JP7443183B2 - Pick-up device and method - Google Patents

Description

In the manufacturing process of semiconductor devices, it is necessary to pick up diced semiconductor chips (hereinafter simply referred to as chips) from an adhesive sheet. Some conventional pickup devices include a stage that holds an adhesive sheet, a push-up table that moves forward and backward with respect to the stage, and a needle that is pushed up by the push-up table. That is, the needle pushed up by the push-up table hits the adhesive sheet body of the stage from the back side, and the chip is separated from the adhesive sheet body.

However, in pick-up devices that use needles, when the needle breaks through the adhesive sheet and pushes the tip up to peel it off from the adhesive sheet, the tip of the needle may become worn, damaged, or bent. . In such a case, there is a risk that the broken needle may damage the back surface of the chip when pushing up the chip. Furthermore, the lengths of the needles become different due to wear and tear, causing the tips to be pushed up at an angle, which may cause adjacent tips to collide and damage each other.

Furthermore, the chip is adsorbed by a collet and taken out. However, if the chip is pushed up at an angle, the collet will fail to adsorb the chip. If the collet makes a mistake in picking up the chip, it will hinder subsequent work. In addition, the tip was sometimes damaged due to the pushing up of the needle.

Therefore, in recent years, a pickup device (Patent Document 1) that does not use such a needle has been proposed. As shown in FIGS. 11 to 13, this pickup device includes a stage 3 that holds an adhesive sheet body 2 to which a chip 1 is attached. Further, the stage 3 is provided with a receiving portion (sliding body) 4 whose upper surface 4a protrudes from the stage upper surface 3a. Therefore, a gap 6 is formed on the outer peripheral side of the receiving part 4 between it and the adhesive sheet body 2, as shown in FIG. Furthermore, the stage 3 is provided with a suction hole 5 that communicates with the gap 6. Note that a portion of the suction holes 5, 5 protrudes outward from the first side 8a of the chip 1 in plan view.

Next, a pickup method using the pickup device will be explained. First, as shown in FIG. 12, the adhesive sheet body 2 is suctioned through the suction hole 5 while the chip 1 is suctioned (held) by the collet (suction collet) 7 from above. As a result, the air in the gap 6 is sucked as shown by arrow A1, the adhesive sheet body 2 around the receiving portion 4 is sucked, and the adhesive sheet body 2 is peeled off on the outer peripheral side of the chip 1.

Thereafter, as shown in FIG. 13, the receiving portion 4 is moved in the direction of arrow B1. That is, it is moved to the second side 8b side facing the first side 8a. As a result, the receiving area of the chip 1 received by the receiving part 4 decreases, the adsorption (suction) area of the adhesive sheet body 2 increases, and finally the chip 1 is transferred to the adhesive sheet body 2. can be completely removed.

Patent No. 3209736 specification

By the way, in a conventional pickup device, as shown in FIG. 14, the stage 3 is often circular in plan view. If it is circular like this, there will be a difference in peeling force within the chip 1 to be picked up, and the stress applied to the chip 1 to be picked up will become non-uniform, which may cause cracks or internal defects.

The reason why this drawback occurs will be explained using FIG. 14. That is, the stage 3 is made of a disc body, and a groove 10 into which the slide body 4 is slidably fitted is formed on the upper surface of the stage 3, and a suction hole 5 communicating with the negative pressure chamber is opened in the groove 10. ing. Further, when the slide body 4 is loosely fitted into the groove 10, half to most of the opening of each suction hole 5 opens upward.

Although not shown, suction holes are opened over the entire top surface of the stage 3. Therefore, the adhesive sheet body 2 is attracted to the upper surface of the stage 3.

In this case, the dimension from the side sides (long sides) 4a, 4a of the slide body 4 to the stage outer edge 3b is S21, and from the upstream edge (short side) 4b of the slide body 4 in the sliding direction to the stage outer edge 3b. When the dimension is S22 and the dimension from the upstream corner 4c of the slide body 4 to the outer edge 3b of the stage is S23, S21>S23>S22.

That is, the dimension S22 from the short side 4b of the slide body 4 to the stage outer edge 3b and the dimension S22 from the corner 4c of the slide body 4 to the stage outer edge are smaller than the dimension S21 from the long side 4a of the slide body 4 to the stage outer edge 3b. The dimension S23 up to the edge 3b is shortened.

However, if there is a difference in size up to the outer edge 3b of the stage, there will be a difference in the amount of elongation of the adhesive sheet body 2, and therefore a difference will occur in the stress acting on the chip 1 to be peeled off. That is, if the distance is short, the adhesive sheet body 2 becomes difficult to bend. In such a case, if a step is provided between the slide body 4 and the stage 3 to induce initial peeling, cracks and internal defects will occur in the chip 1. In particular, if the chip 1 is rectangular with a large aspect ratio, the stress applied to the chip 1 will be non-uniform.

In view of the above-mentioned problems, the present invention provides a pick-up device and a pick-up method in which the stress applied to the chip is made uniform and cracks and internal defects are less likely to occur in the chip.

The pickup device of the present invention peels and separates a plurality of square or rectangular chips from an adhesive sheet body to which the chips are attached, and includes a stage for receiving the adhesive sheet body, and a stage attached to this stage. The adhesive sheet is provided with a receiver that supports the target chip through an adhesive sheet body and a negative pressure generating means, and by moving the receiver, the negative pressure generated by the negative pressure generating means causes the adhesive sheet to be removed. A pickup device that performs peeling between a body and the target chip, and includes an equalizing structure that makes it possible to equalize stress applied to the target chip in a peeling operation performed by moving the receiving body. It is.

According to the pickup device of the present invention, when peeling a target chip, the stress applied to the target chip can be made uniform with the uniform structure. This effectively prevents cracks and internal defects from occurring in the chip.

The receiver consists of a slide body whose width dimension perpendicular to the slide direction is smaller than the width dimension of the chip in the direction corresponding to the width direction of the receiver, and in the slide of this slide body, The target chip and the adhesive sheet may be separated by a negative pressure generated by the negative pressure generating means. With this configuration, when the target chip is peeled off, the target chip can be peeled off stably by sliding the slide body serving as the receiver.

The dimension from each of the three outer edges of the slide body excluding the downstream side in the sliding direction to the outer edge of the stage opposite to each outer edge edge, and the two dimensions between the three outer edge sides of the slide body. The uniform structure can be constructed by setting the dimensions from each corner to the outer edge of the stage to be the same.

With this configuration, there is no difference in the distance from the slide body to the outer edge of the stage, and when performing a peeling operation on the target chip, it is possible to equalize the stress acting on the target chip. can. That is, a uniform structure can be constructed with a simple configuration.

A raised portion may be provided on each of the three outer end sides of the upper surface of the slide body. In this way, by providing the raised portion, a bent portion is formed on the chip or the adhesive sheet body at a portion corresponding to the raised portion, and moreover, when compared with a slide body that does not have such a raised portion, the bending portion is The curvature of the area increases. For this reason, the stress generated on the chip is greater than that of a chip without a raised part, and the restoring force corresponding to the stress is increased, and the area outside the edge of the chip support surface of the chip is effectively removed from the adhesive sheet body. It has the advantage of being separable. The raised portion preferably has a shape that ensures an opening angle of 15 degrees or more between the chip and the adhesive sheet body.

The receiver consists of a square or rectangular block whose external dimensions are smaller than the external dimensions of the chip, and when the block moves in the vertical direction, the negative pressure generated by the negative pressure generating means is applied. The target chip and the adhesive sheet body may be peeled off. With this configuration, when the target chip is peeled off, the block body serving as the receiver is moved (raised), so that the target chip can be peeled off stably.

The dimensions from each outer edge of the block body to the outer edge of the stage opposite each outer edge, and the dimensions from the four corners formed by each outer edge of the block body to the outer edge of the stage. By setting them to be the same, the uniform structure can be configured. With this configuration, there is no difference in the distance from the block body to the outer edge of the stage, and when performing a peeling operation on the target chip, it is possible to equalize the stress acting on the chip. can. That is, a uniform structure can be constructed with a simple configuration.

The stage may have an oval shape in plan view, so that the dimensions from the receiver to the outer edge of the stage are made the same.

The pickup method of the present invention is to peel and separate a plurality of square or rectangular chips from an adhesive sheet body to which the chips are attached, and sequentially peel off target chips to be separated from among the plurality of chips. In this pick-up method, when a target chip to be separated among the plurality of chips is peeled off, the target chip is peeled off while uniformizing the stress applied to the target chip.

According to the pickup method of the present invention, it is possible to equalize the stress applied to the target chip when peeling the target chip. This effectively prevents cracks and internal defects from occurring in the chip.

According to the present invention, stress applied to the target chip can be made uniform during the target chip pick-up operation (when the target chip is peeled off). As a result, it is possible to effectively prevent cracks and internal defects from occurring in the chip, and the chip can be supplied to a substrate such as a lead frame while maintaining its high quality. That is, when peeling the adhesive sheet body from the chip, the peeling force acts evenly and the peeling angle becomes uniform, allowing stable peeling without deforming or damaging the chip.

FIG. 2 is a plan view showing the stage of the pickup device of the present invention, with a slide body as a receiver attached thereto. FIG. 2 is a side view showing the stage of the pickup device of the present invention, with a slide body as a receiver attached thereto. FIG. 3 is an enlarged plan view showing the relationship between the chip and the slide body. The holding mechanism of the adhesive sheet body at the pick-up position is shown, (a) is a simplified diagram in a state in which tension is applied to the adhesive sheet body, and (b) is a simplified diagram in a state in which the tension is released. 1 is a simplified diagram of a die bonder (bonding device) using a pickup device according to the present invention. The pick-up process is shown, with (a) being a simplified cross-sectional view of the stage in a peeling start state, and (b) being a simplified cross-sectional view of the stage immediately before peeling is completed. FIG. 6 is a simplified diagram showing deformation of the adhesive sheet on the long side of the slide body. FIG. 6 is a simplified diagram showing deformation of the adhesive sheet on the short side of the slide body. FIG. 7 is a plan view showing another pickup device of the present invention, with a block body as a receiver attached thereto. The block body shown in FIG. 9 is shown, in which (a) is an enlarged plan view, (b) is an enlarged cross-sectional view of a main part, and is a simplified cross-sectional view in an initial state of peeling. FIG. 2 is a simplified plan view of a conventional pickup device. FIG. 2 is a simplified cross-sectional view of a conventional pickup device. FIG. 3 is a simplified cross-sectional view showing a peeling process using a conventional pickup device. FIG. 2 is a plan view of a stage for explaining problems with a conventional pickup device.

Embodiments of the present invention will be described below based on FIGS. 1 to 10.

1 and 2 show the stage of the pickup device of the present invention. As shown in FIG. 4, this pickup device sequentially peels and takes out a plurality of thin rectangular chips (semiconductor chips) 11 stuck on the adhesive sheet body 12 at the pickup position P from the adhesive sheet body 12. It is a device.

The chip 11 is made from a wafer, and is made into a final product by cutting this material into squares or strips (rectangles). For this reason, the chip 11 is square or strip-shaped (rectangular). That is, the wafer as a whole is circular, and as shown in FIGS. 4(a) and 4(b), it is divided into individual chips 11 by dicing, and the plurality of chips 11 are attached to an adhesive sheet body 12.

In this case, as shown in FIG. 4(a), the adhesive sheet body 12 to which the plurality of divided chips 11 are attached remains attached to the wafer ring 13, and the expander ring 14 and the wafer ring retainer 15 are attached to each other. Installed in an expander made up of. Then, the wafer ring 13 is held down by the wafer ring presser 15, and thereby the adhesive sheet body 12 placed on the expand ring 14 is expanded in the radial direction, thereby widening the interval between the individual chips 11 (expanding).

Thereafter, as shown in FIG. 4(b), the dicing presser 15 is moved upward, and while the adhesive sheet body 12 is expanded by the expanding device, the individual chips 11 are picked up by the pickup device according to the present invention. , while peeling it off from the adhesive sheet body 12, it is adsorbed and picked up by a collet 37 (see FIG. 5, etc.).

The pickup device according to the present invention includes a stage 20 (20A) shown in FIGS. 1 and 2, a slide body 25 as a receiver 21 attached to this stage, and a negative pressure generating means 22 (see FIG. 6). Be prepared. In this case, the stage 20A is made of a block whose upper surface 20a is oval, and a groove 23 into which the receiver 21 is fitted is formed in the upper surface 20a.

As shown in FIG. 3, when the width of the groove 23 is W1, the width of the chip 11 is W2, and the width of the slide body 25 is W3, W1>W2>W3. When the length of the groove 23 is L1, the length of the chip 11 is L2, and the length of the slide body 25 is L3, L3>L1>L2. Here, the width dimension is a dimension in a direction perpendicular to the sliding direction of the slide body 25.

The upper surface 25a of the slide body 25 is provided with raised portions 26 (26a, 26b, 26c) on both long sides (outer end sides 32a, 32b) and the tip side (outer end side 32c) of the slide body 25. There is. Further, the groove 23 is provided with a suction hole 27 . The suction holes 27 include suction holes 27a and 27b at the upstream corner in the sliding direction of the slide body 25, a suction hole 27c at the center of the upstream end between the corner suction holes 27a and 27b, and a central portion of each long side of the groove 23. It has suction holes 27d and 27e. In this case, a portion or most of each suction hole 27 opens upward through the slide body 25 without the adhesive sheet body 12.

The slide body 25 is capable of reciprocating along the groove 23 in the directions of arrows G1 and G2 by a drive mechanism (not shown). As the drive mechanism in this case, various known and publicly used existing mechanisms can be used, such as a reciprocating mechanism consisting of a bolt shaft member and a nut member screwed into the bolt shaft member, or a cylinder mechanism. (The direction in which the slide body 25 slides (arrow G1 direction) when performing a peeling operation as described later is called the downstream side, and the opposite direction is called the upstream side.)

Further, a large number of suction holes 30 are provided on the entire surface of the upper surface 20a of this stage 20A. A negative pressure generating means 22 is connected to each suction hole 30 and suction hole 27. The negative pressure generating means 22 is composed of a vacuum generator such as a vacuum pump or an ejector. Note that the upper surface 20a of the stage 20A may not have the suction holes 30.

Therefore, when the adhesive sheet body 12 is placed on this stage 20A and the negative pressure generating means 22 is driven, the suction hole 30 becomes in a negative pressure state, and the adhesive sheet body 12 is placed on the upper surface 20a of the stage 20. It is adsorbed. In this case, as shown in FIG. 3, the chip to be peeled (target chip) 11 corresponds to the slide body 25 and extends outward on both sides (both long sides) and the tip side (short side on the upstream side in the sliding direction). It protrudes from the slide body 25. Further, the suction hole 27 corresponds to this protruding portion.

By the way, as shown in FIGS. 7 and 8, the top surface 25a of the slide body 25 is set higher than the top surface 20a of the stage 20A. The height difference H1 between the upper surface 25a excluding the raised portion 26 and the upper surface 20a of the stage 20A, the height H2 of the raised portion 26, etc. can be set arbitrarily. Note that in the raised portion 26 of this embodiment, the cross-sectional shape (cross-sectional shape) of the apex portion is rounded. The thickness W of the raised portion 26 can be set arbitrarily. Further, the raised portion 26 may be formed by an inclined surface that is sequentially upwardly inclined from the inner side toward the outer end side. Furthermore, the inclined surface may be a concave inclined surface or a convex inclined surface.

In this stage 20A, as shown in FIG. 1, the top surface 20a has an oval shape when viewed from above. That is, the stage 20A has four outer edges 33a, 33b, 33c, and 33d opposite to the four outer edges 32a, 32b, 32c, and 32d of the slide body 25, and arcuate corners 33e, 33f, 33g, and 33h. It is configured to form an oval shape. In this case, the dimensions from the slide body 25 to the outer edge 33 of the stage are made the same.

That is, the dimension from the outer edge 32a of the slide body 25 to the outer edge 33 (outer edge 33a) of the stage 20 is S1, and the dimension from the outer edge 32b of the slide body 25 to the outer edge 33 (outer edge 33a) of the stage 20 is S1. 33b) is S2, and when the dimension from the outer edge 32c of the slide body 25 to the outer edge 33 (outer edge 33c) of the stage 20 is S3, S1=S2=S3. Furthermore, among the two corners 32d and 32e formed by the three outer edge sides 32a, 32b, and 33c of the slide body 25, the dimension from one corner 32d to the outer edge 33 is S4, and from the other corner 32e to When the dimension up to the outer edge 33 is S5, S4=S5, and S1=S2=S3=S4=S5. In this case, S1 (S2, S3, S4, S5) differs depending on the size of the chip 11, the size of the slide body 25, etc.

Incidentally, in this pickup device, a holding means 35 as shown in FIGS. 6 and 7 is arranged above the chip 11 to be picked up, and the holding means 35 holds the chip 11 to be peeled from above at its height. maintain position.

The holding means 35 is composed of a suction member (collet) 37 having a head 36 for suctioning the chip 11. The head 36 has a suction hole opened in its lower end surface 36a, and the chip 11 is vacuum-suctioned through the suction hole, and the chip 11 is attracted to the lower end surface 36a of the head 36. Therefore, when this vacuum suction (evacuation) is released, the chip 11 is removed from the head 36. The collet 37 is connected to, for example, a robot arm, and as described later, can be used in the vertical direction (directions of arrows A, B, C, and D in FIG. 5), horizontal direction (directions of arrows E and F in FIG. 5), and Movement in a combination of these directions is possible.

The pickup device is used in a die bonder (bonding device) as shown in FIG. The bonding apparatus picks up a chip 11 as a workpiece cut out from a wafer with a collet (suction collet) 37 at a pick-up position P, and transfers (mounts) it to a bonding position Q of a substrate 40 such as a lead frame.

That is, this pickup device includes a bonding arm to which the suction collet 37 is detachably attached, and a drive mechanism that can drive this bonding arm in the X, Y, Z, and θ directions. In this case, the drive mechanism can be configured with a robot arm mechanism, an XYZθ axis stage, or the like. Furthermore, the stage 20 (20A) is also configured to be movable by a drive mechanism that can drive in the X, Y, Z, and θ directions. In this case as well, the drive mechanism can be composed of a robot arm mechanism, an XYZθ axis stage, or the like. The same applies to stage 20B (see FIG. 9), which will be described later.

Therefore, the collet 37 can reciprocate in the directions of arrows E and F between the pickup position P and the bonding position Q, and can also move in the directions of arrows A, B, C, D, E, and F. It is said that

By the way, a computer basically has an input means with an input function, an output means with an output function, a storage means with a memory function, a calculation means with a calculation function, and a control function. It is composed of control means. The input function is for reading information from the outside into the computer, and the read data or program is converted into a signal in a format suitable for the computer system. The output function is to display calculation results, stored data, etc. externally. The storage means stores and saves programs, data, processing results, and the like. Arithmetic functions process data by calculating and comparing data in accordance with program instructions. The control function decodes the instructions of the program and issues instructions to each means, and this control function oversees all means of the computer.

Input means include a keyboard, mouse, tablet, microphone, joystick, scanner, capture board, etc. Furthermore, output means include a monitor, speaker, printer, etc. Storage means include memory, hard disk, CD/CD-R, PD/MO, etc. The calculation means includes a CPU, and the control means includes a CPU, a motherboard, and the like.
Therefore, the drive mechanism of the slide body 25, the drive mechanism of the bonding arm, the negative pressure generating means 22, the drive mechanism of the stage 20, etc. can be controlled by one known and publicly available existing computer.

Next, a method of peeling the target chip 11 from the adhesive sheet body 12 using the pickup device configured as described above will be explained. First, the adhesive sheet body 12 on which a plurality of chips 11 are adhered in a matrix is placed on the stage 20 (20A). At this time, by moving the stage 20A in the horizontal direction, the adhesive sheet body 12 is placed on the upper surface 20a of the stage 20A so that the target chip 11 is located above the slide body 25. That is, the target chip 11 and the slide body 25 are brought into the state shown in FIG. Specifically, in plan view, each long side of the target chip 11 protrudes outward from the outer end sides 32a and 32b in the longitudinal direction of the slide body 25, and the slide direction of the slide body 25 of the target chip 11 (peeling operation The target chip 11 is not protruded from the concave groove 23 of the stage 20A, with the short side on the upstream side (in the sliding direction) protruding from the outer end side 32c of the slide body 25 on the upstream side in the sliding direction. .

In this state, as shown in FIG. 6A, the adhesive sheet body 12 is attracted to the upper surface 20a of the stage 20, and the target chip 11 is attracted (held) from above by the collet 37. In this state, the adhesive sheet body 12 is sucked from the suction hole 27 of the groove 23, so that the adhesive sheet body 12 corresponding to the portion protruding from the slide body 25 is peeled off from the chip 11. becomes.

Thereafter, by sliding (moving) the slide body in the direction of arrow G1 in FIG. 6(b), the area (range) of the chip 11 received by the slide body 25 decreases, and the adhesive sheet The downward suction area for the body 12 increases, and the adhesive sheet body 12 can finally be peeled off (separated) from the chip 11. The chip 11 peeled off in this way is transferred to the bonding position Q of the lead frame or substrate 40 while being adsorbed by the collet 37, and is mounted on the substrate 40.

Thereafter, the chips 11 on the adhesive sheet body 12 can be sequentially picked up by sequentially performing the above-described peeling operation using the chip 11 to be peeled next as the target chip.

By the way, in this pickup device, as described above, the stage 20A has an elliptical shape in plan view, and as shown in FIG. 1, S1=S2=S3=S4=S5. Therefore, this stage 20A can constitute a uniform structure M that can uniformize the stress applied to the target chip 11.

That is, as in the conventional apparatus shown in FIG. 14, the dimension S22 from the short side 4b of the slide body 4 to the stage outer edge 3b is smaller than the dimension S21 from the side edge 4a of the slide body 4 to the stage outer edge 3b. And if the dimension S23 from the corner 4c of the slide body 4 to the stage outer edge 3b is short, that is, if the dimension from the stage outer edge 3b is large or small, there is a difference in the amount of elongation of the adhesive sheet body 2. Therefore, a difference occurs in the stress acting on the chip 1 to be peeled off.

However, in the present invention, there is no difference in the dimension from the slide body 25 to the outer edge 33 of the stage, and there is no difference in the amount of elongation of the adhesive sheet body 12, so there is no difference in the stress acting on the chip 11 to be peeled off. does not occur. Further, FIG. 7 shows a cross-sectional view taken along the line X1-X1 in FIG. 1, and FIG. 8 shows a cross-sectional view taken along the line Y1-Y1 in FIG. In such a device, the deformation of the adhesive sheet body 12 follows the level difference.

In this way, in the pickup device of the present invention, it is possible to equalize the stress applied to the target chip 11 during the pickup operation of the target chip 11 (when peeling off the target chip 11). This effectively prevents cracks and internal defects from occurring in the chip 11, and allows the chip 11 to be supplied to a substrate 40 such as a lead frame with high quality.

That is, the peeling force when peeling the adhesive sheet body 12 from the chip 11 is applied uniformly, and the peeling angle becomes uniform, so that the chip 11 can be stably peeled off without being deformed or damaged.

When peeling the target chip 11, by sliding the slide body 25, which is the receiver 21, stable peeling can be achieved.

Further, as in this embodiment, the outer edge 33 of the stage 20A facing each outer edge 32a, 32b, 32c from each of the three outer edge edges 32a, 32b, 32c excluding the downstream side in the sliding direction of the slide body 25 Dimensions S1, S2, S3 up to, and dimensions S4, S5 from the two corners 33d, 33e formed between the three outer edge sides 32a, 32b, 32c of the slide body 25 to the outer edge 33 of the stage 20A. A uniform structure M can be constructed by setting the same values.

With this configuration, there is no difference in the distance from the slide body 25 to the outer edge 33 of the stage 20A, and when performing a peeling operation on the target chip 11, the stress acting on the chip 11 is uniform. It is possible to aim for That is, the uniform structure M can be configured with a simple configuration.

A raised portion 26 (26a, 26b, 26c) may be provided on each of the three outer end sides 32a, 32b, and 32c on the upper surface 25a of the slide body 25. As described above, by providing the raised portion 26, a bent portion is formed on the chip or the adhesive sheet body 12 at a portion corresponding to the raised portion 26, and moreover, the slide body 25 which does not have such a raised portion 26 and When compared, the curvature of the bent portion becomes larger. For this reason, the stress generated in the chip 11 is greater than that in a chip without a raised portion, and the restoring force corresponding to the stress is increased, and the area outside the edge of the chip support surface of the chip 11 is moved onto the adhesive sheet body 12. It has the advantage of being able to be effectively separated from In this case, as shown in FIGS. 7 and 8, the raised portion 26 preferably has a shape that can ensure an opening angle θ1 between the chip 11 and the adhesive sheet body 12 of 15 degrees or more. Further, the raised portion 26 may be formed by an inclined surface that is sequentially upwardly inclined from the inner side toward the outer end side. Furthermore, the inclined surface may be a concave inclined surface or a convex inclined surface. If the opening angle θ1 between the chip 11 and the adhesive sheet body 12 can be maintained at 15 degrees or more, stable peeling and damage to the chip 11 can be effectively prevented. Further, the raised portion 26 may be formed by an inclined surface that is sequentially upwardly inclined from the inner side toward the outer end side. Furthermore, the inclined surface may be a concave inclined surface or a convex inclined surface.

Next, FIG. 9 shows a pickup device using a block body 50 in which the receiving body 21 moves up and down. The block body 50 includes a first block 51 that is a rectangular cylindrical body, a second block 52 that is a rectangular cylindrical body that is loosely fitted into the first block 51, and a second block 52 that is fitted inside the second block 52. It consists of a third block 53 in the shape of a plate.

Further, the block body 50 is loosely fitted into the fitting hole 55 of the stage 20 (20B), and a gap 56 is provided between the outer surface of the first block 51 and the inner surface of the fitting hole 55. A gap 57 is provided between the outer surface of the second block 52 and the first block 51, and a gap 58 is provided between the outer surface of the third block 53 and the inner surface of the second block 52.

In this case, each of the first, second, and third blocks 51, 52, and 53 of the block body 50 can be moved up and down independently. That is, each of the blocks 51, 52, and 53 can be moved up and down using a known and publicly used up and down movement mechanism. Further, the vertical movement mechanism of each block 51, 52, 53 is also controlled by the computer described above.

Further, a suction groove 60 is formed at the inner corner of the first block 52, and a suction groove 61 is formed at the inner corner of the second block 52. Therefore, the gap 56 can be brought into a negative pressure state by the negative pressure generating means 22, the gap 57 can be brought into a negative pressure state through the suction groove 60, and the gap 57 can be brought into a negative pressure state through the suction groove 61. 58 can be brought into a negative pressure state.

In this case, the outer edges 33a, 33b of the stage 20 (20B) facing from the outer edges 62a, 62b, 62c, 62d of the block body 50, that is, the first block 51 to the outer edges 62a, 62b, 62c. , 33c, and 33d, and from the four corners 62e, 62f, 62g, and 62h of the block body 50, that is, the outer edge sides 62a, 62b, 62c, and 62d of the first block 51 to the outer edge of the stage 20. The uniform structure M is configured by setting the dimensions of the edges 33e, 33f, 33g, and 33h to be the same.

That is, the dimension from the outer edge 62a of the first block 51 to the outer edge 33a of the stage 20 is S11, the dimension from the outer edge 62b of the first block 51 to the outer edge 33b of the stage 20 is S12, The dimension from the outer edge 62c of the first block 51 to the outer edge 33c of the stage 20 is S13, the dimension from the outer edge 62d of the first block 51 to the outer edge 33d of the stage 20 is S14, and the first The dimension from the corner 62e of the block 51 to the outer edge 33e of the stage 20 is S15, the dimension from the corner 62f of the first block 51 to the outer edge 33f of the stage 20 is S16, and the dimension from the corner 62g of the first block 51 to the outer edge 33f of the stage 20 is S15. When the dimension from the outer edge 33g of the stage 20 is S17, and the dimension from the corner 62h of the first block 51 to the outer edge 33h of the stage 20 is S18, S11=S12=S13=S14=S15=S16 =S17=S18. Note that S11 (S12, S13, S14, S15, S16, S17, S18) differs depending on the size of the chip 11, the size of the slide body 25, etc.

Further, a raised portion 65 is provided on each outer edge side 62a, 62b, 62c, 62d, 63a, 63b, 63c, 63d, 64a, 64b, 64c, 64d of the upper surface of each block 51, 52, 53 of the block body 50. , 66 and 67 are provided. Even if the cross-sectional shape of each of the raised portions 65, 66, and 67 is similar to the cross-sectional shape of the raised portion 26 shown in FIGS. 7 and 8, it slopes sequentially upward from the inside toward the outer edge. It may also be constructed with an inclined surface.

Next, a peeling operation (peeling method) of the chip 11 using a pickup device having the stage 20 (20B) configured as described above will be described. Note that the stage 20B in this case can also be driven in the X, Y, Z, and θ directions by a drive mechanism (not shown). Further, the outer dimensions of the block body 50 are made smaller than the outer dimensions of the target chip 11. Therefore, when the adhesive sheet body 12 is attracted to the stage 20B, the four sides of the target chip 11 protrude outward from the four outer edges 62a, 62b, 62c, and 62d of the block body 50. ing. The four sides of the target chip 11 do not protrude outward beyond the fitting hole 55.

First, the entire block body 50 is raised by a predetermined distance from the top surface 20a of the stage 20B, and the adhesive sheet body 12 is sucked onto the top surface 20a of the stage 20, and the target chip 11 is sucked and held by the suction collet 37. state. In this case, the gap 56 is brought into a negative pressure state. Therefore, a suction force is applied that draws the adhesive sheet body 12 on the outer peripheral portion of the target chip 11 into the gap 56.

Next, while leaving the first block 51 as it is, the second block 52 and the third block 53 are further increased to a predetermined size (the predetermined size here refers to the predetermined size obtained by raising the entire block body 50 from the upper surface 20a of the stage 20B). They may be the same or different.) At this time, the collet 37 is also raised by this predetermined distance, and the adhesive sheet body 12 outside the second block 52 of the target chip 11 is peeled off. In this case, the gap 57 is also under negative pressure via the suction groove 60.

After that, only the third block 53 is further increased by a predetermined size (the predetermined size here may be the same as or different from the predetermined size by which the entire block body 50 is raised from the upper surface 20a of the stage 20). raise. At this time, the suction collet 37 is also raised by this predetermined distance, and the adhesive sheet body 12 outside the third block 53 of the target chip 11 is peeled off. In this case, the gap 58 is also under negative pressure via the suction groove 61.

As a result, the adhesive sheet body 12 is in a state where it is adhered to the target chip 11 in the range of the upper surface of the third block 53. From this state, by raising the collet 37, the target chip 11 is attached to the adhesive sheet body 12. can be completely peeled off.

Also in the structures shown in FIGS. 9 and 10, the uniform structure M is configured by setting S11=S12=S13=S14=S15=S16=S17=S18. That is, there is no difference in the dimension from the block body 50 to the outer edge 33 of the stage, there is no difference in the amount of elongation of the adhesive sheet body 12, and therefore there is no difference in the stress acting on the chip 11 to be peeled off. That is, it is possible to equalize the stress applied to the target chip 11 during the pick-up operation of the target chip 11 (when peeling off the target chip 11). This effectively prevents cracks and internal defects from occurring in the chip 11, and allows the chip to be supplied to the substrate 40, such as a lead frame, with high quality.

Further, even if the receiving body 21 is configured as a block body 50, since each block body 51, 52, 53 has the raised portions 65, 57, 58, the raised portion provided on the upper surface 25a of the slide body 25 Similar to 26, there is an advantage that it can be effectively separated from the adhesive sheet body 12.

The present invention is not limited to the above-described embodiments and can be modified in various ways. For example, in the pickup device shown in FIG. 1, the stage 20A shown in FIG. 1 has a flat top surface 20a; It may have a mortar shape that is inclined upward toward the outer periphery. As shown in FIGS. 9 and 10, when using the block body 50, three blocks 51, 52, 53 were used in the above embodiment, but even when two blocks are used, four or more blocks are used. It may be used. Further, the number, diameter, etc. of the suction holes 27 and 30 for suctioning air are arbitrary.

By the way, in each embodiment, a so-called long chip with a large aspect ratio is used as the chip 11, but it may be a rectangular chip with a relatively small aspect ratio or a square chip with the same sides. When the stage 20 is circular in plan view and picks up a long chip 11 with a large aspect ratio, there is a large difference in the distance from the receiver 21 to the outer edge of the stage 20. A device with this feature is most suitable for such a long chip 11 with a large aspect ratio.

11 chip (target chip)
12 Adhesive sheet body 20 Stage 20a Top surface 21 Receiver 22 Negative pressure generating means 25 Slide body 26 Protrusion 32a Outer edge 32b Outer edge 32c Outer edge 32d Corner 32e Corner 33, 33a, 33b, 33c, 33d Outer edge 33e, 33f, 33g, 33h Outer edge (arc side)
50 Block body 62a Outer edge 62b Outer edge 62c Outer edge 62d Outer edge 62e, 62f, 62g, 62h Corner M Uniform structure

Claims (6)

This device peels and separates a plurality of square or rectangular chips from an adhesive sheet body to which the chips are pasted, and includes a stage for receiving the adhesive sheet body, and a stage attached to this stage to separate the chips from the adhesive sheet body through the adhesive sheet body. A receiver for supporting a target chip and a negative pressure generating means are provided, and by moving the receiver, the negative pressure generated by the negative pressure generating means is used to create a gap between the adhesive sheet body and the target chip. A pickup device for peeling,
In the peeling operation performed by moving the receiver, the receiver is provided with an equalizing structure that makes it possible to equalize the stress applied to the target chip, and the receiver has a width direction dimension perpendicular to the sliding direction of the receiver. It consists of a slide body that has a square or rectangular shape that is smaller than the width dimension of the chip in the direction corresponding to the width direction, and when the slide body slides, the negative pressure generated by the negative pressure generating means is applied to the target chip. The dimensions from each of the three outer edges of the slide body excluding the downstream side in the sliding direction to the outer edge of the stage opposite to each outer edge, and the three dimensions of the chip. A pickup device characterized in that the uniform structure is constructed by setting the dimensions from two corners formed between the outer edges to the outer edge of the stage to be the same . 2. The pickup device according to claim 1 , wherein a raised portion is provided on each of the three outer end sides of the upper surface of the slide body . This device peels and separates a plurality of square or rectangular chips from an adhesive sheet body to which the chips are pasted, and includes a stage for receiving the adhesive sheet body, and a stage attached to this stage to separate the chips from the adhesive sheet body through the adhesive sheet body. A receiver for supporting a target chip and a negative pressure generating means are provided, and by moving the receiver, the negative pressure generated by the negative pressure generating means is used to create a gap between the adhesive sheet body and the target chip. A pickup device for peeling,
In the peeling operation performed by moving the receiving body, the receiving body is provided with an equalizing structure that makes it possible to equalize the stress applied to the target chip, and the receiving body has a square shape whose external dimensions are smaller than the external dimensions of the chip. It consists of a rectangular block body, and when the block body moves in the vertical direction, the target chip and the adhesive sheet body are peeled off by the negative pressure generated by the negative pressure generating means, and the block body The dimensions from each outer edge of the block to the outer edge of the stage opposite each outer edge, and the dimensions from the four corners formed by each outer edge of the block body to the outer edge of the stage are set to be the same. A pickup device characterized in that the uniformization structure is formed by : Any one of claims 1 to 3, characterized in that the stage has an oval shape in plan view so that the dimensions from the receiver to the outer edge of the stage are made the same. The pickup device according to item 1 . A pickup method for peeling and separating a plurality of square or rectangular chips from an adhesive sheet body to which the chips are attached, and for sequentially peeling target chips to be separated from among the plurality of chips,
When peeling a target chip to be separated among a plurality of chips using the pickup device according to claim 1, the target chip is peeled off while equalizing the stress applied to the target chip. Featured pickup method. A pickup method for peeling and separating a plurality of square or rectangular chips from an adhesive sheet body to which the chips are attached, and for sequentially peeling target chips to be separated from among the plurality of chips,
When peeling a target chip to be separated among a plurality of chips using the pickup device according to claim 2, the target chip is peeled off while equalizing the stress applied to the target chip. Featured pickup method.

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