JP7440780B2 - Light emitting device and surface emitting device using the light emitting device - Google Patents

Light emitting device and surface emitting device using the light emitting device Download PDF

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JP7440780B2
JP7440780B2 JP2021198230A JP2021198230A JP7440780B2 JP 7440780 B2 JP7440780 B2 JP 7440780B2 JP 2021198230 A JP2021198230 A JP 2021198230A JP 2021198230 A JP2021198230 A JP 2021198230A JP 7440780 B2 JP7440780 B2 JP 7440780B2
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light emitting
light
emitting device
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light source
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JP2022031318A (en
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浩一 山本
剛 田村
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Nichia Corp
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Nichia Corp
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本開示は、発光装置及び発光装置を用いた面発光装置に関する。 The present disclosure relates to a light emitting device and a surface emitting device using the light emitting device.

液晶テレビ等に用いられる直下方式のバックライトとして、例えば特許文献1のような面発光装置が知られている。
特許文献1に開示される発光装置は、複数の光源の周囲に周壁を有し、マトリックス状に配置された枠体を有している。これにより、発光エリアを分割してエリア外への光の漏れを防止しつつ、光源ごとに発光量を制御して複数のエリア内でのコントラスト比を高めるローカルディミングを可能としている。
2. Description of the Related Art As a direct type backlight used in liquid crystal televisions and the like, a surface emitting device as disclosed in Patent Document 1, for example, is known.
The light emitting device disclosed in Patent Document 1 has a peripheral wall around a plurality of light sources and a frame arranged in a matrix. This makes it possible to divide the light emitting area and prevent light from leaking outside the area, while controlling the amount of light emitted by each light source and performing local dimming to increase the contrast ratio within multiple areas.

特開2013-25945号公報JP2013-25945A

しかしながら、光源から発生する熱によって枠体が膨張し、枠体が変形するおそれがあった。 However, there was a risk that the frame would expand and deform due to the heat generated from the light source.

本発明に係る実施形態は、枠体の変形を抑制することが可能な発光装置及びそれを用いた面発光装置を提供する。 Embodiments of the present invention provide a light emitting device that can suppress deformation of a frame and a surface light emitting device using the same.

本実施形態に係る発光装置は、複数の光源が配置された基板と、前記光源が配置される第1開口を有する第1平面部と前記第1平面部を囲む第1壁部とを有する第1凹部を複数備える第1反射部材と、前記光源が配置される第2開口を有する第2平面部と前記第2平面部を囲む第2壁部とを有する第2凹部を複数備える第2反射部材と、前記第1反射部材と前記第2反射部材との間に配置され、前記第1壁部の一部と前記第2壁部の一部とを覆う被覆部材と、を備える。 The light emitting device according to the present embodiment includes a substrate on which a plurality of light sources are arranged, a first plane part having a first opening in which the light sources are arranged, and a first wall part surrounding the first plane part. a first reflecting member having a plurality of recesses; a second reflection member having a plurality of second recesses having a second plane portion having a second opening in which the light source is disposed; and a second wall portion surrounding the second plane portion; and a covering member disposed between the first reflecting member and the second reflecting member and covering a part of the first wall part and a part of the second wall part.

本発明に係る実施形態によれば、枠体の変形を抑制することが可能な発光装置及びそれを用いた面発光装置を提供することができる。 According to embodiments of the present invention, it is possible to provide a light emitting device that can suppress deformation of a frame and a surface emitting device using the same.

本発明の実施形態に係る発光装置の全体構成を示す分解図である。1 is an exploded view showing the overall configuration of a light emitting device according to an embodiment of the present invention. 本発明の実施形態に係る発光装置及び面発光装置の一部を示す断面図である。1 is a cross-sectional view showing a part of a light emitting device and a surface emitting device according to an embodiment of the present invention. 本発明の実施形態に係る光源の一例を示す断面図である。FIG. 1 is a cross-sectional view showing an example of a light source according to an embodiment of the present invention. 本発明の実施形態に係る光源の一例を示す断面図である。FIG. 1 is a cross-sectional view showing an example of a light source according to an embodiment of the present invention. 本発明の実施形態に係る光源の一例を示す断面図である。FIG. 1 is a cross-sectional view showing an example of a light source according to an embodiment of the present invention. 図6(A)は本発明の実施形態に係る反射部材の一例を示す上面図であり、図6(B)は図6(A)のA-A線断面図である。FIG. 6(A) is a top view showing an example of a reflective member according to an embodiment of the present invention, and FIG. 6(B) is a sectional view taken along the line AA in FIG. 6(A). 本発明の実施形態に係る反射部材の一例を示す上面図である。FIG. 2 is a top view showing an example of a reflective member according to an embodiment of the present invention.

以下、本開示の実施形態について図面を参照して説明する。ただし、以下に説明する発光装置または面光源装置は、本開示の技術思想を具体化するためのものであって、特定的な記載がない限り、本開示を以下のものに限定しない。また、一の実施の形態、実施例において説明する内容は、他の実施の形態、実施例にも適用可能である。 Embodiments of the present disclosure will be described below with reference to the drawings. However, the light emitting device or surface light source device described below is for embodying the technical idea of the present disclosure, and the present disclosure is not limited to the following unless specifically stated. Furthermore, the content described in one embodiment or example is also applicable to other embodiments or examples.

本発明の実施形態に係る発光装置について、図1を参照しながら説明する。
図1は発光装置の全体構成を示す分解図である。本発明の実施形態に係る発光装置は、複数の光源103が配置された基板120と、第1反射部材110Aと、第2反射部材110Bと、第1反射部材110Aと第2反射部材110Bとの間に配置される被覆部材200を有する。
A light emitting device according to an embodiment of the present invention will be described with reference to FIG.
FIG. 1 is an exploded view showing the overall configuration of a light emitting device. The light emitting device according to the embodiment of the present invention includes a substrate 120 on which a plurality of light sources 103 are arranged, a first reflecting member 110A, a second reflecting member 110B, and a first reflecting member 110A and a second reflecting member 110B. It has a covering member 200 disposed therebetween.

第1反射部材110Aは、第1開口104Aが形成された第1平面部106A及び第1開口104Aを取り囲む第1壁部105Aを有する第1凹部102Aを複数備えている。また、第2反射部材110Bは、第1反射部材110Aと同様に、第2開口104Bが形成された第2平面部106B及び第2開口104Bを取り囲む第2壁部105Bを有する第2凹部102Bを複数備えている。 The first reflecting member 110A includes a plurality of first recesses 102A each having a first plane portion 106A in which a first opening 104A is formed and a first wall portion 105A surrounding the first opening 104A. Further, like the first reflecting member 110A, the second reflecting member 110B has a second recessed portion 102B having a second flat portion 106B in which the second opening 104B is formed and a second wall portion 105B surrounding the second opening 104B. It has several.

第1開口104A及び第2開口104Bが、基板120上に配置された複数の光源103のそれぞれを露出するように、基板120の上に第1反射部材110A及び第2反射部材110Bが配置される。図2に示すように、第1開口104A、第2開口104Bを下側から貫通するように光源103を配置することで、光源103の上面が第1平面部106A及び第2平面部106Bの上面よりも高い位置に配置される。これにより、光源103から出射される光を第1壁部105A及び第2壁部105Bによって効率よく反射させることができる。 A first reflecting member 110A and a second reflecting member 110B are arranged on the substrate 120 such that the first opening 104A and the second opening 104B expose each of the plurality of light sources 103 arranged on the substrate 120. . As shown in FIG. 2, by arranging the light source 103 so as to penetrate the first opening 104A and the second opening 104B from below, the upper surface of the light source 103 becomes the upper surface of the first flat section 106A and the second flat section 106B. placed at a higher position. Thereby, the light emitted from the light source 103 can be efficiently reflected by the first wall portion 105A and the second wall portion 105B.

第1開口104A及び第2開口104Bは、第1平面部106A及び第2平面部106Bの略中心に略円形で形成されている。開口の形状及び大きさは、光源103の全部が露出される形状及び大きさであって、光源からの光を第1平面部106A及び第2平面部106Bで反射可能なように、光源103近傍のみに形成されることが好ましい。 The first opening 104A and the second opening 104B are formed in a substantially circular shape approximately at the center of the first plane part 106A and the second plane part 106B. The shape and size of the opening are such that the entire light source 103 is exposed, and the opening is such that the light source 103 is exposed in the vicinity of the light source 103 so that the light from the light source can be reflected by the first plane part 106A and the second plane part 106B. It is preferable to form only one.

光源103としては、LED等の半導体発光素子を好適に用いることができる。複数の光源103は、所定間隔で基板120上に配置される。図1では、光源103は行列状に等間隔に配置されている。また、第1凹部102A及び第2凹部102Bは、マトリックス状に配列されている。なお、マトリックス状とは、X方向(横方向ともいう)及びY方向(縦方向ともいう)に格子状に配列された状態をいう。 As the light source 103, a semiconductor light emitting element such as an LED can be suitably used. The plurality of light sources 103 are arranged on the substrate 120 at predetermined intervals. In FIG. 1, the light sources 103 are arranged in a matrix at equal intervals. Further, the first recess 102A and the second recess 102B are arranged in a matrix. Note that the matrix shape refers to a state where the elements are arranged in a grid pattern in the X direction (also referred to as the horizontal direction) and the Y direction (also referred to as the vertical direction).

第1反射部材110A及び第2反射部材110Bは、酸化チタン、酸化アルミニウム、酸化ケイ素等の金属酸化物粒子からなる反射材を含有する樹脂を用いて成形してもよいし、反射材を含有しない樹脂を用いて成形した後、表面に反射材を設けてもよい。光源103からの出射光に対する反射率が440nm~630nmの領域で平均70%以上となるように設定されることが好ましい。 The first reflective member 110A and the second reflective member 110B may be molded using a resin containing a reflective material made of metal oxide particles such as titanium oxide, aluminum oxide, silicon oxide, etc., or may not contain a reflective material. After molding using resin, a reflective material may be provided on the surface. It is preferable that the reflectance of the light emitted from the light source 103 is set to be 70% or more on average in the range of 440 nm to 630 nm.

第1反射部材110A及び第2反射部材110Bの成形方法としては、金型を用いた成形や光造形による成形方法が挙げられる。金型を用いた成形方法としては、射出成形、押出成形、圧縮成形、真空成形、圧空成形、プレス成形等の成形方法を適用することができる。例えば、PET等で形成された反射シートを用いて真空成形することで、第1平面部106Aと第1壁部105Aが一体的に形成された第1反射部材110Aを得ることができる。同様に、第2平面部106Bと第2壁部105Bが一体的に形成された2反射部材110Bを得ることもできる。反射シートの厚みは、例えば100~300μmである。 Examples of the method for molding the first reflective member 110A and the second reflective member 110B include molding using a mold and stereolithography. As a molding method using a mold, injection molding, extrusion molding, compression molding, vacuum molding, pressure molding, press molding, and the like can be applied. For example, by vacuum forming a reflective sheet made of PET or the like, it is possible to obtain the first reflective member 110A in which the first plane portion 106A and the first wall portion 105A are integrally formed. Similarly, it is also possible to obtain a two-reflection member 110B in which the second plane portion 106B and the second wall portion 105B are integrally formed. The thickness of the reflective sheet is, for example, 100 to 300 μm.

第1開口104A及び第2開口104Bから露出された光源103を取り囲むように形成される第1壁部105A及び第2壁部105Bは、第1平面部106A及び第2平面部106Bの上面に対して垂直方向(図2のZ方向)に離れるほど広がるように傾斜した面を有することが好ましい。 A first wall portion 105A and a second wall portion 105B formed to surround the light source 103 exposed from the first opening 104A and the second opening 104B are arranged with respect to the upper surfaces of the first plane portion 106A and the second plane portion 106B. It is preferable to have an inclined surface that widens as the distance increases in the vertical direction (Z direction in FIG. 2).

図1に示す例では、1つの基板120に対して第1反射部材110Aと第2反射部材110Bの組み合わせを複数用いて反射部材が形成されている。図2に示すように、第1反射部材110Aと第2反射部材110Bの間には、隙間107が形成されている。隙間107を有することにより、光源103から発生する熱によって第1反射部材110A及び第2反射部材110Bが膨張しても、隙間107によって水平方向(X及びY方向)への膨張を吸収することで、第1反射部材110A及び第2反射部材110Bの変形を抑制することができる。 In the example shown in FIG. 1, a reflective member is formed using a plurality of combinations of the first reflective member 110A and the second reflective member 110B on one substrate 120. As shown in FIG. 2, a gap 107 is formed between the first reflective member 110A and the second reflective member 110B. By having the gap 107, even if the first reflecting member 110A and the second reflecting member 110B expand due to the heat generated from the light source 103, the gap 107 absorbs the expansion in the horizontal direction (X and Y directions). , deformation of the first reflecting member 110A and the second reflecting member 110B can be suppressed.

例えば、第1反射部材110A及び第2反射部材110Bが基板120に固定されていることで、基板120の水平方向への膨張を阻害され、逃げ場を失った応力によって第1反射部材110A及び第2反射部材110Bが、基板120から浮くようにして反ってしまう。このような反りは、基板120及び第1反射部材110A及び第2反射部材110Bが筐体に配置され、熱膨張した第1反射部材110A及び第2反射部材110Bと筐体とが干渉する場合には、より顕著になる。 For example, since the first reflecting member 110A and the second reflecting member 110B are fixed to the substrate 120, the expansion of the substrate 120 in the horizontal direction is inhibited, and stress with no escape causes the first reflecting member 110A and the second reflecting member 110B to The reflective member 110B is warped and floats off the substrate 120. Such warping occurs when the substrate 120, the first reflecting member 110A, and the second reflecting member 110B are arranged in a casing, and the thermally expanded first reflecting member 110A and second reflecting member 110B interfere with the casing. becomes more prominent.

図1の例では、1つの基板120上に光源103が、X方向に6個、Y方向に4個の合計24個、一定の間隔で配置されている。第1反射部材110Aは、それぞれの光源103に対応した6個の第1開口104Aを有する。第2反射部材110Bは、それぞれの光源103に対応した6個の第2開口104Bを有する。なお、図1の例ではさらにもう一組の第1反射部材110Aと第2反射部材110Bを有している。このように、発光装置は第1反射部材110A及び第2反射部材110Bを複数組有していてもよい。隣接する第1反射部材110Aと第2反射部材110Bの間には、被覆部材200が配置される。 In the example of FIG. 1, a total of 24 light sources 103, six in the X direction and four in the Y direction, are arranged at regular intervals on one substrate 120. The first reflecting member 110A has six first openings 104A corresponding to the respective light sources 103. The second reflective member 110B has six second openings 104B corresponding to the respective light sources 103. In addition, the example of FIG. 1 further includes another set of the first reflecting member 110A and the second reflecting member 110B. In this way, the light emitting device may include a plurality of sets of the first reflecting member 110A and the second reflecting member 110B. A covering member 200 is arranged between the first reflecting member 110A and the second reflecting member 110B which are adjacent to each other.

図2に示すように、第1平面部106A及び第2平面部106Bの下面と基板120の上面は、接着部材111で固定される。光源103からの出射光が、基板120と第1反射部材110A及び第2反射部材110Bとの間に入射しないように、第1開口104A及び第2開口104Bの周囲を、設けた接着部材111で固定することが好ましい。例えば、開口に沿ってリング状に接着部材111を配置することが好ましい。接着部材111は両面テープであってもよいし、ホットメルト型の接着シートであってもよいし、熱硬化樹脂や熱可塑樹脂の接着液であってもよい。これらの接着部材は、高い難燃性を有することが好ましい。また、接着剤ではなく、ネジ止めで固定されていてもよい。隙間107の近傍においては第1反射部材110A及び第2反射部材110Bの膨張を吸収できるように、基板120と、第1反射部材110A及び第2反射部材110Bとは固定されていないことが好ましい。 As shown in FIG. 2, the lower surfaces of the first plane part 106A and the second plane part 106B and the upper surface of the substrate 120 are fixed with an adhesive member 111. An adhesive member 111 is provided around the first opening 104A and the second opening 104B so that the light emitted from the light source 103 does not enter between the substrate 120 and the first reflecting member 110A and the second reflecting member 110B. Preferably, it is fixed. For example, it is preferable to arrange the adhesive member 111 in a ring shape along the opening. The adhesive member 111 may be a double-sided tape, a hot-melt adhesive sheet, or an adhesive liquid made of thermosetting resin or thermoplastic resin. These adhesive members preferably have high flame retardancy. Further, it may be fixed with screws instead of adhesive. In the vicinity of the gap 107, it is preferable that the substrate 120 and the first reflecting member 110A and the second reflecting member 110B are not fixed so that the expansion of the first reflecting member 110A and the second reflecting member 110B can be absorbed.

被覆部材200は、図2に示すように、隙間107と隙間107近傍の第1壁部105A及び第2壁部105Bの一部を被覆するように設けられる。これにより、反射部材の存在しない箇所を塞いで隣接する第1反射部材及び第2反射部材を連結し、光取り出し効率の低下を抑制することができる。よって、被覆部材200は第1反射部材110A及び第2反射部材110Bと同様に、光を反射することができる部材で形成されていることが好ましい。また、隙間107が形成されている領域のうち全ての領域が、被覆部材200で被覆されていることが好ましい。 As shown in FIG. 2, the covering member 200 is provided to cover the gap 107 and a portion of the first wall portion 105A and the second wall portion 105B near the gap 107. Thereby, it is possible to close a portion where no reflective member is present and connect the adjacent first reflective member and second reflective member, thereby suppressing a decrease in light extraction efficiency. Therefore, like the first reflecting member 110A and the second reflecting member 110B, the covering member 200 is preferably formed of a member that can reflect light. Further, it is preferable that all the regions in which the gaps 107 are formed are covered with the covering member 200.

被覆部材200で被覆される第1壁部105A及び第2壁部105Bは、被覆部材200で被覆されていない他の第1壁部及び第2壁部よりも高さが低く、あるいは第1壁部105A及び第2壁部105Bの傾斜面の面積が小さく形成されている。これにより、隣接する第1反射部材110Aと第2反射部材110Bの繋ぎ目部分に隙間を形成することができる。 The first wall portion 105A and the second wall portion 105B covered with the covering member 200 are lower in height than the other first wall portions and second wall portions that are not covered with the covering member 200, or are lower in height than the first wall portions and the second wall portions that are covered with the covering member 200. The areas of the inclined surfaces of the portion 105A and the second wall portion 105B are formed to be small. Thereby, a gap can be formed at the joint between the adjacent first reflecting member 110A and second reflecting member 110B.

被覆部材200は、図2に示すように第1壁部105A及び第2壁部105Bの傾斜面に沿って傾斜した被覆面201を有し、被覆面201で第1壁部105A及び第2壁部105Bを上側から押さえるようにして隙間107を被覆している。 As shown in FIG. 2, the covering member 200 has a covering surface 201 that is inclined along the inclined surfaces of the first wall section 105A and the second wall section 105B. The gap 107 is covered by pressing the portion 105B from above.

断面視において、被覆部材200に被覆されない第1壁部105Aと、第1平面106Aとのなす角度θ1は、被覆部材200に被覆される第1壁部105Aと、第1平面106Aとのなす角度θ2よりも大きい角度になるように設定することが好ましい。これにより、第1反射部材110Aが膨張または収縮して動く際に、被覆面201の内面に沿って動かすことができる。第2反射部材110Bについても同様に、被覆部材200に被覆されない第2壁部と、第2平面とのなす角度は、被覆部材200に被覆される第2壁部と、第2平面とのなす角度よりも大きい角度になるように設定することが好ましい。ここで被覆面201とは、第1壁部105A及び第2壁部105B並びに隙間107を被覆している面をいい、第1壁部及び第2壁部と接している内面部分並びに第1壁部及び第2壁部の傾斜面と連なって反射面を構成する外面部分の双方を含むものとする。 In cross-sectional view, the angle θ1 between the first wall portion 105A not covered by the covering member 200 and the first plane 106A is the angle θ1 formed between the first wall portion 105A covered by the covering member 200 and the first plane 106A. It is preferable to set the angle to be larger than θ2. Thereby, when the first reflecting member 110A expands or contracts and moves, it can be moved along the inner surface of the covering surface 201. Similarly, for the second reflective member 110B, the angle formed between the second wall portion not covered by the covering member 200 and the second plane is the same as the angle formed between the second wall portion covered by the covering member 200 and the second plane. It is preferable to set the angle to be larger than the angle. Here, the covering surface 201 refers to a surface that covers the first wall 105A, the second wall 105B, and the gap 107, and includes the inner surface that is in contact with the first wall and the second wall, and the first wall. and an outer surface portion that is continuous with the inclined surface of the second wall portion and constitutes a reflective surface.

被覆部材200の被覆面201は、平面視で十字形状に形成されていることが好ましい。この被覆部材200の十字の交点と、隣接する壁部の頂辺の交点とを一致させ、第1壁部及び第2壁部を被覆部材200で被覆する。被覆部材の十字の交点に、後述する軸部160及び凸部164が形成されていてもよい。 It is preferable that the covering surface 201 of the covering member 200 is formed in a cross shape in plan view. The intersection of the cross of this covering member 200 and the intersection of the top sides of adjacent wall parts are made to match, and the first wall part and the second wall part are covered with the covering member 200. A shaft portion 160 and a convex portion 164, which will be described later, may be formed at the intersection of the crosses of the covering member.

また、被覆部材200は、一組の第1反射部材110A及び第2反射部材110Bに対し、複数用いられていてもよい。例えば、隣接する被覆部材200は、その端部で互いにX方向またはY方向に重なっていてもよいし、X方向とY方向に交差されて重なっていてもよい。 Further, a plurality of covering members 200 may be used for a set of the first reflecting member 110A and the second reflecting member 110B. For example, adjacent covering members 200 may overlap each other at their ends in the X direction or the Y direction, or may intersect and overlap in the X direction and the Y direction.

被覆部材200は、基板120に固定されていることが好ましい。図2に示す例では、被覆部材200が軸部160を有しており、軸部160の上方に、軸部を中心にして上方から下方に向かって広がるようなテーパー面となる被覆面201が形成されている。 Preferably, the covering member 200 is fixed to the substrate 120. In the example shown in FIG. 2, the covering member 200 has a shaft portion 160, and above the shaft portion 160 there is a covering surface 201 that is a tapered surface that widens from above to below with the shaft portion as the center. It is formed.

図2に示すように、軸部160は、基板120及び基板120の下に配置されるバックシャーシ170等に形成された貫通穴に差込まれている。軸部160には、軸部160よりも径の大きい抜け止め部162を有している。これにより、基板120の貫通穴及びバックシャーシ170の貫通穴に差込んだ軸部160が、所定の高さで止まるようになっている。このように差込まれた軸部160を下側から、かしめ加工することによって、被覆部材200と基板120とが固定される。 As shown in FIG. 2, the shaft portion 160 is inserted into a through hole formed in the substrate 120, a back chassis 170, etc. arranged under the substrate 120. The shaft portion 160 has a retaining portion 162 having a larger diameter than the shaft portion 160 . Thereby, the shaft portion 160 inserted into the through hole of the board 120 and the through hole of the back chassis 170 is stopped at a predetermined height. The covering member 200 and the substrate 120 are fixed by caulking the shaft portion 160 inserted in this manner from below.

また、被覆部材200は、かしめ加工された側とは反対側に、被覆面201の上面よりも上側に突出した凸部164を有している。この凸部164は、発光装置の上方に配置される部材を支持する支持部材として機能させることができる。例えば、光源103からの光を拡散させる拡散板を配置する場合、複数の凸部164を用いて拡散板を支持することができる。 Further, the covering member 200 has a convex portion 164 that projects above the upper surface of the covering surface 201 on the side opposite to the crimped side. This convex portion 164 can function as a support member that supports a member placed above the light emitting device. For example, when disposing a diffuser plate that diffuses light from the light source 103, the plurality of convex portions 164 can be used to support the diffuser plate.

光源103から出射された光は、第1壁部105A及び第2壁部105B並びに被覆部材の被覆面201の外面により反射されて発光装置の上方に取り出される。光源103の配光特性は、どのようなものであってもよいが、第1壁部105A及び第2壁部で囲まれた1つ1つの領域を輝度ムラ少なく光らせるために、広配光であることが好ましい。 The light emitted from the light source 103 is reflected by the first wall portion 105A, the second wall portion 105B, and the outer surface of the covering surface 201 of the covering member, and is extracted above the light emitting device. The light distribution characteristics of the light source 103 may be of any type, but in order to illuminate each area surrounded by the first wall portion 105A and the second wall portion with less uneven brightness, the light source 103 should have a wide light distribution. It is preferable that there be.

特に、光源103のそれぞれがバットウイング型の配光特性を有していることが好ましい。これにより光源103の真上方向に出射される光量を抑制して、各々の光源の配光を広げ、広げた光を第1平面部106A及び第2平面部106B並びに第1壁部105A及び第2壁部105Bに照射することで、第1壁部105A及び第2壁部105Bで囲まれた1つ1つの領域における輝度ムラを抑制することができる。 In particular, it is preferable that each of the light sources 103 has a batwing type light distribution characteristic. As a result, the amount of light emitted directly above the light source 103 is suppressed, the light distribution of each light source is expanded, and the expanded light is transmitted to the first plane part 106A, the second plane part 106B, the first wall part 105A, and the first wall part 105A. By irradiating the second wall portion 105B, it is possible to suppress uneven brightness in each area surrounded by the first wall portion 105A and the second wall portion 105B.

ここでバットウイング型の配光特性とは、光軸Lを0°として、0°よりも配光角の絶対値が大きい角度において発光強度が強い発光強度分布で定義される。なお、光軸Lとは、図3に示すように、光源103の中心を通り、基板120の平面上の線と垂直に交わる線で定義されるものとする。 Here, the batwing type light distribution characteristic is defined as a light emission intensity distribution where the light emission intensity is strong at angles where the absolute value of the light distribution angle is larger than 0°, with the optical axis L being 0°. Note that the optical axis L is defined as a line passing through the center of the light source 103 and perpendicular to a line on the plane of the substrate 120, as shown in FIG.

バットウイング型の配光特性を有する光源103としては、例えば図3に示すように、上面に光反射膜122を有する発光素子108を、封止部材124で被覆した光源を用いることができる。発光素子108の上面に形成される光反射膜122は、金属膜であってもよく、誘電体多層膜(DBR膜)であってもよい。これにより、発光素子108の上方向への光は光反射膜122で反射され、発光素子108の直上の光量が抑制され、バットウイング型の配光特性とすることができる。光反射膜122を発光素子108に直接形成することができるため、バットウイングレンズが不要となり、光源103の厚みを薄くすることが可能である。 As the light source 103 having batwing type light distribution characteristics, for example, as shown in FIG. 3, a light source in which a light emitting element 108 having a light reflecting film 122 on the upper surface is covered with a sealing member 124 can be used. The light reflecting film 122 formed on the upper surface of the light emitting element 108 may be a metal film or a dielectric multilayer film (DBR film). As a result, light directed upward from the light emitting element 108 is reflected by the light reflecting film 122, the amount of light directly above the light emitting element 108 is suppressed, and a batwing type light distribution characteristic can be achieved. Since the light reflecting film 122 can be formed directly on the light emitting element 108, a batwing lens is not required, and the thickness of the light source 103 can be reduced.

例えば、基板120に直接実装された発光素子108の高さは100~500μmであり、光反射膜122の厚みは0.1~3.0μmである。後述する封止部材124を含めても、光源103の厚みは0.5~2.0mm程度とすることができる。このような光源103と組み合わせる第1反射部材110A、第2反射部材110Bの高さは、8.0mm以下、より薄型の発光装置とする場合は1.0~4.0mm程度であることが好ましく、拡散板130までの距離を8.0mm程度以下、より薄型の発光装置とする場合は2.0~4.0mm程度とすることが好ましい。これにより、拡散板130等の光学部材を含めたバックライトユニットを極めて薄型にすることができる。 For example, the height of the light emitting element 108 directly mounted on the substrate 120 is 100 to 500 μm, and the thickness of the light reflecting film 122 is 0.1 to 3.0 μm. Even including a sealing member 124 to be described later, the thickness of the light source 103 can be approximately 0.5 to 2.0 mm. The height of the first reflecting member 110A and the second reflecting member 110B combined with such a light source 103 is preferably 8.0 mm or less, and in the case of a thinner light emitting device, it is preferably about 1.0 to 4.0 mm. The distance to the diffuser plate 130 is preferably about 8.0 mm or less, and in the case of a thinner light emitting device, it is preferably about 2.0 to 4.0 mm. Thereby, the backlight unit including optical members such as the diffuser plate 130 can be made extremely thin.

光反射膜122は、発光素子108の発光波長に対して、入射角に対する反射率角度依存性を有していることが好ましい。具体的には、光反射膜122の反射率は、垂直入射よりも斜め入射の方が低くなるように設定されている。これにより、発光素子直上における輝度の変化が緩やかになり、発光素子直上が暗点になる等、極端に暗くなることを抑制することができる。 It is preferable that the light reflection film 122 has a reflectance angle dependence on the incident angle with respect to the emission wavelength of the light emitting element 108. Specifically, the reflectance of the light reflection film 122 is set so that it is lower when the light is incident obliquely than when the light is incident vertically. As a result, the change in brightness immediately above the light emitting element becomes gradual, and it is possible to prevent the area directly above the light emitting element from becoming extremely dark, such as a dark spot.

発光素子108は、図3に示すように、基板120の上面に設けられた正負一対の導体配線126a、126bに跨るように、接合部材128を介してフリップチップ実装されている。発光素子108の下面と基板120の上面との間には、アンダーフィル136が配置されていてもよい。導体配線126a、126bのうち、電気的な接続を行わない領域には白色レジスト等の光反射層138が形成されていてもよい。 As shown in FIG. 3, the light emitting element 108 is flip-chip mounted via a bonding member 128 so as to straddle a pair of positive and negative conductor wirings 126a and 126b provided on the upper surface of the substrate 120. An underfill 136 may be disposed between the lower surface of the light emitting element 108 and the upper surface of the substrate 120. A light reflecting layer 138 such as a white resist may be formed in a region of the conductor wirings 126a and 126b where electrical connection is not made.

発光素子を被覆する封止部材124は透光性の部材であり、発光素子108を被覆するように設けられている。封止部材124は、基板120と直接接触していてもよい。封止部材124は、印刷やディスペンサ塗布が可能である粘度に調整され、加熱処理や光を照射することで硬化することができる。封止部材124の形状としては、例えば、略半球形状や、断面視において縦長(断面視において、X方向の長さよりもZ方向の長さが長い形状)の凸形状、断面視において偏平(断面視において、Z方向の長さよりもX方向の長さが長い形状)な凸形状、上面視において円形状や楕円形状となるように形成されていてもよい。 The sealing member 124 that covers the light emitting element is a translucent member and is provided so as to cover the light emitting element 108. The sealing member 124 may be in direct contact with the substrate 120. The sealing member 124 is adjusted to a viscosity that allows printing or dispenser application, and can be cured by heat treatment or light irradiation. The shape of the sealing member 124 may be, for example, approximately hemispherical, a convex shape that is vertically elongated in cross-section (the length in the Z direction is longer than the length in the X direction in cross-section), or flat in cross-section (the length in the Z direction is longer in the cross-section). It may be formed to have a convex shape (the length in the X direction is longer than the length in the Z direction) when viewed from above, or a circular or elliptical shape when viewed from above.

なお、バットウイング型の配光特性を得るための光源103は、上述の構造に限られない。例えば図4に示すように、発光素子108を被覆する封止部材124の上面に光反射膜122を設け、封止部材124の側面は光反射膜122から露出させることで横方向に光を取り出す構造であってもよい。発光素子108は支持体140の上面に搭載されていてもよく、支持体140の下面に外部電極を有していてもよい。図4に示す光源103であっても、発光素子108の上方向への光は光反射膜122で反射され、発光素子108の直上の光量が抑制され、バットウイング型の配光特性とすることができる。 Note that the light source 103 for obtaining batwing-type light distribution characteristics is not limited to the above-described structure. For example, as shown in FIG. 4, a light reflecting film 122 is provided on the upper surface of a sealing member 124 that covers the light emitting element 108, and the side surfaces of the sealing member 124 are exposed from the light reflecting film 122 to extract light laterally. It may be a structure. The light emitting element 108 may be mounted on the upper surface of the support 140, or may have an external electrode on the lower surface of the support 140. Even with the light source 103 shown in FIG. 4, the light directed upward from the light emitting element 108 is reflected by the light reflecting film 122, and the amount of light directly above the light emitting element 108 is suppressed, resulting in a batwing type light distribution characteristic. I can do it.

また、バットウイング型の配光特性を得るための光源103として、図5に示すように発光素子108を被覆するレンズ142を備えていてもよい。レンズ142は円柱状の外形を有し、レンズ底面の略中央に発光素子108が配置される凹部148を有する。 Furthermore, as the light source 103 for obtaining batwing type light distribution characteristics, a lens 142 covering the light emitting element 108 may be provided as shown in FIG. The lens 142 has a cylindrical outer shape, and has a recess 148 in which the light emitting element 108 is arranged approximately in the center of the bottom surface of the lens.

また、レンズ底面と対向する面は略中心に凹部150を有し、中心側から外側に向かって基板120と対向する側を凸形状とする曲面が形成されている。なお、発光素子108は支持体に搭載されて被覆部材で覆われた発光装置であってもよい。図5に示す光源103であっても、発光素子108の上方向への光は凹部150の内面で横方向へ反射されて、凸形状の曲面から出射されることで発光素子108の直上の光量が抑制され、バットウイング型の配光特性とすることができる。 Further, the surface facing the bottom surface of the lens has a concave portion 150 approximately at the center, and a curved surface is formed in which the side facing the substrate 120 is convex from the center side toward the outside. Note that the light emitting element 108 may be a light emitting device mounted on a support and covered with a covering member. Even with the light source 103 shown in FIG. 5, the light directed upward from the light emitting element 108 is reflected laterally on the inner surface of the recess 150 and is emitted from the convex curved surface, so that the amount of light directly above the light emitting element 108 is reduced. is suppressed, and a batwing type light distribution characteristic can be achieved.

以上の例では、第1壁部及び第2壁部に仕切られた領域ごとに、1つの発光素子108を用いて光源103としたものを例に挙げたが、複数個の発光素子108を用いて1つの光源103としてもよい。 In the above example, one light emitting element 108 is used as the light source 103 for each area partitioned by the first wall part and the second wall part, but a plurality of light emitting elements 108 are used as the light source 103. A single light source 103 may also be used.

平面部106の形状は多角形であることが好ましい。これにより、発光面の面積に応じて発光面を第1壁部105A及び第2壁部105Bで任意の数に区分することが容易になる。第1平面部106A及び第2平面部106Bの形状は、例えば図6に示すような正方形や長方形、図7に示すような六角形が挙げられる。平面部106の形状が六角形の場合は、第1反射部材110A及び第2平面部106Bの配列は図7に示すようなハニカム状の配列となる。ハニカム状の配列の場合、光源103は千鳥状に配置される。図6及び図7では第1反射部材110Aの例を示しているが、第2反射部材110Bも同様に形成することができる。 The shape of the flat portion 106 is preferably a polygon. This makes it easy to divide the light emitting surface into an arbitrary number of sections using the first wall section 105A and the second wall section 105B according to the area of the light emitting surface. The shapes of the first plane part 106A and the second plane part 106B include, for example, a square or a rectangle as shown in FIG. 6, and a hexagon as shown in FIG. 7. When the planar portion 106 has a hexagonal shape, the first reflecting member 110A and the second planar portion 106B are arranged in a honeycomb shape as shown in FIG. In the case of a honeycomb arrangement, the light sources 103 are arranged in a staggered manner. Although FIGS. 6 and 7 show an example of the first reflecting member 110A, the second reflecting member 110B can also be formed in the same manner.

第1壁部及び第2壁部によって区分される領域の区分数は、任意で設定することができ、所望のサイズに応じて光源の位置と第1壁部及び第2壁部の形状を変更することができる。 The number of divisions of the area divided by the first wall part and the second wall part can be set arbitrarily, and the position of the light source and the shape of the first wall part and the second wall part can be changed according to the desired size. can do.

(面発光装置)
以上説明した発光装置を、直下型バックライト用光源として用いる場合について説明する。図2に示すように、発光装置の上方に所定距離を隔てて拡散板130やプリズムシート等の光学部材を配置し、さらにその上に液晶パネル132を配置し、面発光装置とする。
(Surface emitting device)
A case will be described in which the light emitting device described above is used as a light source for a direct type backlight. As shown in FIG. 2, optical members such as a diffuser plate 130 and a prism sheet are arranged above the light emitting device at a predetermined distance, and a liquid crystal panel 132 is further arranged thereon to form a surface emitting device.

第1反射部材110A及び第2反射部材110Bの形状を最適化することでバックライト用光源を薄くすることができるが、第1壁部及び第2壁部によって区分される面積を固定したうえで、例えば光源ピッチ(P)と、光源載置面から光軸L方向に配置された光学部材までの距離(H)についてP/H=5.2程度であっても輝度均一性が満足できるように光反射部材を最適化したとする。そうすればP/H=3.3程度までは輝度均一性を維持することができるため、所望の画面サイズ、所望のP/Hに応じて、区分数を増減させるだけで種々のバックライト用光源を提供することができる。後述するローカルディミングの制御エリアについても、制御する区分単位を1つ、2つと選択することで対応できる。これにより所望の画面サイズによって区分面積を変動し、都度光反射部材を最適化するという手間を省略できるため、コストダウンを図ることができる。 Although the backlight light source can be made thinner by optimizing the shapes of the first reflecting member 110A and the second reflecting member 110B, For example, even if P/H is about 5.2 regarding the light source pitch (P) and the distance (H) from the light source mounting surface to the optical member arranged in the optical axis L direction, the brightness uniformity can be satisfied. Suppose that the light reflecting member is optimized. By doing so, it is possible to maintain brightness uniformity up to P/H = 3.3, so you can use it for various backlights by simply increasing or decreasing the number of sections depending on the desired screen size and desired P/H. A light source can be provided. The local dimming control area, which will be described later, can also be handled by selecting one or two division units to be controlled. This eliminates the need to vary the divided area depending on the desired screen size and optimize the light reflecting member each time, thereby reducing costs.

基板120に配置されたそれぞれの光源103は、互いに独立して駆動可能であり、光源ごとの調光制御(例えば、ローカルディミングやHDR)が可能である。それぞれの光源103は第1壁部105A及び第2壁部105Bに取り囲まれていることから、隣接する光源から発せられた光が壁部を隔てて隣接する領域内に入射することを抑制することができる。例えば、第1壁部105Aに囲まれた1つの領域のみを消灯する場合、隣接する領域の光が入射すると輝度が落ちず、表示装置で黒を表示する場合でも白っぽい黒となってしまうが、不要な光の入射を抑制することで輝度を落とすことができる。また、1つの領域のみで輝度を上げたい場合も、隣接する領域への光の入射を抑制しつつ、1つの領域のみの輝度を上げることができる。 The respective light sources 103 arranged on the substrate 120 can be driven independently of each other, and dimming control (for example, local dimming or HDR) for each light source is possible. Since each light source 103 is surrounded by the first wall 105A and the second wall 105B, it is possible to suppress light emitted from adjacent light sources from entering an adjacent area across the wall. I can do it. For example, when only one area surrounded by the first wall part 105A is turned off, the brightness does not decrease when light from an adjacent area enters, and even when black is displayed on a display device, it becomes a whitish black. Brightness can be reduced by suppressing the incidence of unnecessary light. Furthermore, even when it is desired to increase the brightness in only one area, it is possible to increase the brightness in only one area while suppressing the incidence of light into adjacent areas.

以下に、実施形態の発光装置の各構成部材に適した材料等について説明する。
(基板)
基板120は、光源103を載置するための部材であり、図3に示されるように、発光素子108等の光源に電力を供給するための導体配線126a、126bを有する。
Materials suitable for each component of the light emitting device of the embodiment will be described below.
(substrate)
The substrate 120 is a member on which the light source 103 is placed, and as shown in FIG. 3, has conductor wirings 126a and 126b for supplying power to the light source such as the light emitting element 108.

基板の材料としては、少なくとも一対の導体配線126a、126bを絶縁分離できるものであればよい。例えば、セラミックス、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂、BTレジン、ポリフタルアミド(PPA)、ポリエチレンテレフタレート(PET)等の樹脂が挙げられる。金属部材に絶縁層を形成している、いわゆる金属基板を用いてもよい。 The substrate may be made of any material as long as it can insulate and separate at least one pair of conductor wirings 126a and 126b. Examples include resins such as ceramics, phenol resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA), and polyethylene terephthalate (PET). A so-called metal substrate in which an insulating layer is formed on a metal member may be used.

基板の厚さは適宜選択することができ、ロール・ツー・ロール方式で製造可能なフレキシブル基板、あるいはリジット基板のいずれであってもよい。リジット基板は湾曲可能な薄型リジット基板であってもよい。 The thickness of the substrate can be selected as appropriate, and it may be either a flexible substrate that can be manufactured by a roll-to-roll method or a rigid substrate. The rigid substrate may be a bendable thin rigid substrate.

(接合部材)
接合部材は、発光素子108を基板または導体配線に固定するための部材である。絶縁性の樹脂や導電性の部材が挙げられ、図3に示すようなフリップチップ実装の場合は導電性の部材が用いられる。具体的にはAu含有合金、Ag含有合金、Pd含有合金、In含有合金、Pb-Pd含有合金、Au-Ga含有合金、Au-Sn含有合金、Sn含有合金、Sn-Cu含有合金、Sn-Cu-Ag含有合金、Au-Ge含有合金、Au-Si含有合金、Al含有合金、Cu-In含有合金、金属とフラックスの混合物等を挙げることができる。
(Joining member)
The bonding member is a member for fixing the light emitting element 108 to the substrate or conductor wiring. Examples include insulating resin and conductive members, and in the case of flip-chip mounting as shown in FIG. 3, conductive members are used. Specifically, Au containing alloy, Ag containing alloy, Pd containing alloy, In containing alloy, Pb-Pd containing alloy, Au-Ga containing alloy, Au-Sn containing alloy, Sn containing alloy, Sn-Cu containing alloy, Sn- Examples include Cu--Ag-containing alloys, Au--Ge-containing alloys, Au--Si-containing alloys, Al-containing alloys, Cu--In containing alloys, mixtures of metal and flux, and the like.

(光反射層)
導体配線は、発光素子108や他材料と電気的に接続する部分以外は光反射層138で被覆されている事が好ましい。すなわち、図3に示されるように、基板120上には、導体配線を絶縁被覆するためのレジストが配置されていても良く、光反射層138はレジストとして機能させることができる。後述する樹脂材料に白色系のフィラーを含有させることにより、光の漏れや吸収を防いで、発光装置の光取り出し効率を向上させることもできる。
(light reflective layer)
Preferably, the conductor wiring is covered with a light reflective layer 138 except for the portion electrically connected to the light emitting element 108 or other material. That is, as shown in FIG. 3, a resist for insulatingly covering the conductor wiring may be disposed on the substrate 120, and the light reflecting layer 138 can function as a resist. By incorporating a white filler into the resin material described below, it is possible to prevent light leakage and absorption and improve the light extraction efficiency of the light emitting device.

(発光素子)
発光素子108は、公知のものを利用することができる。例えば、発光素子108として発光ダイオードを用いるのが好ましい。
発光素子108は、任意の波長のものを選択することができる。例えば、青色、緑色の発光素子としては、窒化物系半導体を用いたものを用いることができる。また、赤色の発光素子としては、GaAlAs、AlInGaPなどを用いることができる。さらに、これ以外の材料からなる半導体発光素子を用いることもできる。用いる発光素子の組成や発光色、大きさや、個数などは目的に応じて適宜選択することができる。
(Light emitting element)
A known light emitting element can be used as the light emitting element 108. For example, it is preferable to use a light emitting diode as the light emitting element 108.
The light emitting element 108 can be selected to have an arbitrary wavelength. For example, as the blue and green light emitting elements, those using nitride semiconductors can be used. Further, as the red light emitting element, GaAlAs, AlInGaP, etc. can be used. Furthermore, semiconductor light emitting elements made of materials other than these can also be used. The composition, emitted light color, size, number, etc. of the light emitting elements used can be appropriately selected depending on the purpose.

(封止部材)
発光素子を外部環境から保護するとともに、発光素子から出力される光を光学的に制御する等の目的で、発光素子を被覆するように封止部材124を配置してもよい。封止部材の材料としては、エポキシ樹脂やシリコーン樹脂あるいはそれらを混合させた樹脂などの透光性樹脂や、ガラスなどを用いることができる。これらのうち、耐光性および成形のしやすさを考慮して、シリコーン樹脂を選択することが好ましい。
(Sealing member)
The sealing member 124 may be arranged to cover the light emitting element for the purpose of protecting the light emitting element from the external environment and optically controlling light output from the light emitting element. As the material of the sealing member, a translucent resin such as epoxy resin, silicone resin, or a mixture thereof, glass, or the like can be used. Among these, silicone resins are preferably selected in consideration of light resistance and ease of molding.

さらに、封止部材には、発光素子からの光を吸収して発光素子からの出力光とは異なる波長の光を発する蛍光体等の波長変換材料や、発光素子からの光を拡散させるための拡散剤を含有させることができる。また、発光素子の発光色に対応させて、着色剤を含有させることもできる。 Furthermore, the sealing member includes a wavelength conversion material such as a phosphor that absorbs light from the light emitting element and emits light of a different wavelength from the output light from the light emitting element, and a material that diffuses the light from the light emitting element. A diffusing agent can be included. Further, a coloring agent may be included in accordance with the color of light emitted by the light emitting element.

本発明の発光装置および面発光装置は、表示装置のバックライト用光源や、照明装置の光源など、各種発光装置に利用することができる。 The light emitting device and surface emitting device of the present invention can be used in various light emitting devices such as a light source for a backlight of a display device and a light source for a lighting device.

120 基板
103 光源
102A 第1凹部
104A 第1開口
105A 第1壁部
106A 第1平面部
102B 第2凹部
104B 第2開口
105B 第2壁部
106B 第2平面部
108 発光素子
110A 第1反射部材
110B 第2反射部材
111 接着部材
122 光反射膜
124 封止部材
126a、126b 導体配線
130 拡散板
132 液晶パネル
136 アンダーフィル
138 光反射層
140 支持体
142 レンズ
200 被覆部材
201 被覆面
160 軸部
162 抜け止め部
164 凸部
170 バックシャーシ
120 Substrate 103 Light source 102A First recess 104A First opening 105A First wall 106A First plane 102B Second depression 104B Second opening 105B Second wall 106B Second plane 108 Light emitting element 110A First reflective member 110B 2 Reflective member 111 Adhesive member 122 Light reflective film 124 Sealing member 126a, 126b Conductor wiring 130 Diffusion plate 132 Liquid crystal panel 136 Underfill 138 Light reflective layer 140 Support body 142 Lens 200 Covering member 201 Covering surface 160 Shaft portion 162 Retaining portion 164 Convex portion 170 Back chassis

Claims (10)

基板と、前記基板の上面に配置された光源と、を有し、
前記光源は、発光素子と、前記発光素子を被覆する封止部材と、
前記封止部材の上面に光反射膜と、を有し、
前記封止部材の形状は、断面視において前記基板の上面に垂直な方向に長い縦長形状であり、
前記光源の厚みは、0.5~2.0mmであり、バットウィング型の配光特性を有する光源であって、
複数有し、前記基板上に行列状に配置されている、発光装置。
a substrate; a light source disposed on the top surface of the substrate;
The light source includes a light emitting element, a sealing member covering the light emitting element,
a light reflecting film on the upper surface of the sealing member ;
The shape of the sealing member is a vertically elongated shape that is long in a direction perpendicular to the upper surface of the substrate when viewed in cross section;
The thickness of the light source is 0.5 to 2.0 mm, and the light source has batwing type light distribution characteristics,
A plurality of light emitting devices are arranged on the substrate in a matrix.
前記複数の光源は、前記基板上に一定の間隔で配置されている請求項1に記載の発光装置。 The light emitting device according to claim 1, wherein the plurality of light sources are arranged at regular intervals on the substrate. 前記封止部材は、前記発光素子からの出力光とは異なる波長の光を発する波長変換材料を含む請求項1または2に記載の発光装置。 The light emitting device according to claim 1 or 2, wherein the sealing member includes a wavelength conversion material that emits light of a different wavelength from the output light from the light emitting element. 前記封止部材は、前記発光素子からの光を拡散させる拡散剤を含む請求項1~3のいずれか1項に記載の発光装置。 The light emitting device according to claim 1, wherein the sealing member includes a diffusing agent that diffuses light from the light emitting element. 前記基板上には、前記複数の光源がそれぞれ配置される第1開口を有する第1平面部と前記第1平面部を囲む第1壁部と
を有する第1凹部を複数備える第1反射部材と、を備える請求項1~4のいずれか1項に記載の発光装置。
a first reflecting member provided on the substrate, including a plurality of first recesses each having a first plane part having a first opening in which each of the plurality of light sources is disposed, and a first wall part surrounding the first plane part; The light emitting device according to any one of claims 1 to 4, comprising:
前記基板の上面と、前記第1平面部の下面とが固定されている、請求項5に記載の発光装置。 The light emitting device according to claim 5, wherein an upper surface of the substrate and a lower surface of the first plane part are fixed. 前記光源の上面は、前記第1平面部の上面よりも高い位置に配置される、請求項5または6に記載の発光装置。 The light emitting device according to claim 5 or 6, wherein the upper surface of the light source is arranged at a higher position than the upper surface of the first plane part. 前記第1壁部は、前記第1平面部の上面に対して垂直方向に離れるほど広がるように傾斜した面を有する、請求項5~7のいずれか1項に記載の発光装置。 The light emitting device according to any one of claims 5 to 7, wherein the first wall portion has an inclined surface that widens as the distance increases in a direction perpendicular to the upper surface of the first flat portion. 前記光源は、さらに支持体を有し、前記発光素子は支持体の上面に有する、請求項1~8のいずれ1項に記載の発光装置。The light emitting device according to any one of claims 1 to 8, wherein the light source further includes a support, and the light emitting element is provided on the upper surface of the support. 前記支持体の下面に外部電極を有する、請求項9に記載の発光装置。The light emitting device according to claim 9, further comprising an external electrode on the lower surface of the support.
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