JP7435145B2 - Laser processing system and laser processing method - Google Patents

Description

The present invention relates to a laser processing system and a laser processing method.

At sheet metal processing sites, work defects may occur in subsequent processes due to processing defects in previous processes. Therefore, when a machining defect occurs, it is preferable that the operator be able to appropriately recognize that the machining defect has occurred. For example, Patent Document 1 discloses a technique for grasping the processing state of a workpiece using a laser processing machine that performs a cutting process in which a plurality of parts are cut from a plate-shaped workpiece using a laser.

JP 2017-192983 Publication

If an operator can obtain information regarding the machining results when parts are cut with a laser beam, it will be easier to understand the situation even if a cutting defect occurs.

Therefore, the present invention has developed a technology that allows an operator to easily obtain information on the processing results when cutting parts with a laser beam, and furthermore, even if a cutting defect occurs, it is easy to understand the situation. provide.

A first aspect of the present invention is a laser processing system. The laser processing system includes a laser processing section that performs cutting processing that cuts a plurality of parts from a plate-shaped workpiece using laser light, and mark processing that forms marks on the workpiece using laser light. The laser processing system includes a reading section that reads marks formed by the laser processing section. The laser processing system includes a display section that displays information corresponding to the mark read by the reading section. The information corresponding to the mark includes information on the kerf width, assist gas pressure, or visible light as information regarding the processing results when cutting the part. The information corresponding to the mark includes information on the plate thickness, material, size, laser beam output, or laser head movement speed as information on the processing conditions when cutting the part.

The laser machining unit may form marks on the surface of the part. The laser processing system may include an imaging unit that captures an image of a location irradiated with laser light. The laser processing system may include a determination unit that determines whether cutting of the part is defective based on an image captured by the imaging unit. The laser processing unit may form a mark at a position corresponding to a part that has been determined to be poorly cut by the determination unit. The laser processing system may include a nesting section that generates a layout for cutting multiple parts from a workpiece. The nesting unit may generate a new layout for cutting again the part that has been determined to be poorly cut by the determining unit. The mark may be a one-dimensional mark or a two-dimensional mark.

A second aspect of the present invention is a laser processing method. The laser processing method includes cutting a plurality of parts from a plate-shaped workpiece using a laser beam. The laser machining method includes performing mark machining to form a mark on a workpiece using a laser beam. The laser processing method includes reading the marks formed. The laser processing method includes displaying information corresponding to the read marks. The information corresponding to the mark includes information on the kerf width, assist gas pressure, or visible light as information on the processing results when cutting the part. The information corresponding to the mark includes information on the plate thickness, material, size, laser beam output, or laser head movement speed as information on the processing conditions when cutting the part.

Note that the above summary of the invention does not list all necessary features of the invention. Furthermore, subcombinations of these features may also constitute inventions.

According to the aspect of the present invention, a worker can easily obtain information regarding the processing results when parts are cut with a laser beam, and even if a cutting defect occurs, it is easy to understand the situation. .

In addition, according to the aspect in which the mark includes information about the processing conditions when cutting the part, the worker can easily obtain information about the processing conditions, and even if a cutting defect occurs, it is possible to understand the situation. It becomes even easier. Further, according to the aspect in which marks are formed on the surfaces of parts, it becomes easy for the operator to understand which part the acquired information regarding processing conditions corresponds to. Furthermore, according to the aspect in which a mark is formed at a position corresponding to a part determined to be defective in cutting, the worker immediately recognizes that the part corresponding to the position where the mark is formed is defective in cutting. be able to. Furthermore, according to the aspect of generating a new layout for cutting again a part that has been determined to be defective in cutting, it is possible to improve the yield in the cutting process without human intervention. Further, according to an aspect in which the mark is a one-dimensional mark, the reading speed of the mark is high, and the time for stopping the process line to read the mark can be shortened. Further, according to the embodiment in which the mark is a two-dimensional mark, the operator can easily obtain a large amount of information regarding the machining results, and even if a cutting defect occurs, it becomes easy to understand the situation.

1 schematically shows an example of a laser processing system 100. An example of a laser head 200 is schematically shown. An example of the flow of processing when parts are cut by the control unit 140 is schematically shown. An example of the flow of cutting and mark processing by the laser beam machine 110 is schematically shown. An example of the flow of cutting and mark processing by the laser beam machine 110 is schematically shown. An example of the flow of cutting and mark processing by the laser beam machine 110 is schematically shown. An example of mark M is schematically shown. An example of the flow of processing when reading a mark by the control unit 140 is schematically shown. An example of information displayed when mark M is read is schematically shown. An example of the flow of nesting processing by the nesting unit 170 is schematically shown. An example of a position where a mark M is formed is schematically shown. An example of the flow of re-nesting processing by the nesting unit 170 is schematically shown.

Hereinafter, the present invention will be explained through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. Furthermore, not all combinations of features described in the embodiments are essential to the solution of the invention.

Hereinafter, directions in the figures will be explained using an XYZ coordinate system. In this XYZ coordinate system, the vertical direction is the Z direction, and the horizontal directions are the X and Y directions. In addition, in the following description, the side at the tip of the arrow will be referred to as the + side, and the opposite side will be referred to as the - side, as appropriate, with respect to each of the X direction, Y direction, and Z direction.

FIG. 1 schematically shows an example of a laser processing system 100. The laser processing system 100 according to this embodiment includes a laser processing machine 110, a pallet transport device 120, an autoloader 130, a control section 140, a reading section 150, a display section 160, and a nesting section 170. Note that the laser processing machine 110 is an example of a "laser processing section."

The laser processing machine 110 is a machine tool that uses laser energy to cut, drill, or harden. The laser processing machine 110 performs a cutting process of cutting a plurality of parts P1 to P3 (hereinafter collectively referred to as parts P) from a plate-shaped workpiece W using a laser beam. Further, the laser processing machine 110 performs mark processing to form a mark M on the workpiece W using a laser beam. The laser processing machine 110 forms a mark M on the surface of the part P, for example. Here, the mark M is a general term for a barcode symbol, an array of symbols, an array of characters, etc. formed on the workpiece W to provide information to the worker.

A barcode symbol is a general term for an information medium that displays information using a combination of areas with high optical reflectance and areas with low optical reflectance, and is made readable mechanically. Therefore, barcode symbol is a general term that includes one-dimensional symbols and two-dimensional symbols, and has the same meaning as barcode symbol system. Information media such as one-dimensional symbols and two-dimensional symbols are called data carriers. A data carrier is a general term for an information medium that is used to add information to an object or the like and to identify this object or the like. A one-dimensional symbol is an example of a "one-dimensional mark." A two-dimensional symbol is an example of a "two-dimensional mark."

A one-dimensional symbol is a mechanically readable barcode symbol that is comprised of regions of high and low optical reflectivity and a varying array of parallel, rectangular bars or spaces. A one-dimensional symbol is generally simply called a "barcode," and is also called a "linear symbol" or a "one-dimensional barcode." A one-dimensional symbol consists of barcode symbol characters arranged in a straight line to form information.

On the other hand, a two-dimensional symbol is a barcode symbol in which symbol characters or information units corresponding to symbol characters are arranged vertically and horizontally. A two-dimensional symbol is also called a "two-dimensional code" or "two-dimensional barcode." Two-dimensional symbols include a multi-row symbol system in which one-dimensional symbols are stacked, and a matrix symbol system in which data is arranged mainly in a grid.

It is sufficient that the mark M includes at least information regarding the machining results when the part P is cut. Further, the mark M may include information regarding processing conditions when the part P is cut.

The laser processing machine 110 processes a workpiece W in a processing area R surrounded by a frame 111. Frame 111 supports carriage 112. Further, the frame 111 supports the pallet PA at the lower part of the processing area R.

The pallet PA is a stand on which the work W is attached and supplied. The pallet PA includes a plurality of knife edges K. The knife edge K is a wavy plate that supports the workpiece W on the pallet PA. Knife edge K is also called kenzan. For example, the knife edges K are arranged in a line in the X direction while standing on the upper surface of the rectangular pallet PA. For example, the upper end of the knife edge K is formed in a sawtooth shape to reduce the contact area with the workpiece W and suppress welding of the workpiece W to the pallet PA by laser processing. The upper end portion of each knife edge K is formed so that the position in the Z direction from the pallet PA is the same. The workpiece W is placed on a plurality of knife edges K. Since the height of the upper end of each knife edge K is the same, the workpiece W is placed substantially horizontally on the pallet PA.

The carriage 112 is a device that supports the laser head 200 and moves the laser head 200. The carriage 112 is placed above the workpiece W. The carriage 112 is elongated in the Y direction. For example, the length of the carriage 112 in the Y direction is set to be longer than the length of the pallet PA in the Y direction. The carriage 112 moves in the X direction with respect to the work W placed on the pallet PA, and moves the laser head 200 relative to the work W in each of the X, Y, and Z directions. let

The carriage 112 includes a gantry 112A, a slider 112B, and an elevating section 112C. The gantry 112A is a member that supports each part. The gantry 112A extends in the Y direction and is placed on a pair of guides 113 formed on the top surface of the frame 111. The length of the gantry 112A in the Y direction is set to be longer than the length of the pallet PA in the Y direction.

A guide 112D is provided on the +Z side surface which is the upper surface of the gantry 112A. The guide 112D is formed along the Y direction and guides the slider 112B. The slider 112B is arranged from the top surface of the gantry 112A to the −X side surface.

A guide 112E is provided on the -X side surface of the slider 112B. The guide 112E is formed along the vertical direction and guides the elevating section 112C. The elevating section 112C is arranged on the -X side surface of the slider 112B.

The carriage 112 includes, for example, an actuator such as a motor as a drive device that moves the gantry 112A, the slider 112B, and the elevating section 112C. The gantry 112A is driven by a drive device and is movable in the X direction along the guide 113. The slider 112B is driven by a drive device and is movable in the Y direction along the guide 112D. The elevating section 112C is movable in the Z direction along the guide 112E. The drive device operates under the control of the control unit 140.

A laser head 200 is mounted on the carriage 112. The laser head 200 is a processing head that includes a condenser lens, a processing nozzle, and the like. The laser head 200 is held at the lower part of the elevating section 112C. The laser head 200 moves in the X direction when the gantry 112A moves in the X direction, moves in the Y direction when the slider 112B moves in the Y direction, and moves in the Z direction when the lifting section 112C moves in the Z direction. Move to.

The pallet transport device 120 is a device that carries the pallet PA into and out of the processing area R. The pallet transport device 120 includes rails 121. The rail 121 extends linearly in the X direction from the processing area R to the unloading position UP. The unloading position UP is a position where the workpiece W is placed when the part P is extracted from the workpiece W on which the part P has been formed by laser processing. Pallet PA includes wheels that can run on rails 121. The pallet transport device 120 transports the pallet PA along the rails 121 by pulling the pallet PA. For example, a hook connected to a wire is hung on the pallet PA, and the pallet PA is pulled by the wire being wound around the drive unit.

The autoloader 130 is a device that automatically transports the parts P to a predetermined position. For example, the autoloader 130 carries out a part P cut from a workpiece W on a pallet PA placed at an unloading position UP after laser processing to a product carrying-out area A by sucking the surface of the part P. The autoloader 130 is attached to an X guide 131 that extends in the X direction from the unloading position UP to the product unloading area A. The X guide 131 is supported by the traveling truck and moves in the Y direction as the traveling truck moves in the Y direction. The autoloader 130 includes, for example, an X moving body 132 movable along an X guide 131, a Z moving body 133 provided on the X moving body 132, and a suction section 134 provided at the lower end of the Z moving body 133. . The X moving body 132 is movable between the product unloading area A and above the pallet PA placed at the unloading position UP. The Z moving body 133 is movable in the Z direction relative to the X moving body 132 while holding the suction part 134. The suction unit 134 moves in the Y direction as the traveling carriage moves, moves in the X direction as the X moving body 132 moves, and moves in the Z direction as the Z moving body 133 moves.

A plurality of suction pads are provided on the lower surface of the suction unit 134, and the parts P are suctioned by vacuum or reduced pressure. At the unloading position UP, the suction unit 134 is aligned with the part P cut from the workpiece W by movement in the X direction and the Y direction. Then, the suction unit 134 approaches the part P by moving toward the −Z side and suctions the part P. Then, the suction unit 134 moves to the +Z side while sucking the part P, lifts the part P, and moves the part P to a predetermined position in the product delivery area A by moving in the X direction and the Y direction.

The control unit 140 is a machine that automatically performs complex calculations according to given procedures. The control unit 140 includes an input/output device that exchanges data with the outside, a storage device that records data, a control device that controls program execution status and the status of each device, and an arithmetic device that calculates and processes data. It consists of The control unit 140 mainly controls the laser processing machine 110, the pallet transport device 120, and the autoloader 130.

The control unit 140 includes a determination unit 141 that determines whether the cutting of the part P is defective. For example, the laser processing machine 110 forms a mark M at a position corresponding to a part P that has been determined to be poorly cut by the determination unit 141.

The reading unit 150 is a device that reads the mark M formed by the laser processing machine 110. For example, the reading unit 150 optically detects the mark M and converts it into a specific character by analyzing the pattern of high and low optical reflectance parts. The reading unit 150 has some kind of light source and optical sensor, and also has a mechanism for scanning the mark M. The output of the optical sensor is a weak analog signal. Therefore, the reading unit 150 amplifies the output of the optical sensor and digitizes it using a certain reference threshold. Then, the reading unit 150 converts the digital signal into a digital signal in which the portion with high optical reflectance is set as "0" and the portion with low optical reflectance is set as "1", and stores it in the memory. Then, the reading unit 150 decodes the pattern of “0” and “1” and outputs data indicating the decoding result to the control unit 140. The reading section 150 includes a light source section, a scanning section, a light receiving section, a signal amplification section, a digital conversion section, a decoding section, and an interface section in order to realize the above operations.

The display unit 160 is a device that displays information corresponding to the mark M read by the reading unit 150. The display unit 160 is, for example, a user terminal that has a display screen and is usually connected to an input device such as a keyboard.

The nesting unit 170 is a device that generates a layout for cutting a plurality of parts P from a workpiece W. The nesting unit 170 optimally arranges, for example, a part P expressed by a two-dimensional closed figure in a workpiece W such as a rectangle. The nesting unit 170 can generate a new layout for cutting again the part P that has been determined to be poorly cut by the determining unit 141.

FIG. 2 schematically shows an example of a laser head 200. Laser head 200 has a nozzle 210. The processing laser L1 and the illumination laser L2 are irradiated toward the workpiece W from an exit formed in the nozzle 210. As described above, the laser head 200 is provided so as to be movable relative to the workpiece W in each of the X direction, the Y direction, and the Z direction. The laser processing machine 110 performs a cutting process by irradiating the workpiece W with a processing laser L1 from the nozzle 210 of the laser head 200 while moving the laser head 200 relative to the workpiece W.

The laser head 200 includes an optical fiber 221, a collimator 231, a beam splitter 241, and a condenser lens 232. The optical fiber 221 has one end connected to the laser oscillator 220 and the other end connected to the laser head 200. A processing laser L1 output from a laser oscillator 220 is introduced into the laser head 200 via an optical fiber 221.

The collimator 231 converts the processing laser L1 output from the laser oscillator 220 into parallel light or makes it close to parallel light. The collimator 231 is arranged, for example, so that the focal point on the incident side of the processing laser L1 coincides with the position of the end of the optical fiber 221.

The beam splitter 241 is arranged at a position where the processing laser L1 that has passed through the collimator 231 is incident. The beam splitter 241 is a wavelength selection mirror that has the property of reflecting the processing laser L1 and projecting the illumination laser L2. Beam splitter 241 is inclined at an angle of approximately 45 degrees with respect to optical axis 231A of collimator 231.

The condensing lens 232 is arranged at a position where the processing laser L1 reflected by the beam splitter 241 is incident. The processing laser L1 passes through the collimator 231, is reflected by the beam splitter 241, has an optical path bent by about 90 degrees from the X direction to the Z direction, and enters the condenser lens 232. The condensing lens 232 condenses the incident processing laser L1. The optical system drive unit of the laser head 200 adjusts the focus on the workpiece W side, for example, by moving the condenser lens 232 along the optical axis 232A of the condenser lens 232. The spot size of the processing laser L1 on the surface of the workpiece W becomes larger as the focal point moves away from the surface of the workpiece W. The kerf width is determined by the spot size and the material of the work W to be cut. Here, the kerf is a groove formed by laser cutting. Moreover, the kerf width is the width of the kerf.

A lighting unit 250 is detachably connected to the laser head 200. The illumination unit 250 includes a laser array 251 and a collimator 252. The laser array 251 emits light of a different wavelength from the processing laser L1 as the illumination laser L2.

The collimator 252 is arranged at a position where the illumination laser L2 from the laser array 251 is incident. The collimator 252 converts the illumination laser L2 from the laser array 251 into parallel light or makes it close to parallel light.

Laser head 200 includes a half mirror 261. The half mirror 261 is arranged at a position where the illumination laser L2 that has passed through the collimator 252 is incident. The half mirror 261 is a reflective/transmissive member having a characteristic of partially reflecting the illumination laser L2 and partially transmitting the illumination laser L2. The half mirror 261 is set, for example, so that the ratio of transmitted light of the illumination laser L2 is about 50%. The half mirror 261 is inclined at an angle of about 45 degrees with respect to the optical axis 252A of the collimator 252.

The illumination laser L2 passes through the collimator 252, is partially reflected by the half mirror 261, and its optical path is bent approximately 90 degrees from the X direction to the Z direction, and enters the beam splitter 241. The condensing lens 232 condenses the illumination laser L2 from the beam splitter 241. The illumination area of the illumination laser L2 on the workpiece W is set to include the irradiation area of the processing laser L1 on the workpiece W.

Laser head 200 includes an imaging section 270. The imaging unit 270 is a device that images a location irradiated with laser light. The imaging unit 270 includes an imaging device 271, and the imaging device 271 detects the return light from the workpiece W by illumination by the illumination laser L2.

The return light from the workpiece W passes through the condenser lens 232 and enters the beam splitter 241 . The returned light includes, for example, the light of the illumination laser L2 that is reflected and scattered by the workpiece W, and the light of the processing laser L1 that is reflected by the workpiece W. Of the returned light, the light originating from the illumination laser L2 passes through the beam splitter 241 and enters the half mirror 261. On the other hand, among the returned lights, the light originating from the processing laser L1 is reflected by the beam splitter 241 and removed from the optical path from the beam splitter 241 toward the half mirror 261.

Note that, when molten metal obtained by melting the workpiece W by the processing laser L1 exists on the surface of the workpiece W, the returned light includes light in a wavelength range from red to near-infrared emitted from the molten metal. Further, when plasma is generated due to melting and evaporation of the workpiece W by the processing laser L1, the returned light includes light in a wavelength range from blue to ultraviolet. Of the light caused by the molten metal or plasma, light having a wavelength different from that of the processing laser L1 passes through the beam splitter 241 and enters the half mirror 261.

The laser head 200 includes a wavelength selection filter 281 and an imaging lens 282. The wavelength selection filter 281 is, for example, a dichroic mirror or a notch filter. A portion of the return light incident on the half mirror 261 passes through the half mirror 261 and enters the wavelength selection filter 281, and a portion is reflected by the half mirror 261. The wavelength selection filter 281 has a characteristic of reflecting the returned light in the wavelength band that is reflected by the workpiece W by the illumination laser L2. Further, the wavelength selection filter 281 has a characteristic of transmitting return light in a wavelength band emitted from the workpiece W by irradiation with the processing laser L1. Return light originating from the illumination laser L2 is reflected by the wavelength selection filter 281 and enters the imaging lens 282. The imaging lens 282 focuses the light reflected by the wavelength selection filter 281 onto the image sensor 271 .

As the image sensor 271, for example, a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) image sensor is used. The image sensor 271 is provided with a plurality of pixels arranged two-dimensionally. Each pixel is provided with a light receiving element such as a photodiode. The image sensor 271 sequentially reads and amplifies the signals generated in each pixel by the return light incident on the light receiving element, converts them into A/D (Analog-to-Digital), and arranges them to generate digital data of the captured image. generate.

The laser processing system 100 includes an image processing section 180. The image processing section 180 is communicably connected to the control section 140 and the imaging section 270 by wire or wirelessly. The imaging unit 270 transmits captured image data generated by the imaging device 271 to the image processing unit 180. When the image processing unit 180 receives the captured image data transmitted from the imaging unit 270, the image processing unit 180 performs image processing on the captured image and generates data regarding the processing state. For example, the image processing unit 180 performs image processing on the captured image data, detects the positions of edges at both ends of the kerf by laser processing, and then converts the distance between the edges on the image into a distance on an actual scale to determine the kerf width. Measure. Then, the image processing unit 180 transmits data indicating the measured kerf width to the control unit 140 as data related to the processing state.

The laser head 200 also includes an assist gas supply section 290 and a pressure sensor 291. The assist gas supply section 290 is a device that supplies assist gas into the nozzle 210. Here, the assist gas is a gas used mainly to remove melted or sublimated material during laser cutting. The assist gas supply section 290 operates under the control of the control section 140. The pressure sensor 291 is a device that measures the pressure of the assist gas supplied from the assist gas supply section 290 with a pressure sensitive element via a diaphragm, converts it into an electrical signal, and outputs it. The pressure sensor 291 outputs, for example, data indicating the measurement result of the pressure of the assist gas to the control unit 140.

FIG. 3 schematically shows an example of the flow of processing performed by the control unit 140 when cutting parts. 4 to 6 schematically show an example of the flow of cutting and mark processing by the laser beam machine 110. FIG. 7 schematically shows an example of the mark M. The process shown in FIG. 3 will be described with a state in which the laser beam machine 110 starts cutting the part P from the workpiece W as a starting state. Further, the process in FIG. 3 will be explained with reference to FIGS. 4 to 7.

In FIGS. 4 to 6, the processing line PL for cutting the part P from the workpiece W is indicated by a chain line. Further, in FIGS. 4 to 6, the kerf KL formed by laser cutting is shown by a solid line. Moreover, in FIGS. 4 to 6, a kerf KL with a cutting defect in which the kerf width exceeds an allowable value is indicated by a thick solid line.

As described above, when the cutting process of cutting the part P from the plate-shaped workpiece W using the laser beam is being performed, the imaging unit 270 images the area irradiated with the laser beam, and performs image processing on the captured image data. 180. For example, the imaging unit 270 transmits captured image data with a time stamp indicating the date and time when the image was captured to the image processing unit 180.

When the image processing unit 180 receives the captured image data, the image processing unit 180 performs image processing on the captured image data, and generates processing state data regarding the processing state, such as data indicating the kerf width, for example. Then, the image processing unit 180 transmits, for example, processing state data with a time stamp attached to the captured image data to the control unit 140.

As described above, the pressure sensor 291 measures the pressure of the assist gas when the laser beam is used to cut the part P from the plate-shaped workpiece W, and transmits the measurement result data indicating the measurement result to the control unit. 140.

When the control unit 140 receives the machining state data and measurement result data (step S101), it stores the received machining state data and measurement result data (step S102). As described above, the control unit 140 controls the operation of the laser processing machine 110. Therefore, by referring to the time stamp attached to the machining state data, the control unit 140 can identify which part P the machining state data corresponds to. Furthermore, by referring to the date and time when the measurement result data was received, the control unit 140 can identify which part P the measurement result data corresponds to. In step S102, the control unit 140 associates and stores the machining state data, measurement result data, and data that can identify the part P corresponding to the machining state data.

After the processing in step S102, the control unit 140 determines whether cutting of the part P has been completed (step S103). In step S103, the control unit 140 determines that the cutting of the part P has been completed when the cutting of any one of the parts P cut from the workpiece W has been completed. Note that the control unit 140 may determine that the cutting of the parts P has been completed when the cutting of all the parts P cut from the workpiece W has been completed.

If the cutting of the part P is not completed in step S103 (step S103; NO), the control unit 140 executes the process of step S101 again. The control unit 140 repeatedly executes the processing of steps S101 and S102 until the cutting process of the part P is completed (step S103; NO → step S101 → step S102 → step S103; NO...).

For example, in the example shown in FIG. 4, from the start of cutting of part P1 (FIG. 4(A)) to the end of cutting of part P1 (FIG. 4(IB)), steps S101 to S102 are performed. The process is executed repeatedly.

If the cutting process of the part P has been completed in step S103 (step S103; YES), the determination unit 141 of the control unit 140 determines whether there is a cutting defect in the part P (step S104). In step S104, the determination unit 141 of the control unit 140 determines that there is a cutting defect in the part P corresponding to the machining state data, for example, when the kerf width indicated by the machining state data exceeds the allowable value.

If there is no cutting defect in the part P in step S104 (step S104; NO), the control unit 140 ends the part cutting process. Then, when the cutting of the next part P is started, the control unit 140 again executes the part cutting process shown in FIG. 3.

For example, in the example shown in FIG. 4, there is no cutting defect in the part P1, so the part cutting process when cutting the part P1 is completed without performing mark processing. In the example shown in FIG. 4, when the cutting of part P1 is finished (FIG. 4(B)) and the cutting of part P2 is started (FIG. 4(B)), the part cutting process is executed again. Ru.

If there is a cutting defect in the part P in step S104 (step S104; YES), the control unit 140 specifies the storage location of the machining performance information and machining condition information corresponding to the part P (step S105). Here, the processing results include, for example, the kerf width measured by the image processing unit 180, the pressure of the assist gas measured by the pressure sensor 291, and the like. Further, the processing conditions include, for example, the thickness, material, and size of the workpiece W, the output of the processing laser L1, and the moving speed of the laser head 200. The machining conditions can be specified, for example, by referring to the machining program executed when the part P was cut. In step S105, the control unit 140 specifies, for example, the storage location of the machining state data stored in step S102 as the storage location of the machining performance information. Further, the control unit 140 specifies, for example, the storage location of the measurement result data stored in step S102 as the storage location of the processing performance information. Further, the control unit 140 specifies, for example, the storage location of the machining program that was executed when the cutting of the part P with the defective cutting was performed, as the storage location of the machining condition information.

For example, in the example shown in FIG. 5A, a cutting defect occurs in which the kerf width of the kerf KL exceeds the allowable value during cutting of the part P2. Therefore, when the cutting process of the part P2 is completed (FIG. 5B), the control unit 140 specifies the storage location of the machining performance information and the machining condition information corresponding to the part P2. Similarly, in the example shown in FIG. 6(A), a cutting defect occurs in which the kerf width of the kerf KL exceeds the allowable value from the start of the cutting process of the part P3. Therefore, when the cutting process of the part P3 is completed (FIG. 6(B)), the control unit 140 specifies the storage location of the machining performance information and the machining condition information corresponding to the part P3.

After the processing in step S105, the control unit 140 generates a mark M indicating the storage location of the processing result information and the storage location of the processing condition information identified in step S105 (step S106). In step S106, the control unit 140 displays marks such as barcode symbols (FIGS. 7(A) and 7(B)), symbol arrays (FIG. 7(C)), character arrays (FIG. 7(D)), etc. Generate M. The control unit 140 may generate a one-dimensional symbol (FIG. 7(B)) or a two-dimensional symbol (FIG. 7(A)) as a barcode symbol.

After the processing in step S106, the control unit 140 controls the laser processing machine 110 to perform mark processing to form a mark M on the workpiece W using laser light (step S107). By executing the process in step S107, the laser processing machine 110 forms a mark M at a position corresponding to the part P determined by the determination unit 141 of the control unit 140 to have a cutting defect. For example, the laser processing machine 110 forms a mark M on the surface of a part P that is determined to have a cutting defect.

For example, in the example shown in FIG. 5C, a two-dimensional symbol mark M is formed on the surface of a part P2 that has been determined to have a cutting defect. Similarly, in the example shown in FIG. 6C, a two-dimensional symbol mark M is formed on the surface of the part P3 that has been determined to have a cutting defect.

Furthermore, the control unit 140 transmits data indicating the part P with the defective cutting to the nesting unit 170 (step S108), and ends the part cutting process. In step S108, the control unit 140 transmits, for example, data indicating the part number of the part P to the nesting unit 170 as data indicating the part P in which the cutting defect occurred.

FIG. 8 schematically shows an example of the flow of processing performed by the control unit 140 when reading a mark. FIG. 9 schematically shows an example of information displayed when mark M is read. The process shown in FIG. 8 will be described with a state in which the mark M formed by the laser processing machine 110 is read and decoded by the reading unit 150 as a starting state. Further, the process in FIG. 8 will be explained with reference to FIG. 9.

When the mark M is formed by the laser processing machine 110, the operator reads the mark M by the reading unit 150. As described above, upon optically detecting the mark M, the reading unit 150 decodes the pattern of high and low optical reflectance parts, and outputs data indicating the decoding result to the control unit 140. Here, the information indicated by the mark M is a storage location of information on machining results and a storage location of machining conditions. Therefore, the reading unit 150 outputs data indicating the storage location of the processing result information and the storage location of the processing conditions to the control unit 140 as data indicating the decoding result.

When the control unit 140 acquires data indicating the result of decoding the mark M (step S201), it acquires information on the machining results and information on the machining conditions from the decoded storage location (step S202). In step S202, the control unit 140 acquires information on the kerf width from the machining state data stored in step S102 in FIG. 3, for example, as machining performance information. Further, the control unit 140 acquires, for example, information on the pressure of the assist gas from the measurement result data stored in step S102 in FIG. 3 as information on the machining results. Further, the control unit 140 acquires, for example, information on the thickness, material, and size of the workpiece W, the output of the processing laser L1, and the moving speed of the laser head 200 from the processing program.

After the process in step S202, the control unit 140 displays the machining performance information and machining condition information acquired in step S202 on the display unit 160 (step S203), and ends the mark reading process.

For example, in the example shown in FIG. 9, the machining performance information includes kerf width information PI1, assist gas pressure information PI2, and visible light information PI2 when cutting a part P with a machining defect. , is displayed. Here, the visible light information PI3 is, for example, information indicating the brightness of the captured image data. As described above, the return light originating from the illumination laser L2 is incident on the image sensor 271. However, if a cutting defect occurs, light caused by molten metal or the like also enters the image sensor 271. In that case, the brightness of the captured image data will be brighter than when no cutting defect has occurred.

In addition, in the example shown in FIG. 9, as processing condition information, plate thickness information CI1, material information CI2, and size information CI3 are provided for the workpiece W on which the cutting process of the part P with cutting defects was performed. Displayed.

In addition, in the example shown in FIG. 9, information CI4 about the output of the laser beam when cutting the part P with a processing defect and information CI5 about the moving speed of the laser head 200 are displayed as information about the processing conditions. has been done.

In addition, in the example shown in FIG. 9, a button image L is displayed that functions as a hyperlink to the machining program used when cutting the part P that had a cutting defect in relation to the machining condition information. .

As described above, according to the examples shown in FIGS. 3 to 9, the mark M includes information regarding the machining results when the part P is cut. Therefore, the operator can easily obtain information regarding the machining results. Furthermore, even if a cutting defect occurs, the operator can easily grasp the situation.

Further, according to the examples shown in FIGS. 3 to 9, the mark M includes information regarding the processing conditions when the part P is cut. Therefore, the operator can also easily obtain information regarding processing conditions. Furthermore, even if a cutting defect occurs, it becomes easier for the operator to grasp the situation.

Moreover, according to the example shown in FIGS. 3 to 9, the laser processing machine 110 forms a mark M on the surface of the part P. Therefore, the operator can easily understand which part P corresponds to the acquired information regarding the processing conditions.

Further, according to the example shown in FIGS. 3 to 9, the laser processing machine 110 forms a mark M at a position corresponding to a part P determined by the determination unit 141 to have a cutting defect. Therefore, the operator can immediately recognize that the part P corresponding to the position where the mark M is formed is defective in cutting.

Further, according to the examples shown in FIGS. 3 to 9, the mark M is a one-dimensional symbol, a two-dimensional symbol, an array of symbols, or an array of characters. When a one-dimensional symbol is employed, the reading speed of the mark M increases, and the time required to stop the process line to read the mark M can be shortened. Furthermore, when two-dimensional symbols are used, the operator can easily obtain a large amount of information regarding the machining results, and even if a cutting defect occurs, it is easy to understand the situation. In addition, when a list of symbols or a list of characters is used, the secrecy of the information indicated by the mark M can be improved since it is less versatile.

FIG. 10 schematically shows an example of the flow of nesting processing by the nesting unit 170. FIG. 11 schematically shows an example of a position where the mark M is formed. The process in FIG. 10 will be described with a state in which the shape of the workpiece W and the shapes of the plurality of parts P to be cut from the workpiece W are determined as a starting state. Further, the process in FIG. 10 will be explained with reference to FIG. 11.

Upon acquiring the information on the shape of the work W and the information on the shapes of the plurality of parts P (step S301), the nesting unit 170 generates a layout for cutting the plurality of parts P from the workpiece W (step S302). .

After the process in step S302, the nesting unit 170 adds to the layout a position where the mark M is to be formed when there is a cutting defect (step S303). In step S303, for example, when forming the mark M on the surface of the part P, the nesting unit 170 selects the ends of the surface of the part P (FIG. 11(A)), the center of the surface of the part P (FIG. 11(B)), etc. position. Further, the nesting portion 170 is located near the part P (FIG. 11C), for example, when the mark M is not formed on the surface of the part P.

After the process in step S303, the nesting unit 170 outputs the generated layout data to the control unit 140 (step S304), and ends the nesting process.

FIG. 12 schematically shows an example of the flow of re-nesting processing by the nesting unit 170. The process in FIG. 12 will be described with a state in which the control unit 140 has transmitted data indicating a part P that is defective in cutting to the nesting unit 170 as a starting state.

As described above, when the control unit 140 forms the mark M at the position corresponding to the part P that has been determined to have a cutting defect, it transmits data indicating the part P that has a cutting defect to the nesting unit 170.

When the nesting unit 170 receives data indicating a part P that has a cutting defect (step S401), it generates a new layout for cutting the part P that has a cutting defect again (step S402).

After the process in step S402, the nesting unit 170 adds to the layout a position where the mark M is to be formed when there is a cutting defect, similarly to the nesting process shown in FIG. 10 (step S403). Then, the nesting unit 170 outputs the generated layout data to the control unit 140 (step S404), and ends the re-nesting process.

As described above, according to the example shown in FIGS. 10 to 12, the nesting unit 170 generates a new layout for cutting again the part P that has been determined to be poorly cut by the determination unit 141. Therefore, at a site where the laser processing system 100 is employed, the yield in the cutting process can be improved without human intervention.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the range described in the above embodiments. It will be apparent to those skilled in the art that various changes or improvements can be made to the embodiments described above. It is clear from the claims that forms with such changes or improvements may also be included within the technical scope of the present invention.

The execution order of each process such as operation, procedure, step, stage, etc. in the apparatus, system, program, and method shown in the claims, specification, and drawings is specifically specified as "before", "prior to", etc. I haven't. It should also be noted that each process can be implemented in any order, unless the output of a previous process is used in a subsequent process. With regard to the claims, specification, and operational flows in the drawings, even if "first", "next", etc. are used for convenience in explanation, it does not mean that it is essential to implement them in this order.

110 Laser processing machine 141 Judgment unit 150 Reading unit 160 Display unit 170 Nesting unit 270 Imaging unit CI1 Board thickness information CI2 Material information CI3 Size information CI4 Laser light output information CI5 Laser head movement speed information L button image L1 Processing laser M Mark P Part PI1 Kerf width information PI2 Assist gas pressure information PI3 Visible light information W Work

Claims (6)

a laser processing section that performs a cutting process of cutting a plurality of parts from a plate-shaped workpiece using a laser beam and a mark process of forming a mark on the workpiece using a laser beam;
a reading unit that reads the mark formed by the laser processing unit;
a display section that displays information corresponding to the mark read by the reading section;
Information corresponding to the above mark is
Information regarding the processing performance when cutting the part includes information on kerf width, assist gas pressure, or visible light ;
A laser processing system that includes information on plate thickness, material, size, output of laser light, or moving speed of a laser head as information regarding processing conditions when cutting the part . The laser processing system according to claim 1 , wherein the laser processing section forms the mark on the surface of the part. an imaging unit that captures an image of a location irradiated with the laser light;
a determination unit that determines whether the cutting of the part is defective based on the image captured by the imaging unit,
The laser processing system according to claim 1 or 2 , wherein the laser processing section forms the mark at a position corresponding to the part that is judged to be poorly cut by the judgment section. a nesting unit that generates a layout for cutting the plurality of parts from the workpiece,
4. The laser processing system according to claim 3 , wherein the nesting section generates a new layout for cutting again the part that has been determined to be poorly cut by the determination section. The laser processing system according to any one of claims 1 to 4 , wherein the mark is a one-dimensional mark or a two-dimensional mark. Performing a cutting process that cuts multiple parts from a plate-shaped workpiece using a laser beam,
performing mark processing to form a mark on the workpiece using a laser beam;
reading the mark formed by a laser beam;
displaying information corresponding to the read mark;
Information corresponding to the above mark is
Information regarding the processing performance when cutting the part includes information on kerf width, assist gas pressure, or visible light ;
A laser processing method , wherein information regarding processing conditions when cutting the part includes information on plate thickness, material, size, output of laser light, or moving speed of a laser head .

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