JP7441722B2 - liquid crystal polymer - Google Patents
liquid crystal polymer Download PDFInfo
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- JP7441722B2 JP7441722B2 JP2020089560A JP2020089560A JP7441722B2 JP 7441722 B2 JP7441722 B2 JP 7441722B2 JP 2020089560 A JP2020089560 A JP 2020089560A JP 2020089560 A JP2020089560 A JP 2020089560A JP 7441722 B2 JP7441722 B2 JP 7441722B2
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- 229920000106 Liquid crystal polymer Polymers 0.000 title claims description 77
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 title claims description 77
- 150000001875 compounds Chemical class 0.000 claims description 31
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 14
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 7
- 239000011256 inorganic filler Substances 0.000 claims description 7
- 239000012766 organic filler Substances 0.000 claims description 7
- SJJCQDRGABAVBB-UHFFFAOYSA-N 1-hydroxy-2-naphthoic acid Chemical compound C1=CC=CC2=C(O)C(C(=O)O)=CC=C21 SJJCQDRGABAVBB-UHFFFAOYSA-N 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- -1 aromatic hydroxycarboxylic acids Chemical class 0.000 description 18
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 239000000178 monomer Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- 238000005452 bending Methods 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- 239000000654 additive Substances 0.000 description 8
- 235000014113 dietary fatty acids Nutrition 0.000 description 8
- 239000000194 fatty acid Substances 0.000 description 8
- 229930195729 fatty acid Natural products 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000008188 pellet Substances 0.000 description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 150000004665 fatty acids Chemical class 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QCNWZROVPSVEJA-UHFFFAOYSA-N Heptadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCC(O)=O QCNWZROVPSVEJA-UHFFFAOYSA-N 0.000 description 2
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 description 2
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 229960000250 adipic acid Drugs 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- GJBRTCPWCKRSTQ-UHFFFAOYSA-N decanedioic acid Chemical compound OC(=O)CCCCCCCCC(O)=O.OC(=O)CCCCCCCCC(O)=O GJBRTCPWCKRSTQ-UHFFFAOYSA-N 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- QQHJDPROMQRDLA-UHFFFAOYSA-N hexadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCC(O)=O QQHJDPROMQRDLA-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- JJOJFIHJIRWASH-UHFFFAOYSA-N icosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCC(O)=O JJOJFIHJIRWASH-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 2
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 2
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004605 External Lubricant Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- IFAWYXIHOVRGHQ-UHFFFAOYSA-N Nonadecandioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCC(O)=O IFAWYXIHOVRGHQ-UHFFFAOYSA-N 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229960002255 azelaic acid Drugs 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- YVSCCMNRWFOKDU-UHFFFAOYSA-N hexanedioic acid Chemical compound OC(=O)CCCCC(O)=O.OC(=O)CCCCC(O)=O YVSCCMNRWFOKDU-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Polyesters Or Polycarbonates (AREA)
Description
本発明は、機械強度に優れた液晶ポリマーに関する。 The present invention relates to a liquid crystal polymer with excellent mechanical strength.
液晶ポリマーは、耐熱性、剛性等の機械物性、耐薬品性、寸法精度等に優れているため、成形品用途のみならず、繊維やフィルムといった各種用途にその使用が拡大しつつある。特に電気・電子部品の高集積度化、小型化、薄肉化、低背化等が急速に進んでおり0.5mm以下の非常に薄い肉厚部が形成されるケースが多く、液晶ポリマーの優れた成形性、すなわち、流動性が良好であり、かつバリが出ないという他のポリマーにない特徴を活かして、その使用量が大幅に増大している。 Liquid crystal polymers have excellent mechanical properties such as heat resistance and rigidity, chemical resistance, and dimensional accuracy, so their use is expanding not only to molded products but also to various applications such as fibers and films. In particular, electrical and electronic components are rapidly becoming more highly integrated, smaller, thinner, and lower in height, and in many cases very thin wall parts of 0.5 mm or less are formed, making liquid crystal polymers an excellent solution. Its usage has increased significantly due to its excellent moldability, that is, its good fluidity and no burrs, which are characteristics not found in other polymers.
近年、高度情報化社会の発展とともに、パーソナル・コンピューターや携帯電話等の情報・通信分野において、情報通信機器の伝送情報量および伝達速度の爆発的な増加に伴い、マイクロ波およびミリ波の高周波領域において適応できる高性能な高周波用電子部品のニーズがより強くなってきている。 In recent years, with the development of a highly information-oriented society, the amount and speed of information transmitted by information and communication equipment has increased explosively in the information and communication field, such as personal computers and mobile phones. There is a growing need for high-performance, high-frequency electronic components that can be used in
一方、情報処理等に伴う高周波・大容量の電気信号の送受信等により、電子回路基板は発熱する傾向にあるが、発熱に伴う消費電力量は無視できないものとなりつつある。 On the other hand, electronic circuit boards tend to generate heat due to the transmission and reception of high-frequency, large-capacity electrical signals associated with information processing, and the amount of power consumed due to the heat generation is becoming impossible to ignore.
一般に電子回路基板の成形材料の誘電正接が小さいほど発熱量が減少し、発熱に伴う消費電力量を抑えることができる。この点に着目した例として、低誘電正接の成形材料として液晶性芳香族ポリエステルを用いることが知られている。例えば、特許文献1には、p-ヒドロキシ安息香酸に由来する構造単位と6-ヒドロキシ-2-ナフトエ酸に由来する構造単位とからなり、p-ヒドロキシ安息香酸に由来する構造単位の含有割合がおよそ20~35モル%の組成を有する液晶性芳香族ポリエステルが提案されている。 In general, the smaller the dielectric loss tangent of the molding material for the electronic circuit board, the lower the amount of heat generated, and the amount of power consumed due to heat generation can be suppressed. As an example focusing on this point, it is known that liquid crystalline aromatic polyester is used as a molding material with a low dielectric loss tangent. For example, Patent Document 1 discloses that the structural unit is composed of a structural unit derived from p-hydroxybenzoic acid and a structural unit derived from 6-hydroxy-2-naphthoic acid, and the content ratio of the structural unit derived from p-hydroxybenzoic acid is Liquid crystalline aromatic polyesters having a composition of approximately 20 to 35 mol % have been proposed.
しかしながら、特許文献1に記載の液晶性芳香族ポリエステルは、機械強度、特にIzod衝撃強度に劣るものであり、機械的強度については更なる改善が求められている。 However, the liquid crystalline aromatic polyester described in Patent Document 1 is inferior in mechanical strength, particularly Izod impact strength, and further improvement in mechanical strength is required.
本発明の目的は、Izod衝撃強度などの機械強度が改善された液晶ポリマーを提供することにある。 It is an object of the present invention to provide a liquid crystal polymer with improved mechanical strength, such as Izod impact strength.
本発明者等は、上記課題に鑑み、鋭意検討した結果、特定の構造を有する脂肪族ジカルボン酸成分を他の重合性単量体と共重合させることによって、機械強度が向上した成形品等を形成し得る液晶ポリマーが得られることを見出し、本発明を完成させるに至った。 In view of the above-mentioned problems, the present inventors have made extensive studies and have developed molded products with improved mechanical strength by copolymerizing an aliphatic dicarboxylic acid component with a specific structure with other polymerizable monomers. The present inventors have discovered that a liquid crystal polymer that can be formed can be obtained, and have completed the present invention.
すなわち本発明は、以下の好適な態様を包含する。
〔1〕式(1)
HOOC-(CH2)n-COOH ・・・式(1)
[式中、nは4~18の整数である]
で表される化合物ならびにそれらの反応性誘導体からなる群から選択される1種以上の重合性化合物に由来する構成単位(A)、4-ヒドロキシ安息香酸に由来する構成単位(B)および6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(C)を含む液晶ポリマーであって、液晶ポリマーを構成する全構成単位100モル%に対して、構成単位(A)が0.01~7モル%、構成単位(B)が15~40モル%、構成単位(C)が60~85モル%である、液晶ポリマー。
〔2〕式(1)で表される化合物は、式(2)
HOOC-(CH2)8-COOH ・・・式(2)
で表される化合物である、請求項1に記載の液晶ポリマー。
〔3〕Izod衝撃強度が200J/m以上である、〔1〕または〔2〕に記載の液晶ポリマー。
〔4〕〔1〕~〔3〕のいずれかに記載の液晶ポリマーと無機または有機充填材とを含む液晶ポリマー組成物。
〔5〕〔1〕~〔3〕のいずれかに記載の液晶ポリマーまたは〔4〕に記載の液晶ポリマー組成物を加工してなる、成形品、フィルムまたは繊維からなる物品。
That is, the present invention includes the following preferred embodiments.
[1] Formula (1)
HOOC-(CH 2 ) n -COOH...Formula (1)
[In the formula, n is an integer from 4 to 18]
The structural unit (A) derived from one or more polymerizable compounds selected from the group consisting of the compounds represented by and their reactive derivatives, the structural unit (B) derived from 4-hydroxybenzoic acid, and the 6- A liquid crystal polymer containing a structural unit (C) derived from hydroxy-2-naphthoic acid, in which the structural unit (A) is 0.01 to 7 mol% with respect to 100 mol% of all structural units constituting the liquid crystal polymer. , a liquid crystal polymer containing 15 to 40 mol% of the structural unit (B) and 60 to 85 mol% of the structural unit (C).
[2] The compound represented by formula (1) is represented by formula (2)
HOOC-(CH 2 ) 8 -COOH...Formula (2)
The liquid crystal polymer according to claim 1, which is a compound represented by:
[3] The liquid crystal polymer according to [1] or [2], which has an Izod impact strength of 200 J/m or more.
[4] A liquid crystal polymer composition comprising the liquid crystal polymer according to any one of [1] to [3] and an inorganic or organic filler.
[5] An article made of a molded article, film, or fiber produced by processing the liquid crystal polymer according to any one of [1] to [3] or the liquid crystal polymer composition according to [4].
本発明の液晶ポリマーによると、Izod衝撃強度などの機械強度が改善された成形品等の物品を形成することができる。 According to the liquid crystal polymer of the present invention, articles such as molded articles having improved mechanical strength such as Izod impact strength can be formed.
本発明の液晶ポリマーは、好適には、異方性溶融相を形成するポリエステルまたはポリエステルアミドである。これらは、通常、当該技術分野においてサーモトロピック液晶ポリエステル又はサーモトロピック液晶ポリエステルアミドと呼ばれるものであるが、特に限定されない。 The liquid crystal polymer of the invention is preferably a polyester or polyester amide that forms an anisotropic melt phase. These are commonly referred to in the art as thermotropic liquid crystal polyesters or thermotropic liquid crystal polyester amides, but are not particularly limited.
本発明の液晶ポリマーは、液晶ポリマーを構成する全構成単位100モル%に対して、式(1)
HOOC-(CH2)n-COOH ・・・式(1)
[式中、nは4~18の整数である]
で表される化合物ならびにそれらの反応性誘導体からなる群から選択される1種以上の重合性化合物に由来する構成単位(A)を0.01~7モル%、4-ヒドロキシ安息香酸に由来する構成単位(B)を15~40モル%、6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(C)を60~85モル%含む。
The liquid crystal polymer of the present invention has the formula (1) with respect to 100 mol% of the total structural units constituting the liquid crystal polymer.
HOOC-(CH 2 ) n -COOH...Formula (1)
[In the formula, n is an integer from 4 to 18]
0.01 to 7 mol% of the structural unit (A) derived from one or more polymerizable compounds selected from the group consisting of the compounds represented by and their reactive derivatives, derived from 4-hydroxybenzoic acid It contains 15 to 40 mol% of the structural unit (B) and 60 to 85 mol% of the structural unit (C) derived from 6-hydroxy-2-naphthoic acid.
式(1)で表される化合物としては、ヘキサン二酸、ヘプタン二酸、オクタン二酸、ノナン二酸、デカン二酸、ウンデカン二酸、ドデカン二酸、トリデカン二酸、テトラデカン二酸、ペンタデカン二酸、ヘキサデカン二酸、ヘプタデカン二酸、オクタデカン二酸、ノナデカン二酸、エイコサン二酸などが挙げられる。 Examples of the compound represented by formula (1) include hexanedioic acid, heptanedioic acid, octanedioic acid, nonanedioic acid, decanedioic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, and pentadecanedioic acid. acids, hexadecanedioic acid, heptadecanedioic acid, octadecanedioic acid, nonadecanedioic acid, eicosanedioic acid, and the like.
これらの中でも、より機械強度の改善効果が高いことから、それぞれ以下の式(2)~式(4)で表されるデカン二酸(セバシン酸)、ヘキサン二酸(アジピン酸)およびドデカン二酸が好ましく、特にデカン二酸(セバシン酸)がより好ましい。 Among these, decanedioic acid (sebacic acid), hexanedioic acid (adipic acid) and dodecanedioic acid, which are represented by the following formulas (2) to (4), respectively, have a higher effect of improving mechanical strength. is preferred, and decanedioic acid (sebacic acid) is particularly preferred.
HOOC-(CH2)8-COOH ・・・式(2)
HOOC-(CH2)4-COOH ・・・式(3)
HOOC-(CH2)10-COOH ・・・式(4)
HOOC-(CH 2 ) 8 -COOH...Formula (2)
HOOC-(CH 2 ) 4 -COOH...Formula (3)
HOOC-(CH 2 ) 10 -COOH...Formula (4)
式(1)で表される化合物ならびにそれらの反応性誘導体からなる群から選択される1種以上の重合性化合物に由来する構成単位(A)は、全構成単位100モル%に対して、好ましくは0.05~5モル%、より好ましくは0.07~4モル%、さらに好ましくは0.1~3モル%である。構成単位(A)が液晶ポリマーを構成する全構成単位100モル%に対して7モル%を超えると、耐熱性及び機械物性が低下する。構成単位(A)の合計量が液晶ポリマーを構成する全構成単位100モル%に対して0.01モル%未満であると、Izod衝撃強度をはじめとする機械的性質の改善効果が得られない。 The structural unit (A) derived from one or more polymerizable compounds selected from the group consisting of compounds represented by formula (1) and reactive derivatives thereof is preferably based on 100 mol% of the total structural units. is 0.05 to 5 mol%, more preferably 0.07 to 4 mol%, even more preferably 0.1 to 3 mol%. If the content of the structural unit (A) exceeds 7 mol% based on 100 mol% of all structural units constituting the liquid crystal polymer, heat resistance and mechanical properties will decrease. If the total amount of the structural unit (A) is less than 0.01 mol% with respect to 100 mol% of all structural units constituting the liquid crystal polymer, the effect of improving mechanical properties including Izod impact strength cannot be obtained. .
4-ヒドロキシ安息香酸に由来する構成単位(B)は、液晶ポリマーを構成する全構成単位100モル%に対して、好ましくは18~36モル%、より好ましくは20~34モル%、さらに好ましくは21~32モル%、特に好ましくは22~30モル%である。 The structural unit (B) derived from 4-hydroxybenzoic acid is preferably 18 to 36 mol%, more preferably 20 to 34 mol%, even more preferably It is 21 to 32 mol%, particularly preferably 22 to 30 mol%.
6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(C)は、液晶ポリマーを構成する全構成単位100モル%に対して、好ましくは64~82モル%、より好ましくは66~80モル%、さらに好ましくは68~79モル%、特に好ましくは70~78モル%である。 The structural unit (C) derived from 6-hydroxy-2-naphthoic acid is preferably 64 to 82 mol%, more preferably 66 to 80 mol%, based on 100 mol% of all structural units constituting the liquid crystal polymer. More preferably 68 to 79 mol%, particularly preferably 70 to 78 mol%.
本発明の液晶ポリマーの好ましい実施態様として、式(1)で表される化合物ならびにそれらの反応性誘導体からなる群から選択される1種以上の重合性化合物に由来する構成単位(A)、4-ヒドロキシ安息香酸に由来する構成単位(B)および6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(C)から構成される液晶ポリマーが挙げられる。 In a preferred embodiment of the liquid crystal polymer of the present invention, a structural unit (A) derived from one or more polymerizable compounds selected from the group consisting of compounds represented by formula (1) and reactive derivatives thereof; -A liquid crystal polymer composed of a structural unit (B) derived from hydroxybenzoic acid and a structural unit (C) derived from 6-hydroxy-2-naphthoic acid.
本発明の液晶ポリマーにおける構成単位(A)~(C)の合計は100モル%であることが好ましいが、本発明の目的を損なわない範囲において、他の構成単位をさらに含有してもよい。 The total amount of structural units (A) to (C) in the liquid crystal polymer of the present invention is preferably 100 mol%, but other structural units may be further contained within a range that does not impair the object of the present invention.
他の構成単位を与える単量体としては、他の芳香族ヒドロキシカルボン酸、芳香族ジオール、芳香族ジカルボン酸、芳香族ヒドロキシアミン、芳香族ジアミン、芳香族アミノカルボン酸、芳香族ヒドロキシジカルボン酸、脂肪族ジオール、脂肪族ジカルボン酸、芳香族メルカプトカルボン酸、芳香族ジチオール、芳香族メルカプトフェノールおよびこれらの組合せなどが挙げられる。 Monomers providing other structural units include other aromatic hydroxycarboxylic acids, aromatic diols, aromatic dicarboxylic acids, aromatic hydroxyamines, aromatic diamines, aromatic aminocarboxylic acids, aromatic hydroxydicarboxylic acids, Examples include aliphatic diols, aliphatic dicarboxylic acids, aromatic mercaptocarboxylic acids, aromatic dithiols, aromatic mercaptophenols, and combinations thereof.
これらの他の単量体成分から与えられる繰返し構成単位の合計は、全構成単位の10モル%以下であるのが好ましい。 The total amount of repeating structural units provided by these other monomer components is preferably 10 mol % or less of the total structural units.
以下、本発明の液晶ポリマーの製造方法について説明する。 The method for producing the liquid crystal polymer of the present invention will be described below.
本発明の液晶ポリマーは、式(1)で表される化合物およびそれらの反応性誘導体からなる群から選択される1種以上の重合性化合物と、4-ヒドロキシ安息香酸および6-ヒドロキシ-2-ナフトエ酸を含む重合性単量体とを重合させて成る液晶ポリマーである。本発明の液晶ポリマーを製造する方法に特に制限はなく、上記の重合性単量体を、エステル結合またはアミド結合を形成させる公知の重縮合方法、たとえば溶融アシドリシス法、スラリー重合法などに供することにより本発明の液晶ポリマーを得ることができる。 The liquid crystal polymer of the present invention comprises one or more polymerizable compounds selected from the group consisting of compounds represented by formula (1) and reactive derivatives thereof, 4-hydroxybenzoic acid and 6-hydroxy-2- It is a liquid crystal polymer formed by polymerizing a polymerizable monomer containing naphthoic acid. There are no particular limitations on the method for producing the liquid crystal polymer of the present invention, and the above polymerizable monomer may be subjected to a known polycondensation method to form an ester bond or an amide bond, such as a melt acidolysis method or a slurry polymerization method. The liquid crystal polymer of the present invention can be obtained by this method.
溶融アシドリシス法は、本発明の液晶ポリマーを製造するのに好ましい方法である。この方法は、最初に重合性化合物および/または重合性単量体を加熱して反応物質の溶融溶液を形成し、次いで重縮合反応を続けて溶融ポリマーを得るものである。なお、縮合の最終段階で副生する揮発物(たとえば酢酸、水など)の除去を容易にするために真空を適用してもよい。 Melt acidolysis is a preferred method for producing the liquid crystal polymers of the present invention. In this method, the polymerizable compound and/or monomer are first heated to form a molten solution of the reactants, and then a polycondensation reaction is continued to obtain a molten polymer. Note that a vacuum may be applied to facilitate the removal of volatile by-products (eg, acetic acid, water, etc.) in the final stage of condensation.
スラリー重合法とは、熱交換流体の存在下で重合性化合物および/または重合性単量体を反応させる方法であって、固体生成物は熱交換媒質中に懸濁した状態で得られる。 Slurry polymerization is a method in which polymerizable compounds and/or polymerizable monomers are reacted in the presence of a heat exchange fluid, and a solid product is obtained in a suspended state in the heat exchange medium.
溶融アシドリシス法およびスラリー重合法のいずれの場合においても、液晶ポリマーを製造する際に使用される重合性単量体は、いずれも、常温において、ヒドロキシル基および/またはアミノ基をアシル化した変性形態、すなわち低級アシル化物として反応に供することもできる。 In both the melt acidolysis method and the slurry polymerization method, the polymerizable monomers used to produce liquid crystal polymers are modified forms in which hydroxyl groups and/or amino groups are acylated at room temperature. That is, it can also be subjected to the reaction as a lower acylated product.
低級アシル基は炭素原子数2~5のものが好ましく、炭素原子数2または3のものがより好ましい。特に好ましくは前記重合性化合物および/または重合性単量体のアセチル化物を反応に用いる方法が挙げられる。 The lower acyl group preferably has 2 to 5 carbon atoms, more preferably 2 or 3 carbon atoms. Particularly preferred is a method in which an acetylated product of the polymerizable compound and/or polymerizable monomer is used in the reaction.
重合性化合物および/または重合性単量体の低級アシル化物は、別途アシル化して予め合成したものを用いてもよいし、液晶ポリマーの製造時に重合性化合物および/または重合性単量体に無水酢酸等のアシル化剤を加えて反応系内で生成せしめることもできる。 The lower acylated product of the polymerizable compound and/or the polymerizable monomer may be acylated separately and synthesized in advance, or the polymerizable compound and/or the polymerizable monomer may be anhydrous during production of the liquid crystal polymer. It can also be produced within the reaction system by adding an acylating agent such as acetic acid.
溶融アシドリシス法またはスラリー重合法のいずれの場合においても、重合反応は、温度150~400℃、好ましくは250~370℃で、常圧および/または減圧下で行うのがよく、必要に応じて触媒を用いてもよい。 In either the melt acidolysis method or the slurry polymerization method, the polymerization reaction is preferably carried out at a temperature of 150 to 400°C, preferably 250 to 370°C, under normal pressure and/or reduced pressure, and a catalyst is optionally used. may also be used.
触媒の具体例としては、ジアルキルスズオキシド(たとえばジブチルスズオキシド)、ジアリールスズオキシドなどの有機スズ化合物;二酸化チタン;三酸化アンチモン;アルコキシチタンシリケート、チタンアルコキシドなどの有機チタン化合物;カルボン酸のアルカリおよびアルカリ土類金属塩(たとえば酢酸カリウム);ルイス酸(たとえば三フッ化硼素)、ハロゲン化水素(たとえば塩化水素)などの気体状酸触媒などが挙げられる。 Specific examples of catalysts include organotin compounds such as dialkyltin oxide (e.g. dibutyltin oxide), diaryltin oxide; titanium dioxide; antimony trioxide; organotitanium compounds such as alkoxytitanium silicates, titanium alkoxides; alkalis and alkalis of carboxylic acids. Gaseous acid catalysts such as earth metal salts (for example, potassium acetate); Lewis acids (for example, boron trifluoride), hydrogen halides (for example, hydrogen chloride), and the like.
触媒を使用する場合、該触媒の量は重合性単量体全量に対し、好ましくは1~1000ppm、より好ましくは2~100ppmである。 When a catalyst is used, the amount of the catalyst is preferably 1 to 1000 ppm, more preferably 2 to 100 ppm, based on the total amount of polymerizable monomers.
このようにして重縮合反応させて得られた本発明の液晶ポリマーは、通常、溶融状態で重合反応槽より抜き出された後に、ペレット状、フレーク状、または粉末状に加工される。 The liquid crystal polymer of the present invention obtained by polycondensation reaction in this manner is usually extracted from the polymerization reaction tank in a molten state and then processed into pellets, flakes, or powder.
ペレット状、フレーク状、または粉末状の液晶ポリマーは、分子量を高め耐熱性を向上させる目的などで、減圧下、真空下、または窒素、ヘリウムなどの不活性ガス雰囲気下において、実質的に固相状態で熱処理を行ってもよい。 Liquid crystal polymers in the form of pellets, flakes, or powders are made into a substantially solid state under reduced pressure, vacuum, or an inert gas atmosphere such as nitrogen or helium, in order to increase the molecular weight and improve heat resistance. Heat treatment may be performed in this state.
上記のようにして得られた、本発明の液晶ポリマーには、無機または有機充填材、以下に説明する他の添加剤、および他の樹脂成分から選択される一種以上を配合して、液晶ポリマー組成物としてもよい。 The liquid crystal polymer of the present invention obtained as described above is blended with one or more selected from inorganic or organic fillers, other additives explained below, and other resin components to form a liquid crystal polymer. It may also be used as a composition.
本発明の液晶ポリマーに配合してもよい無機または有機充填材は、繊維状、板状または粒状のものであってよく、たとえばガラス繊維、ミルドガラス、シリカアルミナ繊維、アルミナ繊維、炭素繊維、アラミド繊維、チタン酸カリウムウイスカ、ホウ酸アルミニウムウイスカ、ウォラストナイト、タルク、マイカ、グラファイト、炭酸カルシウム、ドロマイト、クレイ、ガラスフレーク、ガラスビーズ、硫酸バリウム、および酸化チタンが挙げられる。これらの中では、ガラス繊維が物性とコストのバランスが優れている点で好ましい。これらの充填材は、2種以上を併用してもよい。 The inorganic or organic filler that may be incorporated into the liquid crystal polymer of the present invention may be fibrous, plate-like or granular, such as glass fiber, milled glass, silica-alumina fiber, alumina fiber, carbon fiber, aramid. Fibers, potassium titanate whiskers, aluminum borate whiskers, wollastonite, talc, mica, graphite, calcium carbonate, dolomite, clay, glass flakes, glass beads, barium sulfate, and titanium oxide. Among these, glass fiber is preferable because it has an excellent balance between physical properties and cost. Two or more of these fillers may be used in combination.
本発明の液晶ポリマー組成物における、無機または有機充填材の合計量は、液晶ポリマー100質量部に対して、好ましくは1~200質量部、より好ましくは5~100質量部である。前記の無機または有機充填材の合計量が液晶ポリマー100質量部に対して200質量部を超える場合には、液晶ポリマー組成物の成形加工性が低下する傾向や、成形機のシリンダーや金型の磨耗が大きくなる傾向がある。 The total amount of inorganic or organic fillers in the liquid crystal polymer composition of the present invention is preferably 1 to 200 parts by weight, more preferably 5 to 100 parts by weight, based on 100 parts by weight of the liquid crystal polymer. If the total amount of the inorganic or organic filler exceeds 200 parts by mass based on 100 parts by mass of the liquid crystal polymer, the moldability of the liquid crystal polymer composition tends to decrease, and the moldability of the cylinder or mold of the molding machine tends to deteriorate. There is a tendency for increased wear.
本発明の液晶ポリマーには、本発明の効果を損なわない範囲で、他の添加剤、例えば高級脂肪酸、高級脂肪酸エステル、高級脂肪酸アミド、高級脂肪酸金属塩(ここで高級脂肪酸とは、通常、炭素原子数10~25のものをいう)、ポリシロキサン、フッ素樹脂などの離型改良剤;染料、顔料などの着色剤;酸化防止剤;熱安定剤;紫外線吸収剤;帯電防止剤;界面活性剤などを配合してもよい。これらの添加剤は1種のみを配合してもよく、または2種以上を組み合わせて配合してもよい。 The liquid crystal polymer of the present invention may contain other additives, such as higher fatty acids, higher fatty acid esters, higher fatty acid amides, higher fatty acid metal salts (here, higher fatty acids are usually carbon mold release improvers such as polysiloxanes and fluororesins; colorants such as dyes and pigments; antioxidants; heat stabilizers; ultraviolet absorbers; antistatic agents; surfactants etc. may also be blended. These additives may be used alone or in combination of two or more.
本発明の液晶ポリマー組成物における他の添加剤の合計量は、液晶ポリマー100質量部に対して、好ましくは0.1~10質量部、より好ましくは0.5~5質量部である。他の添加剤の合計量が液晶ポリマー100質量部に対して10質量部を超える場合には、液晶ポリマー組成物の成形加工性が低下する傾向や、熱安定性が悪くなる傾向がある。 The total amount of other additives in the liquid crystal polymer composition of the present invention is preferably 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight, based on 100 parts by weight of the liquid crystal polymer. If the total amount of other additives exceeds 10 parts by mass based on 100 parts by mass of the liquid crystal polymer, the moldability of the liquid crystal polymer composition tends to decrease and the thermal stability tends to deteriorate.
また、本発明の液晶ポリマーもしくは液晶ポリマー組成物を成形するに際し、上記他の添加剤のうち高級脂肪酸、高級脂肪酸エステル、高級脂肪酸金属塩、フルオロカーボン系界面活性剤等の外部滑剤効果を有する添加剤を、予め、液晶ポリマーのペレット表面に付着せしめてもよい。 In addition, when molding the liquid crystal polymer or liquid crystal polymer composition of the present invention, among the other additives mentioned above, additives having an external lubricant effect such as higher fatty acids, higher fatty acid esters, higher fatty acid metal salts, and fluorocarbon surfactants may be used. may be attached to the surface of the liquid crystal polymer pellet in advance.
本発明の液晶ポリマーは、他の樹脂成分を含有してもよい。他の樹脂成分としては、たとえばポリアミド、ポリエステル、ポリオレフィン、ポリアセタール、ポリフェニレンエーテル、およびその変性物、ならびにポリスルホン、ポリエーテルスルホン、ポリエーテルイミド、ポリアミドイミドなどの熱可塑性樹脂や、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂などの熱硬化性樹脂が挙げられる。他の樹脂成分は、単独で、または2種以上を組み合わせて配合することができる。他の樹脂成分の配合量は特に限定的ではなく、液晶ポリマーの用途や目的に応じて適宜定めればよい。一つの典型的な例において、他の樹脂成分の合計量は、液晶ポリマー100質量部に対して、通常0.1~100質量部、特に0.5~80質量部である。 The liquid crystal polymer of the present invention may contain other resin components. Examples of other resin components include polyamides, polyesters, polyolefins, polyacetals, polyphenylene ethers, and modified products thereof, thermoplastic resins such as polysulfone, polyethersulfone, polyetherimide, polyamideimide, phenolic resins, epoxy resins, Examples include thermosetting resins such as polyimide resins. Other resin components can be blended alone or in combination of two or more. The blending amount of other resin components is not particularly limited, and may be determined as appropriate depending on the use and purpose of the liquid crystal polymer. In one typical example, the total amount of other resin components is usually 0.1 to 100 parts by weight, particularly 0.5 to 80 parts by weight, based on 100 parts by weight of the liquid crystal polymer.
本発明の液晶ポリマーの溶融粘度は、キャピラリーレオメーターを用いて、せん断速度1000s-1の条件で測定した場合、好ましくは1~300Pa・s、より好ましくは5~100Pa・s、さらに好ましくは10~50Pa・sである。尚、溶融粘度が低いほど成形時の流動性に優れることを意味する。 The melt viscosity of the liquid crystal polymer of the present invention is preferably 1 to 300 Pa·s, more preferably 5 to 100 Pa·s, even more preferably 10 ~50 Pa・s. Note that the lower the melt viscosity, the better the fluidity during molding.
本発明の液晶ポリマーは、Izod衝撃強度が、好ましくは200J/m以上であり、機械強度に優れるものである。本発明の液晶ポリマーのIzod衝撃強度は、より好ましくは210J/m以上、さらに好ましくは220J/m以上、特に好ましくは240J/m以上である。Izod衝撃強度の上限値は特に限定されないが、通常620J/mである。 The liquid crystal polymer of the present invention preferably has an Izod impact strength of 200 J/m or more, and has excellent mechanical strength. The Izod impact strength of the liquid crystal polymer of the present invention is more preferably 210 J/m or more, still more preferably 220 J/m or more, particularly preferably 240 J/m or more. The upper limit of Izod impact strength is not particularly limited, but is usually 620 J/m.
本発明の液晶ポリマーは、ASTM4号ダンベル試験片を用いた引張強度試験において、引張強度は好ましくは190MPa以上、より好ましくは200MPa以上、さらに好ましくは210MPa以上である。引張強度の上限値は、特に限定されないが、例えば400MPaである。 The liquid crystal polymer of the present invention has a tensile strength of preferably 190 MPa or more, more preferably 200 MPa or more, and still more preferably 210 MPa or more in a tensile strength test using an ASTM No. 4 dumbbell test piece. The upper limit of the tensile strength is, for example, 400 MPa, although it is not particularly limited.
本発明の液晶ポリマーは、短冊状の試験片(長さ65mm、幅12.7mm、厚さ0.5mm)を用いた曲げ試験において、曲げ強度は好ましくは160MPa以上、より好ましくは165MPa以上、さらに好ましくは170MPa以上である。曲げ強度の上限値は、特に限定されないが、例えば400MPaである。 In a bending test using a strip-shaped test piece (length 65 mm, width 12.7 mm, thickness 0.5 mm), the liquid crystal polymer of the present invention has a bending strength of preferably 160 MPa or more, more preferably 165 MPa or more, and Preferably it is 170 MPa or more. The upper limit of the bending strength is, for example, 400 MPa, although it is not particularly limited.
本発明の液晶ポリマー組成物は、無機または有機充填材、他の添加剤および他の樹脂成分等を液晶ポリマー中に添加し、これをバンバリーミキサー、ニーダー、一軸もしくは二軸押出機などを用いて、液晶ポリマーの結晶融解温度近傍から結晶融解温度プラス100℃までの温度範囲で溶融混練して得ることができる。 The liquid crystal polymer composition of the present invention is produced by adding inorganic or organic fillers, other additives, other resin components, etc. to a liquid crystal polymer, and then using a Banbury mixer, kneader, single screw or twin screw extruder, etc. It can be obtained by melting and kneading in a temperature range from near the crystal melting temperature of the liquid crystal polymer to 100° C. above the crystal melting temperature.
このようにして得られた本発明の液晶ポリマーまたは液晶ポリマー組成物は、射出成形、圧縮成形、押出成形、ブロー成形など公知の加工方法によって成形品、フィルムまたは繊維などの物品に加工される。 The liquid crystal polymer or liquid crystal polymer composition of the present invention thus obtained is processed into articles such as molded articles, films, or fibers by known processing methods such as injection molding, compression molding, extrusion molding, and blow molding.
本発明の液晶ポリマーまたは液晶ポリマー組成物は、Izod衝撃強度等の機械強度が改善され、好適には機械物性に優れるため、電気・電子部品、機械機構部品、自動車部品等として特に有用である。 The liquid crystal polymer or liquid crystal polymer composition of the present invention has improved mechanical strength such as Izod impact strength, and preferably has excellent mechanical properties, and is therefore particularly useful as electrical/electronic parts, mechanical mechanism parts, automobile parts, etc.
以下、実施例により本発明を詳細に説明するが、本発明はこれらに限定されるものではない。 EXAMPLES Hereinafter, the present invention will be explained in detail with reference to Examples, but the present invention is not limited thereto.
実施例中の溶融粘度、引張強度、曲げ強度およびIzod衝撃強度は、以下に記載の方法で測定した。 Melt viscosity, tensile strength, bending strength and Izod impact strength in Examples were measured by the methods described below.
(1)溶融粘度
溶融粘度測定装置(東洋精機(株)製キャピログラフ1D)により、0.7mmφ×10mmのキャピラリーを用いて、剪断速度1000sec-1の条件下、350℃で測定した。
(1) Melt viscosity It was measured at 350° C. using a melt viscosity measuring device (Capillograph 1D manufactured by Toyo Seiki Co., Ltd.) using a 0.7 mmφ×10 mm capillary at a shear rate of 1000 sec −1 .
(2)引張強度
射出成形機(日精樹脂工業(株)製UH1000-110)を用いて、シリンダー設定温度350℃、金型温度70℃で、ASTM4号ダンベル試験片を成形し、これを用いてASTM D638に準拠して測定した。
(2) Tensile strength Using an injection molding machine (UH1000-110 manufactured by Nissei Jushi Kogyo Co., Ltd.), an ASTM No. 4 dumbbell test piece was molded at a cylinder temperature of 350°C and a mold temperature of 70°C. Measured according to ASTM D638.
(3)曲げ強度
型締め圧15tの射出成形機(住友重機械工業(株)製MINIMAT M26/15)を用いて、シリンダー設定温度350℃、金型温度70℃で射出成形し、短冊状試験片(長さ65mm×幅12.7mm×厚さ2.0mm)を作製した。曲げ試験は、3点曲げ試験をINSTRON5567(インストロンジャパンカンパニイリミティッド社製万能試験機)を用いて、ASTM D790に準拠し、スパン間距離40.0mm、圧縮速度1.3mm/分で行った。
(3) Bending strength Injection molding was performed using an injection molding machine (MINIMAT M26/15 manufactured by Sumitomo Heavy Industries, Ltd.) with a mold clamping pressure of 15 tons at a cylinder temperature setting of 350°C and a mold temperature of 70°C, and a strip test was performed. A piece (length 65 mm x width 12.7 mm x thickness 2.0 mm) was produced. The bending test was a three-point bending test using INSTRON 5567 (a universal testing machine manufactured by Instron Japan Company Limited) in accordance with ASTM D790, with a span distance of 40.0 mm and a compression speed of 1.3 mm/min.
(4)Izod衝撃強度
射出成形機(日精樹脂工業(株)製UH1000-110)を用いて、シリンダー設定温度350℃、金型温度70℃で、長さ127.0mm、幅12.7mm、厚さ3.2mmの短冊状試験片を成形した。この試験片の中央を長さ方向と垂直に切断し、長さ63.5mm、幅12.7mm、厚さ3.2mmの短冊状試験片を得、ASTM D256に準拠して測定した。
(4) Izod impact strength Using an injection molding machine (UH1000-110 manufactured by Nissei Jushi Kogyo Co., Ltd.), the cylinder temperature was set at 350°C, the mold temperature was 70°C, and the length was 127.0 mm, the width was 12.7 mm, and the thickness was 127.0 mm. A rectangular test piece with a length of 3.2 mm was molded. The center of this test piece was cut perpendicularly to the length direction to obtain a strip-shaped test piece with a length of 63.5 mm, a width of 12.7 mm, and a thickness of 3.2 mm, and measurements were made in accordance with ASTM D256.
実施例において、下記の略号は以下の化合物を示す。
POB:4-ヒドロキシ安息香酸
BON6:6-ヒドロキシ-2-ナフトエ酸
In the Examples, the following abbreviations indicate the following compounds.
POB: 4-hydroxybenzoic acid BON6: 6-hydroxy-2-naphthoic acid
また、式(1)で表される化合物(重合性化合物)として、以下のものを用いた。
A1:HOOC-(CH2)8-COOH(セバシン酸)
A2:HOOC-(CH2)4-COOH(アジピン酸)
A3:HOOC-(CH2)10-COOH(ドデカン二酸)
Furthermore, the following compounds were used as the compounds (polymerizable compounds) represented by formula (1).
A1: HOOC-(CH 2 ) 8 -COOH (sebacic acid)
A2: HOOC-(CH 2 ) 4 -COOH (adipic acid)
A3: HOOC-(CH 2 ) 10 -COOH (dodecanedioic acid)
[実施例1]
トルクメーター付き攪拌装置および留出管を備えた反応容器に下記化合物を仕込み、さらに全単量体の水酸基量(モル)に対して1.03倍モルの無水酢酸を仕込み、次の条件で脱酢酸重合を行った。
セバシン酸:13.1g(1.0モル%)
POB:213.7g(23.8モル%)
BON6:919.8g(75.2モル%)
[Example 1]
The following compounds were charged into a reaction vessel equipped with a stirring device equipped with a torque meter and a distillation tube, and acetic anhydride was added in an amount of 1.03 times the hydroxyl group amount (mol) of all monomers, and decomposition was carried out under the following conditions. Acetic acid polymerization was performed.
Sebacic acid: 13.1g (1.0 mol%)
POB: 213.7g (23.8 mol%)
BON6: 919.8g (75.2 mol%)
窒素ガス雰囲気下に室温から150℃まで1時間で昇温し、同温度にて30分間保持した。次いで、副生する酢酸を留去しながら210℃まで速やかに昇温し、同温度にて30分間保持した。その後、350℃まで4時間かけて昇温した後、80分かけて10mmHgにまで減圧した。所定のトルクを示した時点で重合反応を終了し、反応容器内容物を取り出し、粉砕機により液晶ポリマーのペレットを得た。重合時の留出酢酸量は、ほぼ理論値どおりであった。得られたペレットを用いて上記の方法により溶融粘度、引張強度、曲げ強度およびIzod衝撃強度を測定した。結果を表1に示す。 The temperature was raised from room temperature to 150° C. in 1 hour under a nitrogen gas atmosphere, and maintained at the same temperature for 30 minutes. Next, the temperature was rapidly raised to 210° C. while distilling off the by-produced acetic acid, and the temperature was maintained at the same temperature for 30 minutes. Thereafter, the temperature was raised to 350° C. over 4 hours, and then the pressure was reduced to 10 mmHg over 80 minutes. The polymerization reaction was terminated when a predetermined torque was exhibited, the contents of the reaction vessel were taken out, and pellets of liquid crystal polymer were obtained using a pulverizer. The amount of acetic acid distilled during the polymerization was almost the same as the theoretical value. Using the obtained pellets, melt viscosity, tensile strength, bending strength and Izod impact strength were measured by the above methods. The results are shown in Table 1.
[実施例2~5、比較例1~2]
式(1)で表される化合物(重合性化合物)、POBおよびBON6を表1に示す割合(モル%)となるように用いたこと以外は実施例1と同様にして、液晶ポリマーのペレットを得た。得られたペレットを用いて上記の方法により溶融粘度、引張強度、曲げ強度およびIzod衝撃強度を測定した。結果を表1に示す。
[Examples 2-5, Comparative Examples 1-2]
Liquid crystal polymer pellets were prepared in the same manner as in Example 1, except that the compound represented by formula (1) (polymerizable compound), POB and BON6 were used in the proportions (mol%) shown in Table 1. Obtained. Using the obtained pellets, melt viscosity, tensile strength, bending strength and Izod impact strength were measured by the above methods. The results are shown in Table 1.
表1に示すように、特定の脂肪族ジカルボン酸を含有する本発明の液晶ポリマー(実施例1~5)は、それらを含有しない液晶ポリマー(比較例1)とそれぞれ比較して、引張強度、曲げ強度およびIzod衝撃強度等の機械特性が改善され、機械強度に優れることが理解される。 As shown in Table 1, the liquid crystal polymers of the present invention containing specific aliphatic dicarboxylic acids (Examples 1 to 5) have higher tensile strength and It is understood that the mechanical properties such as bending strength and Izod impact strength are improved and the mechanical strength is excellent.
Claims (5)
HOOC-(CH2)n-COOH ・・・式(1)
[式中、nは4~18の整数である]
で表される化合物ならびにそれらの反応性誘導体からなる群から選択される1種以上の重合性化合物に由来する構成単位(A)、4-ヒドロキシ安息香酸に由来する構成単位(B)および6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(C)から構成される液晶ポリマーであって、液晶ポリマーを構成する全構成単位100モル%に対して、構成単位(A)が0.01~7モル%、構成単位(B)が15~36モル%、構成単位(C)が60~82モル%である、液晶ポリマー。 Formula (1)
HOOC-(CH 2 ) n -COOH...Formula (1)
[In the formula, n is an integer from 4 to 18]
The structural unit (A) derived from one or more polymerizable compounds selected from the group consisting of the compounds represented by and their reactive derivatives, the structural unit (B) derived from 4-hydroxybenzoic acid, and the 6- A liquid crystal polymer composed of a structural unit (C) derived from hydroxy-2-naphthoic acid, in which the structural unit (A) is 0.01 to 7% based on 100 mol% of the total structural units constituting the liquid crystal polymer. A liquid crystal polymer comprising 15 to 36 mol% of the structural unit (B) and 60 to 82 mol% of the structural unit (C).
HOOC-(CH2)8-COOH ・・・式(2)
で表される化合物である、請求項1に記載の液晶ポリマー。 The compound represented by formula (1) is represented by formula (2)
HOOC-(CH 2 ) 8 -COOH...Formula (2)
The liquid crystal polymer according to claim 1, which is a compound represented by:
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