 sedimentation Methods 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 6
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 5
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000013049 sediment Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 3
- 239000002612 dispersion medium Substances 0.000 description 3
- JQCXWCOOWVGKMT-UHFFFAOYSA-N phthalic acid diheptyl ester Natural products CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- KMZHZAAOEWVPSE-UHFFFAOYSA-N 2,3-dihydroxypropyl acetate Chemical compound CC(=O)OCC(O)CO KMZHZAAOEWVPSE-UHFFFAOYSA-N 0.000 description 2
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 2
- UYXTWWCETRIEDR-UHFFFAOYSA-N Tributyrin Chemical compound CCCC(=O)OCC(OC(=O)CCC)COC(=O)CCC UYXTWWCETRIEDR-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- MGWAVDBGNNKXQV-UHFFFAOYSA-N diisobutyl phthalate Chemical compound CC(C)COC(=O)C1=CC=CC=C1C(=O)OCC(C)C MGWAVDBGNNKXQV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 125000006353 oxyethylene group Chemical group 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000001694 spray drying Methods 0.000 description 2
- 238000010557 suspension polymerization reaction Methods 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- IQBLWPLYPNOTJC-FPLPWBNLSA-N (z)-4-(2-ethylhexoxy)-4-oxobut-2-enoic acid Chemical compound CCCCC(CC)COC(=O)\C=C/C(O)=O IQBLWPLYPNOTJC-FPLPWBNLSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- 239000000263 2,3-dihydroxypropyl (Z)-octadec-9-enoate Substances 0.000 description 1
- PHDVPEOLXYBNJY-KTKRTIGZSA-N 2-(2-hydroxyethoxy)ethyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCOCCO PHDVPEOLXYBNJY-KTKRTIGZSA-N 0.000 description 1
- QUYITUXSUUKIRL-ZDKIGPTLSA-N 2-(2-hydroxyethoxy)ethyl (z,12r)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(=O)OCCOCCO QUYITUXSUUKIRL-ZDKIGPTLSA-N 0.000 description 1
- WGIMXKDCVCTHGW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCOCCO WGIMXKDCVCTHGW-UHFFFAOYSA-N 0.000 description 1
- RTGQGAXEHFZMBG-UHFFFAOYSA-N 2-(2-nonanoyloxyethoxy)ethyl nonanoate Chemical compound CCCCCCCCC(=O)OCCOCCOC(=O)CCCCCCCC RTGQGAXEHFZMBG-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- AHSGHEXYEABOKT-UHFFFAOYSA-N 2-[2-(2-benzoyloxyethoxy)ethoxy]ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOCCOC(=O)C1=CC=CC=C1 AHSGHEXYEABOKT-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- ALKCLFLTXBBMMP-UHFFFAOYSA-N 3,7-dimethylocta-1,6-dien-3-yl hexanoate Chemical compound CCCCCC(=O)OC(C)(C=C)CCC=C(C)C ALKCLFLTXBBMMP-UHFFFAOYSA-N 0.000 description 1
- NUCFNMOPTGEHQA-UHFFFAOYSA-N 3-bromo-2h-pyrazolo[4,3-c]pyridine Chemical compound C1=NC=C2C(Br)=NNC2=C1 NUCFNMOPTGEHQA-UHFFFAOYSA-N 0.000 description 1
- DYYFCJRYZVHEKQ-UHFFFAOYSA-N 3-butoxycarbonylbut-3-enoic acid Chemical compound CCCCOC(=O)C(=C)CC(O)=O DYYFCJRYZVHEKQ-UHFFFAOYSA-N 0.000 description 1
- RZRNAYUHWVFMIP-GDCKJWNLSA-N 3-oleoyl-sn-glycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@H](O)CO RZRNAYUHWVFMIP-GDCKJWNLSA-N 0.000 description 1
- LEUWBMAQQQENOO-UHFFFAOYSA-N 4-(4-chlorophenyl)-6-methyl-2-oxo-3,4-dihydro-1h-pyridine-5-carboxylic acid Chemical compound C1C(=O)NC(C)=C(C(O)=O)C1C1=CC=C(Cl)C=C1 LEUWBMAQQQENOO-UHFFFAOYSA-N 0.000 description 1
- OIYTYGOUZOARSH-UHFFFAOYSA-N 4-methoxy-2-methylidene-4-oxobutanoic acid Chemical compound COC(=O)CC(=C)C(O)=O OIYTYGOUZOARSH-UHFFFAOYSA-N 0.000 description 1
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- XTJFFFGAUHQWII-UHFFFAOYSA-N Dibutyl adipate Chemical compound CCCCOC(=O)CCCCC(=O)OCCCC XTJFFFGAUHQWII-UHFFFAOYSA-N 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- VOWAEIGWURALJQ-UHFFFAOYSA-N Dicyclohexyl phthalate Chemical compound C=1C=CC=C(C(=O)OC2CCCCC2)C=1C(=O)OC1CCCCC1 VOWAEIGWURALJQ-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- KRADHMIOFJQKEZ-UHFFFAOYSA-N Tri-2-ethylhexyl trimellitate Chemical compound CCCCC(CC)COC(=O)C1=CC=C(C(=O)OCC(CC)CCCC)C(C(=O)OCC(CC)CCCC)=C1 KRADHMIOFJQKEZ-UHFFFAOYSA-N 0.000 description 1
- DOOTYTYQINUNNV-UHFFFAOYSA-N Triethyl citrate Chemical compound CCOC(=O)CC(O)(C(=O)OCC)CC(=O)OCC DOOTYTYQINUNNV-UHFFFAOYSA-N 0.000 description 1
- GTVWRXDRKAHEAD-UHFFFAOYSA-N Tris(2-ethylhexyl) phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OCC(CC)CCCC GTVWRXDRKAHEAD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001278 adipic acid derivatives Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229940053200 antiepileptics fatty acid derivative Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001535 azelaic acid derivatives Chemical class 0.000 description 1
- SHLNMHIRQGRGOL-UHFFFAOYSA-N barium zinc Chemical compound [Zn].[Ba] SHLNMHIRQGRGOL-UHFFFAOYSA-N 0.000 description 1
- ROPXFXOUUANXRR-BUHFOSPRSA-N bis(2-ethylhexyl) (e)-but-2-enedioate Chemical compound CCCCC(CC)COC(=O)\C=C\C(=O)OCC(CC)CCCC ROPXFXOUUANXRR-BUHFOSPRSA-N 0.000 description 1
- CGNRQCGWXXLTIA-UHFFFAOYSA-N bis(2-ethylhexyl) 2-methylidenebutanedioate Chemical compound CCCCC(CC)COC(=O)CC(=C)C(=O)OCC(CC)CCCC CGNRQCGWXXLTIA-UHFFFAOYSA-N 0.000 description 1
- WXZOXVVKILCOPG-UHFFFAOYSA-N bis(2-ethylhexyl) benzene-1,3-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC(C(=O)OCC(CC)CCCC)=C1 WXZOXVVKILCOPG-UHFFFAOYSA-N 0.000 description 1
- ZVPBHZIVOWGPMT-UHFFFAOYSA-N bis(2-ethylhexyl) cyclohexene-1,2-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1=C(C(=O)OCC(CC)CCCC)CCCC1 ZVPBHZIVOWGPMT-UHFFFAOYSA-N 0.000 description 1
- ZDWGXBPVPXVXMQ-UHFFFAOYSA-N bis(2-ethylhexyl) nonanedioate Chemical compound CCCCC(CC)COC(=O)CCCCCCCC(=O)OCC(CC)CCCC ZDWGXBPVPXVXMQ-UHFFFAOYSA-N 0.000 description 1
- IMIOEHJVRZOQBJ-UHFFFAOYSA-N bis(6-methylheptyl) benzene-1,3-dicarboxylate Chemical compound CC(C)CCCCCOC(=O)C1=CC=CC(C(=O)OCCCCCC(C)C)=C1 IMIOEHJVRZOQBJ-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical class OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- JBSLOWBPDRZSMB-BQYQJAHWSA-N dibutyl (e)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C\C(=O)OCCCC JBSLOWBPDRZSMB-BQYQJAHWSA-N 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- OGVXYCDTRMDYOG-UHFFFAOYSA-N dibutyl 2-methylidenebutanedioate Chemical compound CCCCOC(=O)CC(=C)C(=O)OCCCC OGVXYCDTRMDYOG-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZEFVHSWKYCYFFL-UHFFFAOYSA-N diethyl 2-methylidenebutanedioate Chemical compound CCOC(=O)CC(=C)C(=O)OCC ZEFVHSWKYCYFFL-UHFFFAOYSA-N 0.000 description 1
- YKDMBTQVKVEMSA-UHFFFAOYSA-N diethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOCCOC(=O)CCCCCCCCCCCCCCCCC YKDMBTQVKVEMSA-UHFFFAOYSA-N 0.000 description 1
- 229940111071 diethylene glycol distearate Drugs 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- ZWWQRMFIZFPUAA-UHFFFAOYSA-N dimethyl 2-methylidenebutanedioate Chemical compound COC(=O)CC(=C)C(=O)OC ZWWQRMFIZFPUAA-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- DROMNWUQASBTFM-UHFFFAOYSA-N dinonyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCC DROMNWUQASBTFM-UHFFFAOYSA-N 0.000 description 1
- UCEHPOGKWWZMHC-UHFFFAOYSA-N dioctyl cyclohex-3-ene-1,2-dicarboxylate Chemical compound CCCCCCCCOC(=O)C1CCC=CC1C(=O)OCCCCCCCC UCEHPOGKWWZMHC-UHFFFAOYSA-N 0.000 description 1
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 description 1
- DWNAQMUDCDVSLT-UHFFFAOYSA-N diphenyl phthalate Chemical compound C=1C=CC=C(C(=O)OC=2C=CC=CC=2)C=1C(=O)OC1=CC=CC=C1 DWNAQMUDCDVSLT-UHFFFAOYSA-N 0.000 description 1
- QQVHEQUEHCEAKS-UHFFFAOYSA-N diundecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCC QQVHEQUEHCEAKS-UHFFFAOYSA-N 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 150000002237 fumaric acid derivatives Chemical class 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- 235000013773 glyceryl triacetate Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002531 isophthalic acids Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical class OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- RZRNAYUHWVFMIP-UHFFFAOYSA-N monoelaidin Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-UHFFFAOYSA-N 0.000 description 1
- 229940043348 myristyl alcohol Drugs 0.000 description 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002826 nitrites Chemical class 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical class CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 150000002888 oleic acid derivatives Chemical class 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003329 sebacic acid derivatives Chemical class 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- PZTAGFCBNDBBFZ-UHFFFAOYSA-N tert-butyl 2-(hydroxymethyl)piperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCCCC1CO PZTAGFCBNDBBFZ-UHFFFAOYSA-N 0.000 description 1
- GNCDUZFXTFAOBE-UHFFFAOYSA-N tetrakis(2-ethylhexyl) benzene-1,2,4,5-tetracarboxylate Chemical compound CCCCC(CC)COC(=O)C1=CC(C(=O)OCC(CC)CCCC)=C(C(=O)OCC(CC)CCCC)C=C1C(=O)OCC(CC)CCCC GNCDUZFXTFAOBE-UHFFFAOYSA-N 0.000 description 1
- 229960002622 triacetin Drugs 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- WEAPVABOECTMGR-UHFFFAOYSA-N triethyl 2-acetyloxypropane-1,2,3-tricarboxylate Chemical compound CCOC(=O)CC(C(=O)OCC)(OC(C)=O)CC(=O)OCC WEAPVABOECTMGR-UHFFFAOYSA-N 0.000 description 1
- 239000001069 triethyl citrate Substances 0.000 description 1
- VMYFZRTXGLUXMZ-UHFFFAOYSA-N triethyl citrate Natural products CCOC(=O)C(O)(C(=O)OCC)C(=O)OCC VMYFZRTXGLUXMZ-UHFFFAOYSA-N 0.000 description 1
- 235000013769 triethyl citrate Nutrition 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- MXHBQKVKHGQWRB-UHFFFAOYSA-N trihexyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCC)C(C(=O)OCCCCCC)=C1 MXHBQKVKHGQWRB-UHFFFAOYSA-N 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- WDRCVXGINNJWPH-UHFFFAOYSA-N tris(6-methylheptyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCOC(=O)C1=CC=C(C(=O)OCCCCCC(C)C)C(C(=O)OCCCCCC(C)C)=C1 WDRCVXGINNJWPH-UHFFFAOYSA-N 0.000 description 1
- YPDXSCXISVYHOB-UHFFFAOYSA-N tris(7-methyloctyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCC(C)C)C(C(=O)OCCCCCCC(C)C)=C1 YPDXSCXISVYHOB-UHFFFAOYSA-N 0.000 description 1
- FJFYFBRNDHRTHL-UHFFFAOYSA-N tris(8-methylnonyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC(C)C)C(C(=O)OCCCCCCCC(C)C)=C1 FJFYFBRNDHRTHL-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、ペースト加工に用いられる塩化ビニル系樹脂組成物、並びにペースト加工に用いられるプラスチゾル及びその製造方法に関する。 The present invention relates to a vinyl chloride resin composition used in paste processing, a plastisol used in paste processing, and a method for producing the same.
塩化ビニル樹脂のペースト加工は、ペースト加工用塩化ビニル系原料樹脂微粒子を可塑剤と混合してプラスチゾルに調製して実施されている。その際、上記ペースト加工用塩化ビニル系原料樹脂微粒子の可塑剤への分散性を向上させるために界面活性剤が配合されることがある。かかる界面活性剤としては、ポリオキシエチレンアルキルエーテル系非イオン性界面活性剤が好適なものとして汎用され、その他に、そのリン酸エステル化体であるリン酸エステル系アニオン性界面活性剤等も使用されている。これらポリオキシエチレン鎖を有する界面活性剤は、一般的に界面活性能が高く、より汎用的な存在であるなどの理由から、オキシエチレン単位の繰り返し数が8程度の長鎖のものが使用されている。 Paste processing of vinyl chloride resin is carried out by mixing vinyl chloride raw material resin particles for paste processing with a plasticizer to prepare plastisol. At that time, a surfactant may be blended in order to improve the dispersibility of the vinyl chloride raw resin fine particles for paste processing in the plasticizer. As such surfactants, polyoxyethylene alkyl ether type nonionic surfactants are widely used as suitable ones, and phosphate ester type anionic surfactants, which are their phosphoric acid esters, are also used. has been done. These polyoxyethylene chain-containing surfactants generally have a long chain of about 8 repeating oxyethylene units because they have high surfactant ability and are more versatile. ing.
このプラスチゾルの用途としては、塗料、コーティング剤等の低粘度品用途がある。このような低粘度品用途の場合、得られるプラスチゾルの粘度を低下させる目的で、上記のようなペースト加工用塩化ビニル系原料樹脂微粒子及び可塑剤の他に、ペースト加工用塩化ビニル系ブレンド樹脂粒子を混合することがある(例えば、特許文献1参照)。 This plastisol is used for low viscosity products such as paints and coating agents. In the case of applications for such low-viscosity products, in order to reduce the viscosity of the resulting plastisol, in addition to the above-mentioned vinyl chloride-based raw material resin particles for paste processing and a plasticizer, vinyl chloride-based blend resin particles for paste processing are added. may be mixed (for example, see Patent Document 1).
上記のように、プラスチゾルにペースト加工用塩化ビニル系ブレンド樹脂粒子を混合する場合、界面活性剤として、上記のようなポリオキシエチレン単位の繰り返し数が8程度のポリオキシエチレンアルキルエーテル系非イオン性界面活性剤や、そのリン酸エステル化体を使用すると、プラスチゾルを長期間保存した際、ぺースト加工用塩化ビニル系ブレンド樹脂粒子に由来した沈降物が生じるという問題があった。 As mentioned above, when mixing vinyl chloride blend resin particles for paste processing with plastisol, as a surfactant, a nonionic polyoxyethylene alkyl ether with a repeating number of polyoxyethylene units of about 8 as described above is used. When a surfactant or a phosphoric acid ester thereof is used, there is a problem in that when plastisol is stored for a long period of time, a precipitate derived from the vinyl chloride blend resin particles for paste processing is generated.
本発明の課題は、低粘度のプラスチゾルにおいて、ぺースト加工用塩化ビニル系ブレンド樹脂粒子に由来した沈降物の発生を抑制することにある。 An object of the present invention is to suppress the generation of sediment derived from vinyl chloride blend resin particles for paste processing in a low viscosity plastisol.
本発明者らは、界面活性剤として、ポリオキシエチレン単位の繰り返し数が1~5のポリオキシエチレン鎖が短いポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤を使用することにより、上記課題を解決できることを見いだし、本発明を完成するに至った。 The present inventors used a polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant with a short polyoxyethylene chain and a polyoxyethylene unit repeating number of 1 to 5 as the surfactant. The inventors have found that the above problems can be solved, and have completed the present invention.
すなわち、本発明は、以下の通りのものである。
[1]ペースト加工用塩化ビニル系原料樹脂と、ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤(ただし、ポリオキシエチレン単位の繰り返し数が1~5である。)とを含有することを特徴とするペースト加工用塩化ビニル系樹脂組成物。
[2]前記ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤が、下記式(1)又は(2)で表される化合物であることを特徴とする[1]記載のペースト加工用塩化ビニル系樹脂組成物。
That is, the present invention is as follows.
[1] A vinyl chloride raw material resin for paste processing and a polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant (however, the number of repeating polyoxyethylene units is 1 to 5). A vinyl chloride resin composition for paste processing, characterized in that it contains:
[2] The paste according to [1], wherein the polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant is a compound represented by the following formula (1) or (2). Vinyl chloride resin composition for processing.
(式(1)及び(2)中、Rは、アルキル基、アルケニル基、又はアラルキル基を表し、Mは、水素原子、アルカリ金属、又はアルカリ土類金属を表し、nは1~5の整数を表し、ポリオキシエチレン単位のエチレン基は、それぞれアルキル基又はアルケニル基で置換されていてもよい。) (In formulas (1) and (2), R represents an alkyl group, an alkenyl group, or an aralkyl group, M represents a hydrogen atom, an alkali metal, or an alkaline earth metal, and n is an integer of 1 to 5. and each ethylene group in the polyoxyethylene unit may be substituted with an alkyl group or an alkenyl group.)
[3]前記ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤が、ペースト加工用塩化ビニル系原料樹脂100質量部に対して0.01~2.0質量部含有されていることを特徴とする[1]又は[2]記載のペースト加工用塩化ビニル系樹脂組成物。
[4]前記ペースト加工用塩化ビニル系原料樹脂は、一次粒子の平均粒子径が0.1~3.0μmの微粒子であることを特徴とする[1]~[3]のいずれか記載のペースト加工用塩化ビニル系樹脂組成物。
[5]顆粒状であることを特徴とする[1]~[4]のいずれか記載のペースト加工用塩化ビニル系樹脂組成物。
[3] The polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant is contained in an amount of 0.01 to 2.0 parts by mass based on 100 parts by mass of vinyl chloride raw material resin for paste processing. The vinyl chloride resin composition for paste processing according to [1] or [2].
[4] The paste according to any one of [1] to [3], wherein the vinyl chloride raw material resin for paste processing is fine particles with an average primary particle diameter of 0.1 to 3.0 μm. Vinyl chloride resin composition for processing.
[5] The vinyl chloride resin composition for paste processing according to any one of [1] to [4], which is in the form of granules.
[6]ペースト加工用塩化ビニル系原料樹脂と、ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤(ただし、ポリオキシエチレン単位の繰り返し数が1~5である。)と、ペースト加工用塩化ビニル系ブレンド樹脂と、可塑剤とを含有することを特徴とするペースト加工用プラスチゾル。
[7]前記ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤が、上記式(1)又は(2)で表される化合物であることを特徴とする[6]記載のペースト加工用プラスチゾル。
[8]粘度が、1500~3200mPa・sであることを特徴とする[6]又は[7]記載のペースト加工用プラスチゾル。
[6] A vinyl chloride raw material resin for paste processing, a polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant (however, the number of repeating polyoxyethylene units is 1 to 5), A plastisol for paste processing, characterized by containing a vinyl chloride blend resin for paste processing and a plasticizer.
[7] The paste according to [6], wherein the polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant is a compound represented by the above formula (1) or (2). Plastisol for processing.
[8] The plastisol for paste processing according to [6] or [7], which has a viscosity of 1500 to 3200 mPa·s.
[9]ペースト加工用塩化ビニル系原料樹脂と、ペースト加工用塩化ビニル系ブレンド樹脂と、可塑剤とを含有するペースト加工用プラスチゾルの製造方法であって、
ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤(ただし、ポリオキシエチレン単位の繰り返し数が1~5である。)を配合することを特徴とするペースト加工用プラスチゾルの製造方法。
[10]ペースト加工用塩化ビニル系原料樹脂の水性分散液に、ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤(ただし、ポリオキシエチレン単位の繰り返し数が1~5である。)を配合し、乾燥して、ペースト加工用塩化ビニル系樹脂顆粒を調製する第1工程と、
前記ペースト加工用塩化ビニル系樹脂顆粒と、ペースト加工用塩化ビニル系ブレンド樹脂粒子と、可塑剤とを混合して、ゾルを調製する第2工程と、
を有することを特徴とする[9]記載のペースト加工用プラスチゾルの製造方法。
[9] A method for producing a plastisol for paste processing containing a vinyl chloride raw material resin for paste processing, a vinyl chloride blend resin for paste processing, and a plasticizer, the method comprising:
A method for producing plastisol for paste processing, which comprises blending a polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant (with the repeating number of polyoxyethylene units being 1 to 5). .
[10] A polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant (provided that the number of repeating polyoxyethylene units is 1 to 5) is added to the aqueous dispersion of vinyl chloride raw material resin for paste processing. ) and drying to prepare vinyl chloride resin granules for paste processing;
a second step of preparing a sol by mixing the vinyl chloride resin granules for paste processing, the vinyl chloride blend resin particles for paste processing, and a plasticizer;
The method for producing plastisol for paste processing according to [9], which comprises:
[11]前記ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤が、上記式(1)又は(2)で表される化合物であることを特徴とする[9]又は[10]記載のペースト加工用プラスチゾルの製造方法。 [11] The polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant is a compound represented by the above formula (1) or (2) [9] or [10] ] The method for producing plastisol for paste processing.
[12]前記ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤を、前記ペースト加工用塩化ビニル系原料樹脂100質量部に対して0.01~2.0質量部配合することを特徴とする[9]~[11]のいずれか記載のペースト加工用プラスチゾルの製造方法。 [12] 0.01 to 2.0 parts by mass of the polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant is blended with respect to 100 parts by mass of the vinyl chloride raw material resin for paste processing. The method for producing plastisol for paste processing according to any one of [9] to [11], characterized by:
本発明によれば、低粘度のプラスチゾルにおいて、ぺースト加工用塩化ビニル系ブレンド樹脂粒子に由来した沈降物の発生を抑制することができる。 According to the present invention, in a low-viscosity plastisol, it is possible to suppress the generation of sediment derived from vinyl chloride blend resin particles for paste processing.
[ペースト加工用塩化ビニル系樹脂組成物]
本発明のペースト加工用塩化ビニル系樹脂組成物は、ペースト加工用塩化ビニル系原料樹脂と、ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤(ただし、ポリオキシエチレン単位の繰り返し数が1~5である。)とを含有する。
[Vinyl chloride resin composition for paste processing]
The vinyl chloride resin composition for paste processing of the present invention comprises a vinyl chloride raw material resin for paste processing, a polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant (however, repeating polyoxyethylene units) The number is 1 to 5).
本発明のペースト加工用塩化ビニル系樹脂組成物の形態としては、例えば、顆粒状物の他、それぞれの粉体の混合物等の粉体の組合せを挙げることができる。顆粒状物の場合、そのレーザー回折/散乱式粒子径分布測定装置で測定した平均粒子径は20~150μmであることが好ましく、30~100μmであることがより好ましい。粉体の場合、そのレーザー回折/散乱式粒子径分布測定装置で測定した平均粒子径は0.1~10μmであることが好ましく、0.5~5μmであることがより好ましい。 Examples of the form of the vinyl chloride resin composition for paste processing of the present invention include granules as well as combinations of powders such as a mixture of each powder. In the case of granules, the average particle diameter measured with a laser diffraction/scattering particle size distribution analyzer is preferably 20 to 150 μm, more preferably 30 to 100 μm. In the case of powder, the average particle diameter measured with a laser diffraction/scattering particle size distribution analyzer is preferably 0.1 to 10 μm, more preferably 0.5 to 5 μm.
ぺースト加工用塩化ビニル系ブレンド樹脂を使用するプラスチゾルの製造において、本発明のペースト加工用塩化ビニル系樹脂組成物を使用することにより、低粘度のゾルとすることができると共に、ぺースト加工用塩化ビニル系ブレンド樹脂粒子に由来した沈降物の発生を抑制することができる。また、顆粒とした際に、見掛け密度が高いものとなり、空送性や流動性に優れた取り扱い性の良好なものとなる。さらに、長期保存後も、ペースト加工用塩化ビニル系原料樹脂の可塑剤への良好な分散性を維持することができる。 In the production of plastisol using a vinyl chloride blend resin for paste processing, by using the vinyl chloride resin composition for paste processing of the present invention, it is possible to obtain a sol with low viscosity, and also to produce a plastisol that uses a vinyl chloride blend resin for paste processing. Generation of sediment derived from vinyl chloride blend resin particles can be suppressed. Moreover, when made into granules, they have a high apparent density, have excellent air transportability and fluidity, and are easy to handle. Furthermore, even after long-term storage, good dispersibility of the vinyl chloride raw material resin for paste processing in the plasticizer can be maintained.
以下、本件明細書においては、本発明におけるペースト加工用塩化ビニル系原料樹脂を、単に塩化ビニル系原料樹脂と称し、ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤(ただし、ポリオキシエチレン単位の繰り返し数が1~5である。)を単にリン酸型アニオン系界面活性剤と称し、ペースト加工用塩化ビニル系ブレンド樹脂を、単に塩化ビニル系ブレンド樹脂と称すことがある。 Hereinafter, in this specification, the vinyl chloride-based raw material resin for paste processing in the present invention will be simply referred to as vinyl chloride-based raw material resin, and the polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant (however, The number of repeating polyoxyethylene units is 1 to 5) is simply referred to as a phosphate-type anionic surfactant, and the vinyl chloride blend resin for paste processing is sometimes simply referred to as a vinyl chloride blend resin.
(ペースト加工用塩化ビニル系原料樹脂)
本発明におけるペースト加工用塩化ビニル系原料樹脂としては、塩化ビニルのホモポリマーの他、塩化ビニルを主体とするコポリマーが含まれる。塩化ビニルを主体とするとは、例えば、塩化ビニルが全体の50質量%以上であることをいい、70質量%以上であることが好ましい。
(Vinyl chloride raw material resin for paste processing)
The vinyl chloride raw material resin for paste processing in the present invention includes homopolymers of vinyl chloride as well as copolymers mainly composed of vinyl chloride. Containing vinyl chloride as a main component means, for example, that vinyl chloride accounts for 50% by mass or more, preferably 70% by mass or more.
塩化ビニルと共重合し得る単量体としては、例えば、エチレン、プロピレン等のオレフィン系化合物;酢酸ビニル、プロピオン酸ビニル等のビニルエステル;アクリル酸、メタクリル酸等の不飽和モノカルボン酸;アクリル酸メチル、アクリル酸エチル、アクリル酸-n-ブチル、アクリル酸-2-ヒドロキシエチル、メタクリル酸メチル、メタクリル酸エチル、メタクリル酸-N,N-ジメチルアミノエチル等の不飽和モノカルボン酸エステル;アクリルアミド、メタクリルアミド等の不飽和アミド;アクリロニトリル、メタクリロニトリル等の不飽和ニトリル;マレイン酸、フマル酸等の不飽和ジカルボン酸;これらのエステルおよびこれらの無水物;N-置換マレイミド類;ビニルメチルエーテル、ビニルエチルエーテル等のビニルエーテル;塩化ビニリデン等のビニリデン化合物等を挙げることができる。 Monomers that can be copolymerized with vinyl chloride include, for example, olefinic compounds such as ethylene and propylene; vinyl esters such as vinyl acetate and vinyl propionate; unsaturated monocarboxylic acids such as acrylic acid and methacrylic acid; acrylic acid Unsaturated monocarboxylic acid esters such as methyl, ethyl acrylate, n-butyl acrylate, 2-hydroxyethyl acrylate, methyl methacrylate, ethyl methacrylate, and N,N-dimethylaminoethyl methacrylate; acrylamide; Unsaturated amides such as methacrylamide; unsaturated nitrites such as acrylonitrile and methacrylonitrile; unsaturated dicarboxylic acids such as maleic acid and fumaric acid; esters and anhydrides thereof; N-substituted maleimides; vinyl methyl ether, Examples include vinyl ethers such as vinyl ethyl ether; vinylidene compounds such as vinylidene chloride; and the like.
本発明の塩化ビニル系原料樹脂は、塩化ビニル単独で、又は塩化ビニルとこれと共重合可能な不飽和単量体とからなる単量体混合物を従来公知の方法で重合することにより得ることができる。例えば、乳化重合(播種乳化重合を含む)や、微細懸濁重合(播種微細懸濁重合を含む)により得ることができる。 The vinyl chloride-based raw material resin of the present invention can be obtained by polymerizing vinyl chloride alone or a monomer mixture consisting of vinyl chloride and an unsaturated monomer copolymerizable with vinyl chloride by a conventionally known method. can. For example, it can be obtained by emulsion polymerization (including seeded emulsion polymerization) or fine suspension polymerization (including seeded fine suspension polymerization).
得られる塩化ビニル系原料樹脂は、通常、一次粒子の平均粒子径が0.1~3.0μmの微粒子であり、0.7~2.0μmの微粒子であることが好ましい。この一次粒子の平均粒子径は、光透過式-遠心沈降粒度分布測定器により、測定されたものをいう。 The obtained vinyl chloride raw material resin is usually fine particles with an average primary particle diameter of 0.1 to 3.0 μm, preferably fine particles of 0.7 to 2.0 μm. The average particle diameter of the primary particles is measured using a light transmission type centrifugal sedimentation particle size distribution analyzer.
(ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤)
本発明におけるポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤は、ポリオキシエチレン単位の繰り返し数が1~5である。
具体的には、下記式(1)又は(2)に示すものを挙げることができる。
(Polyoxyethylene alkyl ether phosphate/phosphate type anionic surfactant)
The polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant in the present invention has a repeating number of polyoxyethylene units of 1 to 5.
Specifically, those shown in the following formula (1) or (2) can be mentioned.
式(1)及び(2)中、Rは、アルキル基、アルケニル基、又はアラルキル基を表す。アルキル基、アルケニル基、又はアラルキル基のアルキル部分は、直鎖状であっても、分岐鎖状であってもよく、その炭素数としては、例えば、1~30が好ましく、5~20がより好ましく、10~16がさらに好ましい。アラルキル基のアリール部分としては、例えば、フェニル基、ナフチル基を挙げることができる。 In formulas (1) and (2), R represents an alkyl group, an alkenyl group, or an aralkyl group. The alkyl group, alkenyl group, or alkyl moiety of the aralkyl group may be linear or branched, and the number of carbon atoms thereof is, for example, preferably 1 to 30, more preferably 5 to 20. Preferably, 10 to 16 are more preferable. Examples of the aryl moiety of the aralkyl group include a phenyl group and a naphthyl group.
Mは、水素原子、アルカリ金属、又はアルカリ土類金属を表す。アルカリ金属としては、ナトリウム、カリウム等を挙げることができ、ナトリウムが好ましい。アルカリ土類金属としては、マグネシウム、カルシウム等を挙げることができ、マグネシウムが好ましい。
nは1~5の整数を表し、1~4の整数が好ましい。
また、ポリオキシエチレン単位のエチレン基は、それぞれアルキル基又はアルケニル基で置換されていてもよい。すなわち、一部のポリオキシエチレン単位のエチレン基が置換基を有していてもよいし、すべてのポリオキシエチレン単位のエチレン基が置換基を有していてもよい。置換基としてのアルキル基及びアルケニル基は、直鎖状であっても、分岐鎖状であってもよく、その炭素数としては、例えば、1~6が好ましく、1~4がより好ましく、1~2がさらに好ましい。
M represents a hydrogen atom, an alkali metal, or an alkaline earth metal. Examples of the alkali metal include sodium and potassium, with sodium being preferred. Examples of alkaline earth metals include magnesium and calcium, with magnesium being preferred.
n represents an integer of 1 to 5, preferably an integer of 1 to 4.
Moreover, the ethylene group of the polyoxyethylene unit may be substituted with an alkyl group or an alkenyl group, respectively. That is, the ethylene groups of some polyoxyethylene units may have substituents, or the ethylene groups of all polyoxyethylene units may have substituents. The alkyl group and alkenyl group as a substituent may be linear or branched, and the number of carbon atoms thereof is, for example, preferably 1 to 6, more preferably 1 to 4, 1 -2 is more preferred.
より具体的に、式(1)又は(2)に示すリン酸型アニオン系界面活性剤は、下記式(1A)又は(2A)で表すことができる。 More specifically, the phosphate type anionic surfactant represented by formula (1) or (2) can be represented by the following formula (1A) or (2A).
式(1A)及び(2A)中、ポリオキシエチレン単位は、それぞれ同一であっても、異なっていてもよい。ポリオキシエチレン単位の構造は、ブロック構造であっても、ランダム構造であってもよい。R1~R4は、水素原子、アルキル基又はアルケニル基を表し、それぞれ同一であっても、異なっていてもよい。また、n1は0~5の整数であり、n2は0~5の整数であり、n1+n2=nである。n1は、1以上であることが好ましく、3以上であることがより好ましく、4以上であることがさらに好ましい。 In formulas (1A) and (2A), the polyoxyethylene units may be the same or different. The structure of the polyoxyethylene unit may be a block structure or a random structure. R 1 to R 4 represent a hydrogen atom, an alkyl group, or an alkenyl group, and may be the same or different. Further, n1 is an integer from 0 to 5, n2 is an integer from 0 to 5, and n1+n2=n. n1 is preferably 1 or more, more preferably 3 or more, and even more preferably 4 or more.
本発明のペースト加工用塩化ビニル系樹脂組成物においては、リン酸型アニオン系界面活性剤が、塩化ビニル系原料樹脂100質量部に対して0.01~2.0質量部含有されていることが好ましく、0.02~1.5質量部含有されていることがより好ましい。この範囲で配合することにより、プラスチゾルに配合した際、本発明の効果を十分に享受することができる。 In the vinyl chloride resin composition for paste processing of the present invention, the phosphoric acid type anionic surfactant is contained in an amount of 0.01 to 2.0 parts by mass based on 100 parts by mass of the vinyl chloride raw material resin. is preferably contained, and more preferably 0.02 to 1.5 parts by mass. By blending within this range, the effects of the present invention can be fully enjoyed when blended into plastisol.
本発明のペースト加工用塩化ビニル系樹脂組成物の製造方法としては、塩化ビニル系原料樹脂及びリン酸型アニオン系界面活性剤を混合して混合粉体とする方法や、塩化ビニル系原料樹脂及びリン酸型アニオン系界面活性剤を造粒して顆粒とする方法を挙げることができる。顆粒の製造方法は、具体的には、後述するペースト加工用プラスチゾルの製造方法における第一工程と同様である。 The method for producing the vinyl chloride resin composition for paste processing of the present invention includes a method of mixing a vinyl chloride raw material resin and a phosphoric acid type anionic surfactant to form a mixed powder, and a method of preparing a mixed powder by mixing a vinyl chloride raw material resin and A method of granulating a phosphate type anionic surfactant into granules can be mentioned. The method for producing the granules is specifically the same as the first step in the method for producing plastisol for paste processing, which will be described later.
[ペースト加工用プラスチゾル]
本発明のペースト加工用プラスチゾルは、ペースト加工用塩化ビニル系原料樹脂と、ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤(ただし、ポリオキシエチレン単位の繰り返し数が1~5である。)と、塩化ビニル系ブレンド樹脂と、可塑剤とを含有する。
[Plastisol for paste processing]
The plastisol for paste processing of the present invention consists of a vinyl chloride-based raw material resin for paste processing, a polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant (provided that the number of repeating polyoxyethylene units is 1 to 5 ), a vinyl chloride blend resin, and a plasticizer.
本発明のペースト加工用プラスチゾルは、粘度が低く、塩化ビニル系ブレンド樹脂に由来した沈降物の発生が抑制される。また、塩化ビニル系原料樹脂の可塑剤への分散性が良好である。 The plastisol for paste processing of the present invention has a low viscosity, and the generation of sediment derived from the vinyl chloride blend resin is suppressed. Moreover, the dispersibility of the vinyl chloride-based raw material resin in the plasticizer is good.
ペースト加工用塩化ビニル系原料樹脂、及びポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤については、上記本発明のペースト加工用塩化ビニル系樹脂組成物で説明したものと同様である。 The vinyl chloride resin for paste processing and the polyoxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant are the same as those explained for the vinyl chloride resin composition for paste processing of the present invention. be.
(ぺースト加工用塩化ビニル系ブレンド樹脂)
本発明におけるぺースト加工用塩化ビニル系ブレンド樹脂としては、塩化ビニル系原料樹脂と同様、塩化ビニルのホモポリマーの他、塩化ビニルを主体とするコポリマーであってもよい。
(Vinyl chloride blend resin for paste processing)
As with the vinyl chloride raw material resin, the vinyl chloride blend resin for paste processing in the present invention may be a homopolymer of vinyl chloride or a copolymer mainly composed of vinyl chloride.
塩化ビニル系ブレンド樹脂は、塩化ビニル系原料樹脂よりも粒子径が大きく、通常、一次粒子の平均粒子径が5.0~50.0μmの粒子であり、20.0~40.0μmの粒子であることが好ましい。一次粒子の平均粒子径の測定方法は、塩化ビニル系原料樹脂の場合と同様である。 The vinyl chloride blend resin has a larger particle size than the vinyl chloride raw material resin, and usually has an average primary particle size of 5.0 to 50.0 μm, and 20.0 to 40.0 μm. It is preferable that there be. The method for measuring the average particle diameter of the primary particles is the same as in the case of vinyl chloride-based raw material resin.
塩化ビニル系ブレンド樹脂の配合量は、用途等に応じて適宜選択すればよいが、例えば、塩化ビニル原料樹脂100質量部当たり、25~100質量部である。 The blending amount of the vinyl chloride blend resin may be appropriately selected depending on the use and the like, and is, for example, 25 to 100 parts by mass per 100 parts by mass of the vinyl chloride raw material resin.
(可塑剤)
本発明のペースト加工用プラスチゾルにおいては、従来塩化ビニル樹脂プラスチゾルの可塑剤として公知のものを使用することができる。
(Plasticizer)
In the paste-processing plastisol of the present invention, conventionally known plasticizers for vinyl chloride resin plastisols can be used.
本発明においては、例えば、ジブチルフタレート、ジ-(2-エチルヘキシル)フタレート、ジ-n-オクチルフタレート、ジイソブチルフタレート、ジヘプチルフタレート、ジフェニルフタレート、ジイソデシルフタレート、ジウンデシルフタレート、ブチルベンジルフタレート、ジノニルフタレート、ジシクロヘキシルフタレートなどのフタル酸誘導体;ジ-(2-エチルヘキシル)イソフタレート、ジイソオクチルイソフタレートなどのイソフタル酸誘導体;ジ-(2-エチルヘキシル)テトラヒドロフタレート、ジ-n-オクチルテトラヒドロフタレート、ジイソデシルテトラヒドロフタレートなどのテトラヒドロフタル酸誘導体;ジ-n-ブチルアジペート、ジ-(2-エチルヘキシル)アジペート、ジイソデシルアジペート、ジイソノニルアジペートなどのアジピン酸誘導体;ジ-(2-エチルヘキシル)アゼレート、ジイソオクチルアゼレート、ジ-n-ヘキシルアゼレートなどのアゼライン酸誘導体;ジ-n-ブチルセバケート、ジ-(2-エチルヘキシル)セバケートなどのセバシン酸誘導体;ジ-n-ブチルマレエート、ジメチルマレエート、ジエチルマレエート、ジ-(2-エチルヘキシル)マレエートなどのマレイン酸誘導体;ジ-n-ブチルフマレート、ジ-(2-エチルヘキシル)フマレートなどのフマル酸誘導体;トリ-(2-エチルヘキシル)トリメリテート、トリ-n-オクチルトリメリテート、トリイソデシルトリメリテート、トリイソオクチルトリメリテート、トリ-n-ヘキシルトリメリテート、トリイソノニルトリメリテートなどのトリメリット酸誘導体;テトラ-(2-エチルヘキシル)ピロメリテート、テトラ-n-オクチルピロメリテートなどのピロメリット酸誘導体;トリエチルシトレート、トリ-n-ブチルシトレート、アセチルトリエチルシトレート、アセチルトリ-(2-エチルヘキシル)シトレートなどのクエン酸誘導体;モノメチルイタコネート、モノブチルイタコネート、ジメチルイタコネート、ジエチルイタコネート、ジブチルイタコネート、ジ-(2-エチルヘキシル)イタコネートなどのイタコン酸誘導体;ブチルオレエート、グリセリルモノオレエート、ジエチレングリコールモノオレエートなどのオレイン酸誘導体;グリセリルモノリシノレート、ジエチレングリコールモノリシノレートなどのリシノール酸誘導体;グリセリンモノステアレート、ジエチレングリコールジステアレートなどのステアリン酸誘導体;ジエチレングリコールモノラウレート、ジエチレングリコールジペラルゴネート、ペンタエリスリトール脂肪酸エステルなどのその他の脂肪酸誘導体;トリエチルホスフェート、トリブチルホスフェート、トリ-(2-エチルヘキシル)ホスフェート、トリフェニルホスフェート、クレジルジフェニルホスフェート、トリクレジルホスフェート、トリス(クロロエチル)ホスフェートなどのリン酸誘導体;ジエチレングリコールジベンゾエート、ジプロピレングリコールジベンゾエート、トリエチレングリコールジベンゾエート、ジブチルメチレンビスチオグリコレートなどのグリコール誘導体;グリセロールモノアセテート、グリセロールトリアセテート、グリセロールトリブチレートなどのグリセリン誘導体;アジピン酸系ポリエステル、セバシン酸系ポリエステル、フタル酸系ポリエステルなどのポリエステル系可塑剤;あるいは部分水添ターフェニル、接着性可塑剤;さらにはジアリルフタレート、アクリル系モノマーやオリゴマーなどの重合性可塑剤などを用いることができる。 In the present invention, for example, dibutyl phthalate, di-(2-ethylhexyl) phthalate, di-n-octyl phthalate, diisobutyl phthalate, diheptyl phthalate, diphenyl phthalate, diisodecyl phthalate, diundecyl phthalate, butylbenzyl phthalate, dinonyl phthalate , phthalic acid derivatives such as dicyclohexyl phthalate; isophthalic acid derivatives such as di-(2-ethylhexyl) isophthalate, diisooctyl isophthalate; di-(2-ethylhexyl)tetrahydrophthalate, di-n-octyltetrahydrophthalate, diisodecyltetrahydro Tetrahydrophthalic acid derivatives such as phthalate; adipic acid derivatives such as di-n-butyl adipate, di-(2-ethylhexyl) adipate, diisodecyl adipate, diisononyl adipate; di-(2-ethylhexyl) azelate, diisooctyl azelate, Azelaic acid derivatives such as di-n-hexyl azelate; sebacic acid derivatives such as di-n-butyl sebacate, di-(2-ethylhexyl) sebacate; di-n-butyl maleate, dimethyl maleate, diethyl maleate, di- - Maleic acid derivatives such as (2-ethylhexyl) maleate; fumaric acid derivatives such as di-n-butyl fumarate, di-(2-ethylhexyl) fumarate; tri-(2-ethylhexyl) trimellitate, tri-n-octyltri Trimellitic acid derivatives such as mellitate, triisodecyl trimellitate, triisooctyl trimellitate, tri-n-hexyl trimellitate, triisononyl trimellitate; tetra-(2-ethylhexyl)pyromellitate, tetra- Pyromellitic acid derivatives such as n-octylpyromellitate; citric acid derivatives such as triethyl citrate, tri-n-butyl citrate, acetyl triethyl citrate, acetyl tri-(2-ethylhexyl) citrate; monomethyl itaconate, mono Itaconic acid derivatives such as butyl itaconate, dimethyl itaconate, diethyl itaconate, dibutyl itaconate, di-(2-ethylhexyl) itaconate; oleic acid derivatives such as butyl oleate, glyceryl monooleate, diethylene glycol monooleate; glyceryl Ricinoleic acid derivatives such as monoricinoleate, diethylene glycol monoricinolate; stearic acid derivatives such as glycerin monostearate, diethylene glycol distearate; other fatty acid derivatives such as diethylene glycol monolaurate, diethylene glycol dipelargonate, pentaerythritol fatty acid ester; Phosphoric acid derivatives such as triethyl phosphate, tributyl phosphate, tri-(2-ethylhexyl) phosphate, triphenyl phosphate, cresyl diphenyl phosphate, tricresyl phosphate, tris(chloroethyl) phosphate; diethylene glycol dibenzoate, dipropylene glycol dibenzoate, Glycol derivatives such as triethylene glycol dibenzoate and dibutyl methylene bisthioglycolate; Glycerin derivatives such as glycerol monoacetate, glycerol triacetate, and glycerol tributyrate; Polyesters such as adipic acid polyester, sebacic acid polyester, and phthalic acid polyester Polymerizable plasticizers such as partially hydrogenated terphenyl, adhesive plasticizers, diallyl phthalate, and acrylic monomers and oligomers can also be used.
可塑剤は、これらの中でもフタル酸エステル系のものが好適である。なお、これらの可塑剤は1種単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
可塑剤の配合量は、用途等に応じて適宜選択すればよいが、例えば、塩化ビニル原料樹脂100質量部当たり、40~250質量部である。
Among these, phthalate-based plasticizers are preferred. Note that these plasticizers may be used alone or in combination of two or more.
The amount of plasticizer to be blended may be appropriately selected depending on the intended use, and is, for example, 40 to 250 parts by mass per 100 parts by mass of the vinyl chloride raw material resin.
(その他の成分)
本発明のペースト加工用プラスチゾルにおいては、その他の各種成分を配合してもよい。例えば、熱安定剤、充填剤、発泡剤、発泡促進剤、粘度調節剤、接着性付与剤、着色剤、希釈剤、紫外線吸収剤、酸化防止剤、補強剤を挙げることができる。
(Other ingredients)
The plastisol for paste processing of the present invention may contain various other components. Examples include heat stabilizers, fillers, foaming agents, foaming accelerators, viscosity modifiers, adhesion agents, colorants, diluents, ultraviolet absorbers, antioxidants, and reinforcing agents.
本発明のペースト加工用プラスチゾルは、塩化ビニル系ブレンド樹脂を配合した低粘度ゾルであり、粘度は、例えば、1500~3200mPa・sであり、1500~3000Pa・sが好ましく、1500~2500Pa・sがより好ましい。この粘度は、実施例で示した測定方法により測定されたものをいう。 The plastisol for paste processing of the present invention is a low-viscosity sol containing a vinyl chloride blend resin, and the viscosity is, for example, 1500 to 3200 mPa·s, preferably 1500 to 3000 Pa·s, and 1500 to 2500 Pa·s. More preferred. This viscosity is measured by the measuring method shown in the examples.
本発明のペースト加工用プラスチゾルは低粘度ゾルであるため、塗料、コーティング剤等の低粘度品用途として有用である。 Since the plastisol for paste processing of the present invention is a low viscosity sol, it is useful for low viscosity products such as paints and coating agents.
[ペースト加工用プラスチゾルの製造方法]
本発明のペースト加工用プラスチゾルの製造方法は、ペースト加工用塩化ビニル系原料樹脂と、ペースト加工用塩化ビニル系ブレンド樹脂と、可塑剤とを含有するペースト加工用プラスチゾルの製造方法であって、ポリオキシエチレンアルキルエーテルリン酸・リン酸塩型アニオン系界面活性剤(ただし、ポリオキシエチレン単位の繰り返し数が1~5である。)を配合する。
各成分については、上記本発明のペースト加工用プラスチゾルで説明したものと同様である。
[Method for manufacturing plastisol for paste processing]
The method for producing a plastisol for paste processing of the present invention is a method for producing a plastisol for paste processing, which contains a vinyl chloride-based raw material resin for paste processing, a vinyl chloride blend resin for paste processing, and a plasticizer. An oxyethylene alkyl ether phosphoric acid/phosphate type anionic surfactant (provided that the number of repeating polyoxyethylene units is 1 to 5) is blended.
Each component is the same as that described for the plastisol for paste processing of the present invention.
リン酸型アニオン系界面活性剤は、プラスチゾルの製造のどの段階で配合してもよく、例えば、予め塩化ビニル系原料樹脂に配合しておいてもよく、塩化ビニル系ブレンド樹脂に配合しておいてもよく、また、塩化ビニル系原料樹脂、塩化ビニル系ブレンド樹脂、可塑剤の混合と同時に配合してもよい。これらの中でも、予め塩化ビニル系原料樹脂に配合しておく方法が好ましい。 The phosphoric acid type anionic surfactant may be blended at any stage in the production of plastisol, for example, it may be blended in advance with the vinyl chloride raw material resin, or it may be blended with the vinyl chloride blend resin. Alternatively, it may be blended at the same time as the vinyl chloride raw material resin, vinyl chloride blend resin, and plasticizer. Among these, a method of blending the resin into the vinyl chloride raw material resin in advance is preferred.
具体的に、リン酸型アニオン系界面活性剤を予め塩化ビニル系原料樹脂に配合しておく方法としては、ペースト加工用塩化ビニル系原料樹脂の水性分散液に、リン酸型アニオン系界面活性剤を配合し、乾燥して、ペースト加工用塩化ビニル系樹脂顆粒を調製する第1工程と、かかるペースト加工用塩化ビニル系樹脂顆粒と、ペースト加工用塩化ビニル系ブレンド樹脂粒子と、可塑剤とを混合して、ゾルを調製する第2工程とを有する方法を挙げることができる。 Specifically, as a method of pre-blending a phosphoric acid type anionic surfactant into a vinyl chloride raw material resin, the phosphoric acid type anionic surfactant is added to an aqueous dispersion of a vinyl chloride raw material resin for paste processing. A first step of blending and drying to prepare vinyl chloride resin granules for paste processing, such vinyl chloride resin granules for paste processing, vinyl chloride blend resin particles for paste processing, and a plasticizer. A second step of mixing to prepare a sol can be mentioned.
ここで、水性分散液とは、水を主体とする分散媒を用いた分散液をいう。水を主体とする分散媒とは、例えば、水が分散媒全体の50質量%以上のものをいい、70質量%以上のものが好ましく、90%以上のものがより好ましい。
また、水性分散液中の塩化ビニル系原料樹脂の含有量としては、分散液全体の30~70質量%であることが好ましく、35~65質量%であることがより好ましく、40~60質量%であることがさらに好ましい。
Here, the aqueous dispersion refers to a dispersion using a dispersion medium mainly composed of water. A dispersion medium mainly composed of water refers to one in which water accounts for 50% by mass or more of the entire dispersion medium, preferably 70% by mass or more, and more preferably 90% or more.
The content of the vinyl chloride raw material resin in the aqueous dispersion is preferably 30 to 70% by mass, more preferably 35 to 65% by mass, and 40 to 60% by mass of the entire dispersion. It is more preferable that
また、第1工程におけるリン酸型アニオン系界面活性剤が配合されたペースト加工用塩化ビニル系原料樹脂の水性分散液の乾燥は、通常、噴霧乾燥により行われる。噴霧乾燥機としては、本件技術分野で用いられている公知の噴霧乾燥機を用いることができ、噴霧形式としても、回転円盤型、二流体ノズル型、加圧ノズル型いずれの形式であってもよい。この噴霧乾燥により、通常、20~150μm程度の平均粒子径の顆粒が得られる。 Further, in the first step, the aqueous dispersion of the vinyl chloride raw material resin for paste processing containing the phosphate-type anionic surfactant is usually dried by spray drying. As the spray dryer, any known spray dryer used in the technical field may be used, and the spray type may be a rotating disk type, a two-fluid nozzle type, or a pressure nozzle type. good. This spray drying usually yields granules with an average particle size of about 20 to 150 μm.
また、第1工程においては、リン酸型アニオン系界面活性剤を、塩化ビニル系原料樹脂100質量部に対して0.01~2.0質量部配合することが好ましく、0.02~1.5質量部配合することがより好ましい。この範囲で配合することにより、所望の顆粒を容易に製造できると共に、第1工程で得られた顆粒をプラスチゾルに配合した際、本発明の効果を十分に享受することができる。 Further, in the first step, it is preferable to mix 0.01 to 2.0 parts by mass of the phosphoric acid type anionic surfactant to 100 parts by mass of the vinyl chloride raw material resin, and preferably 0.02 to 1.0 parts by mass. It is more preferable to mix 5 parts by mass. By blending within this range, desired granules can be easily produced, and the effects of the present invention can be fully enjoyed when the granules obtained in the first step are blended into plastisol.
以下、実施例および比較例を挙げて本発明を更に詳細に説明するが、本発明はこれらの実施例に限定されるものではない。 Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.
[実施例1]
ステンレス製の撹拌機及びジャケット付耐圧反応機に、脱イオン水100部、ドデシルベンゼンスルホン酸ナトリウム0.7部、ラウリルアルコール/ミリスチルアルコール混合物1.0部、ジ-(2-エチルヘキシル)パーオキシジカーボネート0.05部を仕込み、減圧脱気した後、塩化ビニル単量体100部を仕込み、混合撹拌した。この混合物をホモジナイザーで均質化した後、別の脱気された耐圧反応器に移し、47℃に昇温して重合、重合転化率が85%に達した後、未反応単量体を除去し、一次粒子の平均粒子径が1.0μm、固形分濃度43重量%の塩化ビニル系原料樹脂の水性分散液(塩化ビニル重合体水性分散液)を得た。この塩化ビニル重合体水性分散液に分散する塩化ビニル系原料樹脂の一次粒子径は、光透過式-遠心沈降粒度分布測定器により測定して1.0μmであった。
[Example 1]
In a pressure-resistant reactor with a stainless steel stirrer and jacket, 100 parts of deionized water, 0.7 parts of sodium dodecylbenzenesulfonate, 1.0 parts of lauryl alcohol/myristyl alcohol mixture, and di-(2-ethylhexyl) peroxydi After charging 0.05 parts of carbonate and degassing under reduced pressure, 100 parts of vinyl chloride monomer was charged and mixed and stirred. After homogenizing this mixture with a homogenizer, it was transferred to another degassed pressure reactor, and the temperature was raised to 47°C to polymerize. After the polymerization conversion rate reached 85%, unreacted monomers were removed. An aqueous dispersion of vinyl chloride-based raw material resin (vinyl chloride polymer aqueous dispersion) having an average primary particle diameter of 1.0 μm and a solid content concentration of 43% by weight was obtained. The primary particle diameter of the vinyl chloride raw material resin dispersed in this vinyl chloride polymer aqueous dispersion was 1.0 μm as measured by a light transmission centrifugal sedimentation particle size distribution analyzer.
上記塩化ビニル重合体水性分散液に、ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)水溶液を0.3phr(塩化ビニル重合体100質量部に対してポリオキシエチレンラウリルエーテルリン酸が0.3質量部)添加して十分に撹拌分散させた後、スプレードライヤーで入口温度150℃、出口温度55℃、アトマイザー回転数19000rpmでスプレー乾燥することによりペースト加工用塩化ビニル樹脂顆粒を得た。このペースト加工用塩化ビニル樹脂顆粒のレーザー回折/散乱式粒子径分布測定装置で測定した平均粒子径は70μmであった。 Add 0.3 phr of an aqueous solution of polyoxyethylene lauryl ether phosphoric acid (polyoxyethylene unit number: 2) to the above vinyl chloride polymer aqueous dispersion (polyoxyethylene lauryl ether phosphoric acid: 0% per 100 parts by mass of vinyl chloride polymer) .3 parts by mass) was added and sufficiently stirred and dispersed, and then spray-dried with a spray dryer at an inlet temperature of 150°C, an outlet temperature of 55°C, and an atomizer rotation speed of 19,000 rpm to obtain vinyl chloride resin granules for paste processing. The average particle diameter of the vinyl chloride resin granules for paste processing was 70 μm as measured using a laser diffraction/scattering particle diameter distribution analyzer.
[実施例2]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)の添加量を0.03phrに変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[実施例3]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)の添加量を1.2phrに変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[Example 2]
Vinyl chloride resin granules for paste processing were obtained in the same manner as in Example 1, except that the amount of polyoxyethylene lauryl ether phosphoric acid (polyoxyethylene unit number: 2) was changed to 0.03 phr.
[Example 3]
Vinyl chloride resin granules for paste processing were obtained in the same manner as in Example 1, except that the amount of polyoxyethylene lauryl ether phosphoric acid (polyoxyethylene unit number: 2) was changed to 1.2 phr.
[実施例4]
実施例1で得られたペースト加工用塩化ビニル樹脂顆粒を微粉砕機(株式会社ダルトン製AIIW)で破砕し、レーザー回折/散乱式粒子径分布測定装置で測定した平均粒子径が2.0μmペースト加工用塩化ビニル樹脂粉末を得た。
[実施例5]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を、ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数1)に変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[Example 4]
The vinyl chloride resin granules for paste processing obtained in Example 1 were crushed using a pulverizer (AIIW manufactured by Dalton Co., Ltd.) to obtain a paste with an average particle size of 2.0 μm as measured by a laser diffraction/scattering particle size distribution analyzer. A vinyl chloride resin powder for processing was obtained.
[Example 5]
A vinyl chloride resin for paste processing was prepared in the same manner as in Example 1, except that polyoxyethylene lauryl ether phosphoric acid (number of polyoxyethylene units: 2) was changed to polyoxyethylene lauryl ether phosphoric acid (number of polyoxyethylene units: 1). Granules were obtained.
[実施例6]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を、ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数4)に変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[実施例7]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を、ポリオキシエチレンラウリルエーテルリン酸ナトリウム(ポリオキシエチレン単位数2)に変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[Example 6]
A vinyl chloride resin for paste processing was prepared in the same manner as in Example 1, except that polyoxyethylene lauryl ether phosphoric acid (number of polyoxyethylene units: 2) was changed to polyoxyethylene lauryl ether phosphoric acid (number of polyoxyethylene units: 4). Granules were obtained.
[Example 7]
Vinyl chloride for paste processing was prepared in the same manner as in Example 1, except that polyoxyethylene lauryl ether phosphoric acid (number of polyoxyethylene units: 2) was changed to sodium polyoxyethylene lauryl ether phosphate (number of polyoxyethylene units: 2). Resin granules were obtained.
[実施例8]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を、ポリオキシプロピレンラウリルエーテルリン酸リン酸(ポリオキシエチレン単位数2)に変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[Example 8]
A chloride for paste processing was prepared in the same manner as in Example 1 except that polyoxyethylene lauryl ether phosphoric acid (polyoxyethylene unit number 2) was changed to polyoxypropylene lauryl ether phosphoric acid phosphoric acid (polyoxyethylene unit number 2). Vinyl resin granules were obtained.
[比較例1]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を添加しない他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[比較例2]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を、ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数7)に変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[Comparative example 1]
Vinyl chloride resin granules for paste processing were obtained in the same manner as in Example 1, except that polyoxyethylene lauryl ether phosphoric acid (polyoxyethylene unit number: 2) was not added.
[Comparative example 2]
A vinyl chloride resin for paste processing was prepared in the same manner as in Example 1, except that polyoxyethylene lauryl ether phosphoric acid (number of polyoxyethylene units: 2) was changed to polyoxyethylene lauryl ether phosphoric acid (number of polyoxyethylene units: 7). Granules were obtained.
[比較例3]
比較例2で得られたペースト加工用塩化ビニル樹脂顆粒を微粉砕機(株式会社ダルトン製AIIW)で破砕し、ペースト加工用塩化ビニル樹脂粉末を得た。
[比較例4]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を、ポリオキシエチレンラウリルエーテル(ポリオキシエチレン単位数7)に変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[Comparative example 3]
The vinyl chloride resin granules for paste processing obtained in Comparative Example 2 were crushed using a pulverizer (AIIW manufactured by Dalton Co., Ltd.) to obtain vinyl chloride resin powder for paste processing.
[Comparative example 4]
PVC resin granules for paste processing were prepared in the same manner as in Example 1, except that polyoxyethylene lauryl ether phosphoric acid (number of polyoxyethylene units: 2) was changed to polyoxyethylene lauryl ether (number of polyoxyethylene units: 7). Obtained.
[比較例5]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を、ポリエチレングリコール(平均分子量:約20000)に変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[比較例6]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を、ポリエチレングリコール(平均分子量:約300)に変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[Comparative example 5]
Vinyl chloride resin granules for paste processing were obtained in the same manner as in Example 1, except that polyoxyethylene lauryl ether phosphoric acid (polyoxyethylene unit number: 2) was changed to polyethylene glycol (average molecular weight: about 20,000).
[Comparative Example 6]
Vinyl chloride resin granules for paste processing were obtained in the same manner as in Example 1, except that polyoxyethylene lauryl ether phosphoric acid (polyoxyethylene unit number: 2) was changed to polyethylene glycol (average molecular weight: about 300).
[比較例7]
ポリオキシエチレンラウリルエーテルリン酸(ポリオキシエチレン単位数2)を、ポリビニルアルコールに変更した他は実施例1と同様にしてペースト加工用塩化ビニル樹脂顆粒を得た。
[Comparative Example 7]
Vinyl chloride resin granules for paste processing were obtained in the same manner as in Example 1, except that polyoxyethylene lauryl ether phosphoric acid (polyoxyethylene unit number: 2) was changed to polyvinyl alcohol.
上記実施例1~8及び比較例1~7のペースト加工用塩化ビニル樹脂組成物(顆粒、粉末)について、(1)ペースト粘度、(2)プラスチゾルの沈降性、(3)見掛け密度、及び(4)可塑剤への分散性を以下の方法で評価した。 Regarding the vinyl chloride resin compositions (granules, powder) for paste processing of Examples 1 to 8 and Comparative Examples 1 to 7 above, (1) paste viscosity, (2) plastisol sedimentation property, (3) apparent density, and ( 4) Dispersibility in plasticizer was evaluated by the following method.
(1)ペースト粘度
500mlのプラスチックカップに、ペースト加工用塩化ビニル樹脂組成物(顆粒、粉末)50重量部、塩化ビニルブレンド樹脂〔新第一塩ビ(株)製PBZXA 一次粒子の平均粒子径35μm〕50重量部、可塑剤としてのジ-(2-エチルヘキシル)フタレート((株)ジェイ・プラス製DOP)50重量部、液状バリウム-亜鉛系熱安定剤2重量部を加え、プロペラ撹拌翼をとりつけたメカニカル制御撹拌機で10分間混練後、真空脱泡機に5分間かけてプラスチゾルを得た。気温23℃、湿度50%RHの雰囲気下で1時間静置後、プラスチゾルをよく掻き混ぜ、ブルックフィールド粘度計(英弘精機(株)製LVDV-3T)ローターNo.4、6rpmの粘度を測定した。
(1) Paste viscosity In a 500 ml plastic cup, 50 parts by weight of vinyl chloride resin composition for paste processing (granules, powder), vinyl chloride blend resin [PBZXA manufactured by Shin Daiichi PVC Co., Ltd. Average particle diameter of primary particles 35 μm] 50 parts by weight of di-(2-ethylhexyl) phthalate (DOP manufactured by J-Plus Co., Ltd.) as a plasticizer, and 2 parts by weight of a liquid barium-zinc heat stabilizer were added, and a propeller stirring blade was attached. After kneading with a mechanically controlled stirrer for 10 minutes, plastisol was obtained by kneading with a vacuum deaerator for 5 minutes. After standing for 1 hour in an atmosphere with a temperature of 23°C and a humidity of 50% RH, the plastisol was thoroughly stirred and tested using a Brookfield viscometer (LVDV-3T manufactured by Hideko Seiki Co., Ltd.) rotor No. The viscosity was measured at 4 and 6 rpm.
(2)プラスチゾルの沈降性
上記(1)と同様に調製したプラスチゾルを容量150mlのプラスチック容器に200g計量し、温度23℃、湿度50%RHの条件下で7日間静置後、容器を逆さにして5分間プラスチゾルを排出し、容器内残留物の質量測定と堆積物の有無の確認を行った。プラスチゾルの沈降割合は、下記の式より求めた。
(2) Sedimentation property of plastisol Weighed 200 g of plastisol prepared in the same manner as in (1) above into a 150 ml plastic container, left it for 7 days at a temperature of 23°C and a humidity of 50% RH, and then turned the container upside down. The plastisol was discharged for 5 minutes, and the mass of the residue in the container was measured and the presence or absence of deposits was confirmed. The sedimentation rate of plastisol was determined using the following formula.
ゾル沈降割合(%)=(容器内残留プラスチゾル質量÷200×100) Sol sedimentation rate (%) = (mass of plastisol remaining in container ÷ 200 x 100)
(3)見掛け密度
得られたペースト加工用塩化ビニル樹脂組成物を、JISカサ比重測定器(筒井理化学器械(株))を使用し、JIS K7365の方法に従って測定し、見掛け密度を求めた。
(3) Apparent Density The obtained vinyl chloride resin composition for paste processing was measured using a JIS Kasa specific gravity meter (Tsutsui Rikagaku Kikai Co., Ltd.) according to the method of JIS K7365 to determine the apparent density.
(4)可塑剤への分散性
得られたペースト加工用塩化ビニル樹脂組成物を、製造から3カ月後に、可塑剤としてのアジピン酸ビス(2-エチルヘキシル)に分散させ、レーザー回折/散乱式粒子径分布測定装置((株)堀場製作所製LA-960)に投入して5分間超音波をかけ、粒度分布を測定して10μm以下の粒子の割合を求めた。
(4) Dispersibility in plasticizer Three months after production, the obtained vinyl chloride resin composition for paste processing was dispersed in bis(2-ethylhexyl) adipate as a plasticizer, and laser diffraction/scattering particles were dispersed in bis(2-ethylhexyl) adipate as a plasticizer. The sample was placed in a size distribution measuring device (LA-960 manufactured by Horiba, Ltd.) and subjected to ultrasonic waves for 5 minutes to measure the particle size distribution and determine the proportion of particles with a diameter of 10 μm or less.
結果を表1に示す。 The results are shown in Table 1.
実施例1~3及び5~8のペースト加工用塩化ビニル樹脂顆粒は、ペースト粘度が十分に低粘度で、7日間静置後のプラスチゾルに、塩化ビニルブレンド樹脂に由来する堆積物は見られなかった。また、樹脂顆粒は、見掛け密度が高く、3カ月経過後も高い分散性を維持していた。 The paste viscosity of the vinyl chloride resin granules for paste processing of Examples 1 to 3 and 5 to 8 was sufficiently low, and no deposits derived from the vinyl chloride blend resin were observed in the plastisol after standing for 7 days. Ta. Furthermore, the resin granules had a high apparent density and maintained high dispersibility even after 3 months.
なお、実施例1~3に示すように、ペースト粘度は、リン酸型アニオン系界面活性剤の添加量が多いほど低粘度であるが、添加量が少ない場合でも十分な減粘効果を示した。また、見かけ密度は、リン酸型アニオン系界面活性剤の添加量が多いほど高密度であり、添加量が少ない場合でも比較的高い見掛け密度を示した。
また、樹脂顆粒(実施例3)は、樹脂粉末(実施例4)に比して、高い見掛け密度を示した。
In addition, as shown in Examples 1 to 3, the paste viscosity was lower as the amount of phosphoric acid type anionic surfactant added was large, but even when the amount added was small, sufficient viscosity reducing effect was exhibited. . Further, the apparent density was higher as the amount of the phosphate anionic surfactant added was higher, and even when the amount added was smaller, the apparent density was relatively high.
Furthermore, the resin granules (Example 3) exhibited higher apparent density than the resin powder (Example 4).
実施例4のペースト加工用塩化ビニル樹脂粉末は、上記のように、見掛け密度で劣るものの、ペースト粘度、7日間静置後のプラスチゾルの沈降性、及び3カ月経過後の分散性において、粉砕前の樹脂顆粒(実施例3)と同等の物性であった。 As mentioned above, although the vinyl chloride resin powder for paste processing of Example 4 was inferior in apparent density, it was superior in paste viscosity, plastisol sedimentation after 7 days of standing, and dispersibility after 3 months, compared to before pulverization. The physical properties were equivalent to those of the resin granules (Example 3).
これに対して、本発明のリン酸型アニオン系界面活性剤を添加しない比較例1においては、ペースト粘度が高く、また、見掛け密度は低かった。
また、リン酸型アニオン系界面活性剤(ポリオキシエチレン単位数7)を用いた比較例2では、7日間静置後のプラスチゾルで堆積物が確認された。したがって、実施例1、5及び6の結果を合わせて考慮すると、ポリオキシエチレン単位数は、1~5程度が好ましいと考えられる。
比較例2の樹脂顆粒を粉砕した比較例3では、比較例2と同様、7日間静置後のプラスチゾルで堆積物が確認された。また、見掛け密度は、比較例2よりも低密度となった。
On the other hand, in Comparative Example 1 in which the phosphoric acid type anionic surfactant of the present invention was not added, the paste viscosity was high and the apparent density was low.
Furthermore, in Comparative Example 2 using a phosphoric acid type anionic surfactant (7 polyoxyethylene units), deposits were observed in the plastisol after standing for 7 days. Therefore, considering the results of Examples 1, 5, and 6 together, it is considered that the number of polyoxyethylene units is preferably about 1 to 5.
In Comparative Example 3, in which the resin granules of Comparative Example 2 were crushed, deposits were observed in the plastisol after being left standing for 7 days, as in Comparative Example 2. Moreover, the apparent density was lower than that of Comparative Example 2.
リン酸型ではないノニオン系界面活性剤(ポリオキシエチレン単位数7)を用いた比較例4では、ペースト粘度は低粘度であったが、7日間静置後のプラスチゾルで堆積物が確認された。
水溶性ポリマーを用いた比較例5~7では、ペースト粘度はいずれも著しい増粘が見られた。また、3カ月経過後の樹脂顆粒の分散性はいずれも低下した。
In Comparative Example 4 using a nonionic surfactant (polyoxyethylene unit number: 7) that is not a phosphoric acid type, the paste viscosity was low, but deposits were observed in the plastisol after standing for 7 days. .
In Comparative Examples 5 to 7 using water-soluble polymers, a significant increase in paste viscosity was observed in all cases. Further, the dispersibility of the resin granules after 3 months had decreased in all cases.
本発明のペースト加工用塩化ビニル系樹脂組成物及びペースト加工用プラスチゾルは、塩化ビニル樹脂のペースト加工に用いることができることから、産業上有用である。
The vinyl chloride resin composition for paste processing and the plastisol for paste processing of the present invention are industrially useful because they can be used for paste processing of vinyl chloride resin.
Claims (4)
前記リン酸型アニオン系界面活性剤が、下記式(1A)で表される化合物であることを特徴とするペースト加工用プラスチゾル。
A plastisol for paste processing, wherein the phosphoric acid type anionic surfactant is a compound represented by the following formula (1A).
下記式(1A)で表される化合物であるリン酸型アニオン系界面活性剤を配合することを特徴とするペースト加工用プラスチゾルの製造方法。
A method for producing plastisol for paste processing, which comprises blending a phosphate-type anionic surfactant that is a compound represented by the following formula (1A).
前記ペースト加工用塩化ビニル系樹脂顆粒と、ペースト加工用塩化ビニル系ブレンド樹脂粒子と、可塑剤とを混合して、ゾルを調製する第2工程と、
を有することを特徴とする請求項2記載のペースト加工用プラスチゾルの製造方法。 A first step of blending a phosphoric acid type anionic surfactant into an aqueous dispersion of fine particles of vinyl chloride raw material resin for paste processing, and drying the mixture to prepare vinyl chloride resin granules for paste processing;
a second step of preparing a sol by mixing the vinyl chloride resin granules for paste processing, the vinyl chloride blend resin particles for paste processing, and a plasticizer;
3. The method for producing plastisol for paste processing according to claim 2 , comprising:
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